Abstract: An anti-twist structure of a voice coil motor includes a base, a lens housing, a first elastic sheet, a second elastic sheet, a magnet, and a yoke member. The lens housing has first margin wall and a second margin wall, and a first protrusion extends from the first margin wall. The height of the second protrusion is lower than the height of the first protrusion. The yoke member has a first wall, a connection wall, a second wall, and a side wall. The first wall is disposed above the first protrusion, and the second wall is disposed above the second protrusion. The lens housing has a deflectable angle relative to a horizontal reference line. When the lens housing deflects to a maximum value of the deflectable angle, the first margin wall abuts against the second wall and/or the first protrusion abuts against the first wall.

Abstract: A tracking system and a device integrating an existing positional tracking system and a docking mechanism include a tracking system hardware module, a docking mechanism, and a positional tracking software module and are adapted to capture a user's finger movement and send in real time and synchronously the user's finger movement to a computer. The docking mechanism is compatible with an existing third-party positional tracking system such that the device can operate in conjunction with existing, commercially-available positional tracking systems, for example, HTC VIVE Tracker, and Oculus Quest, and thus is applicable to an existing game engine.

Abstract: A multi-chip package comprising an interconnection substrate; a first semiconductor IC chip over the interconnection substrate, wherein the first semiconductor IC chip comprises a first silicon substrate, a plurality of first metal vias passing through the first silicon substrate, a plurality of first transistors on a top surface of the first silicon substrate and a first interconnection scheme over the first silicon substrate, wherein the first interconnection scheme comprises a first interconnection metal layer over the first silicon substrate, a second interconnection metal layer over the first interconnection layer and the first silicon substrate and a first insulating dielectric layer over the first silicon substrate and between the first and second interconnection metal layers; a second semiconductor IC chip over and bonded to the first semiconductor IC chip; and a plurality of second metal vias over and coupling to the interconnection substrate, wherein the plurality of second metal vias are in a space

Abstract: A skate-used skate-tightening apparatus includes a plate, a buckle, a belt and two pivots. The plate includes a lug and two forks. The buckle includes a middle section formed between front and rear sections. A first pivot pivotally connects the rear section of the buckle to the lug. The belt includes a front section. A second pivot pivotally connects the front section of the belt to the middle section of the buckle. The buckle is in a tightening position when the second pivot is engaged with the forks.

Abstract: An electronic device includes: a substrate including a through hole; a connecting element disposed in the through hole; a first insulating layer disposed on the substrate and including a first via; a first conductive element disposed on the first insulating layer and electrically connected to the connecting element through the first via; a second conductive element disposed under the substrate and electrically connected to the connecting element; and a semiconductor disposed between the substrate and the first insulating layer.

Abstract: An LED carrier plate, comprising a carrier plate front side and a carrier plate back side, wherein a plurality of through holes penetrate the carrier plate front side and the carrier plate back side, and the plurality of through holes at least comprise two rows of through holes; at least every three through holes enclose one island-shaped carrier plate region on the carrier plate front side; and at least two electrode pins are arranged in the island-shaped carrier plate region, and are configured to be connected to an LED arranged on the carrier plate front side. In addition, further disclosed is an LED display device using the LED carrier plate. The carrier plate and the LED display device can achieve both light transmission and LED display/lighting effects.

Abstract: Methods, apparatus, and computer program products for multimodal artificial intelligence-based communication systems are provided herein. A computer-implemented method includes generating, using a first set of one or more artificial intelligence techniques, identifying information for one or more objects detected in image data associated with at least one user query; generating at least one updated version of the at least one user query by processing, using a second set of one or more artificial intelligence techniques, at least a portion of the at least one user query in conjunction with at least a portion of the identifying information for the one or more objects; generating at least one response to the at least one updated version of the at least one user query; and performing one or more automated actions based at least in part on the at least one response.

