Abstract: A chip bonding method for bonding a chip on a display panel is provided. The chip includes a joint face, a rear face, input bumps and output bumps. The joint face having a first symmetry axis line is opposite to the rear face. The input bumps and the output bumps are respectively located on two sides of the symmetry axis line and disposed on the joint face. The chip bonding method includes: calculating a first centroid collectively formed by contact faces of the input bumps and the output bumps, defining a straight line passing through the first centroid and parallel to the first symmetry axis line, and applying pressure on the rear face of the chip by a forcing face parallel to the joint face, wherein the forcing face has a second symmetry axis line aligned parallel to the straight line.

Abstract: A chip bonding method for bonding a chip on a display panel is provided. The chip includes a joint face, a rear face, input bumps and output bumps. The joint face having a first symmetry axis line is opposite to the rear face. The input bumps and the output bumps are respectively located on two sides of the symmetry axis line and disposed on the joint face. The chip bonding method includes: calculating a first centroid collectively formed by contact faces of the input bumps and the output bumps, defining a straight line passing through the first centroid and parallel to the first symmetry axis line, and applying pressure on the rear face of the chip by a forcing face parallel to the joint face, wherein the forcing face has a second symmetry axis line aligned parallel to the straight line.

Abstract: A display module includes a display panel, a backlight assembly, and a support frame. The support frame includes a bottom part, a sidewall, and a plurality of tenons. The sidewall and the bottom part are connected to form an accommodation space. The display panel and the backlight assembly are disposed in the accommodation space, and the display panel is disposed on the backlight assembly. Each of the tenons has a height and is disposed on a top part of the sidewall. Besides, each of the tenons is extended inward by a distance, so as to cover a portion of periphery of the display panel and wedge the display panel. The bottom part, the sidewall, and the tenons are integrally formed.