Abstract: The disclosure relates to an electronic device, including a flexible substrate, a driving structure layer, a display structure layer and a touch layer. The flexible substrate includes an area and a main area adjacent to the area. The driving structure layer is disposed on the flexible substrate. The driving structure layer includes an insulating structure, and the insulating structure includes a plurality of recesses. The display structure layer is disposed on the driving structure layer. The touch layer is disposed on the driving structure layer. A portion of the touch layer is disposed on the area of the flexible substrate. At least a part of the plurality of recesses is disposed on the area of the flexible substrate.

Abstract: A manufacturing method of an electronic package includes the following steps. A first interfacial dielectric layer is formed to cover sides of multiple first conductive vias and multiple second conductive vias. Multiple chips are directly bonded to the first and second conductive vias. A base dielectric layer is formed to fill a gap between the adjacent chips. A bridge element is directly bonded to the first conductive vias, such that the bridge element partially overlaps the adjacent chips respectively. A second interfacial dielectric layer and multiple third conductive vias are formed on the first interfacial dielectric layer and the bridge element. A redistribution circuit structure is formed on the second interfacial dielectric layer and the third conductive vias. Multiple conductive bumps are formed on the redistribution circuit structure. An electronic package is also provided.

Abstract: A method includes receiving user data having a number of first bits. The method further includes encoding the user data by generating a number of second encoded bits having a first quantity of bits greater than that of the number of first bits. The number of second encoded bits can include one or more bits having a particular binary value and a quantity of the one or more bits is less than a threshold quantity. The method further includes writing the number of second encoded bits as the user data to a memory.

Abstract: A flexible array substrate and a flexible display panel are provided. The flexible array substrate includes a plurality of pixel island areas sequentially arranged, a plurality of flexible areas, and a plurality of isolation structures. Each of the plurality of flexible areas is disposed between adjacent two of the plurality of pixel island areas. Each of the plurality of isolation structures covers a corresponding one of the plurality of flexible areas, edges of each of the plurality of isolation structures extend out of the corresponding one of the plurality of flexible areas, and an upper surface of each of the plurality of isolation structures defines a groove. Each of the plurality of flexible areas includes an elastic packaging part disposed in the groove and including a light reflective material body. The light reflective material body is configured for pixel compensation.

Abstract: A sensing amplifier circuit includes first and second P-type transistors and first and second N-type transistors. The first P-type transistor includes a gate coupled to an input node, a source and a bulk coupled to a first node, and a drain coupled to an output node. The second P-type transistor includes a gate coupled to an inverted reading-triggered signal, a source coupled to a voltage source, and a drain coupled to the first node. The first N-type transistor includes a gate coupled to the input node, a drain coupled to the output node, and a source coupled to ground. The second N-type transistor includes a gate receiving the inverted reading-triggered signal, a drain coupled to the output node, and a source coupled to the ground. The first P-type transistor includes an N-type well region that is electrically connected to the source and bulk of the first P-type transistor.

Abstract: A folding joint for frames and worktables composed of a control portion and a joint portion is provided. The control portion includes a base provided with a moveable slot and a shaft inserted through the moveable slot. Two ends of the shaft are connected with a moveable seat and a hook correspondingly. The hook is for control of a lock cylinder of the joint portion. The lock cylinder is mounted in an outer tube, inserted through an upper rotary arm, and mounted in a lower rotary arm to be locked. The upper and lower rotary arms are pivotally joined. Thus the hook is driven to make the lock cylinder release from the lower rotary arm and unlock when the moveable seat of the control portion is pulled and moved. Thereby the joint portion is moved freely and folded. The folding joint is convenient to operate and easy to control.

Abstract: The present application discloses an artificial intelligence request analysis method and apparatus and a device. The method of the embodiments of the present application includes: determining, by a first device, first information based on a first request of a second device, where a category of the first request includes an AI inference service request or a self-evolution request; determining, by the first device, an auxiliary device that completes the first request, where auxiliary device is a third device and/or a fourth device; and transferring, by the first device, the first information to the auxiliary device; where the third device is configured to provide a candidate AI model and model information of the candidate AI model, the fourth device is configured to split the first request into a target request and send the target request to a corresponding functional entity to assist in completing the first request.

Abstract: The present invention provides a dual board patch array antenna, comprising: a radio board; a first-layer antenna board and a second-layer antenna board; the ground plane of the radio board is in contact with the first radiation ground plane of the first-layer antenna board through a patch-type conductive pad to form an extended ground area of ground connection; the probes of the radio board pass through and contact the patch microwave transmission line of the first-layer antenna board to form an electrical connection; wherein the patch microwave transmission line is assigned to the antenna radiating element of the second-layer antenna board as a vertically polarized antenna and a horizontally polarized antenna; the antenna radiating element contacts the first radiation surface on the first-layer antenna board through the conductor pad on the first layer antenna board, so as to expand the radiation surface area of the dual board patch array antenna.

Abstract: A display panel includes a drive backplane; a first electrode layer, including a plurality of first electrodes distributed in an array, where the first electrode includes a flat middle part and an edge part surrounding the middle part; a light-emitting function layer, at least partially covering the middle part; and a second electrode, covering the light-emitting function layer, and including a separating part and a plurality of flat parts separated by the separating part, where orthographic projections of the flat parts on the drive backplane are located in one-to-one correspondence within orthographic projections of the first electrodes on the drive backplane, the separating part includes a protruding area and a first recessed area connecting the protruding area and the flat part, and the protruding area is provided with a second recessed area recessed toward the drive backplane.

Abstract: A display substrate and a display device. The display substrate includes a base substrate, and a plurality of pixel units and a plurality of scanning lines on the base substrate. Each pixel unit includes a plurality of sub-pixels and a light shielding layer, the plurality of sub-pixels is arranged in sequence in a first direction, each sub-pixel includes a sub-pixel driving circuitry and a light-emitting element coupled to each other, and the sub-pixel driving circuitry is configured to provide a driving signal to the light-emitting element. At least a part of the light shielding layer is arranged between the sub-pixel driving circuitry and the base substrate. Each scanning line includes at least a part extending in the first direction, is coupled to a corresponding sub-pixel driving circuitry, and is arranged at a same layer as the light shielding layer.

Abstract: This disclosure provides methods and compositions for sample processing, particularly for sequencing applications. Included within this disclosure are bead compositions, such as diverse libraries of beads attached to large numbers of oligonucleotides containing barcodes. Often, the beads provides herein are degradable. For example, they may contain disulfide bonds that are susceptible to reducing agents. The methods provided herein include methods of making libraries of barcoded beads as well as methods of combining the beads with a sample, such as by using a microfluidic device.

Abstract: A manufacturing method of a package structure includes: forming a first package component, where the first package component includes a first insulating encapsulation laterally covering semiconductor dies and a redistribution structure formed on the first insulating encapsulation and the semiconductor dies; coupling the first package component to a second package component; forming an underfill layer between the first and second package component, where the underfill layer extends to cover a sidewall of the first package component; forming a metallic layer on opposing surfaces of the semiconductor dies and the first insulating encapsulation by using a jig, where a window of the jig accessibly exposes the opposing surfaces of the semiconductor dies and the first insulating encapsulation, and a peripheral region of the opposing surface of the first insulating encapsulation is shielded by the jig.

Abstract: A noise elimination device for a Class-D audio amplifier includes a residual signal detector and a multiplexer, wherein the multiplexer is electrically connected with a sigma-delta modulator (SDM) and a pulse width modulator (PWM) of the Class-D audio amplifier and the residual signal detector. The residual signal detector is configured to detect whether an input signal of the Class-D audio amplifier is residual. The multiplexer is configured to output zero data into the pulse width modulator when the residual signal detector detects that the input signal of the Class-D audio amplifier is residual.