Patents by Inventor Yuan Ping

Yuan Ping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250134221
    Abstract: An ornament holder includes: a bottom seat, provided with at least one first hole, and an opening, and a part of the opening extended outward with a placement part along a direction perpendicular to the bottom seat; a cover, provided on the opening and configured with a second hole and a fixing element, and the fixing element pressing against the bottom of the placement part, allowing the cover to be fixed to the bottom seat; and a connecting element, passed through the first hole, and capable of connecting the bottom seat with the other bottom seat. Whereby, the fixing element can be hooked under the placement part, allowing the cover to be fixed to the bottom seat instead of requiring additional welding, and the connecting element connects the bottom seat with the other bottom seat, capable of arranging the ornament holders of the present invention in series.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 1, 2025
    Inventor: YUAN-PING CHENG
  • Publication number: 20250132236
    Abstract: A package substrate and a fabricating method thereof are provided, in which a core board body is provided, a first organic conductive layer and a second metal layer are sequentially formed on a first metal layer of the core board body, and portions of the first organic conductive layer and the first metal layer are removed respectively according to a pattern of the second metal layer, such that the second metal layer, or the second metal layer, the first organic conductive layer and the first metal layer are served as a first circuit layer. Therefore, the design of the organic conductive layer can facilitate the control of the side etching amount of the metal circuit during etching, enabling the production of circuit layer with fine line width/fine line pitch.
    Type: Application
    Filed: March 6, 2024
    Publication date: April 24, 2025
    Inventors: Pao-Hung TSENG, Yu-Cheng PAI, Yuan-Ping YEH
  • Patent number: 12181543
    Abstract: For a receiving surface coil for detecting nuclear magnetic resonance signals from a patient, a solution for an easy adaptation of the receiving surface coil to the anatomy of the patient is disclosed. This is achieved by a receiving surface coil for detecting nuclear magnetic resonance signals from a patient, the receiving surface coil comprising: a flexible housing with an opening, a set of RF loop elements housed in the flexible housing, wherein the set of RF loops comprises at least a central loop element running around the opening in the flexible housing and a number of loop elements arranged around the opening.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: December 31, 2024
    Assignee: Koninklijke Philips N.V.
    Inventors: Yuan Ping Li, Deyi Qiu, Biao Xie, Yu Zhao, Bing Wu
  • Publication number: 20240374532
    Abstract: This document provides methods and materials involved in killing HIV infected cells (e.g., CD4 T cells). For example, methods and materials for using one or more Bcl-2 inhibitors (e.g., ABT-199) alone or in combination with one or more agents capable of reactivating HIV (e.g., latency reversing agent) to kill HIV infected cells (e.g., CD4 T cells) are provided.
    Type: Application
    Filed: February 16, 2024
    Publication date: November 14, 2024
    Applicant: Mayo Foundation for Medical Education and Research
    Inventors: Andrew D. Badley, Amy M. Nguyen, Scott H. Kaufmann, IV, Yuan-Ping Pang, Haiming Dai
  • Publication number: 20240332149
    Abstract: An electronic package and a substrate structure thereof are provided, in which a circuit layer and a filling layer are formed on a substrate body in the substrate structure, where the circuit layer has a plurality of conductive traces separated from each other, so that the filling layer is filled between the plurality of conductive traces, and a portion of a surface of the circuit layer and a surface of the filling layer are covered with an insulating protective layer. Therefore, the insulating protective layer is carried by the filling layer, so that the insulating protective layer can be thin, thereby preventing the phenomenon of copper migration from occurring to the substrate structure in subsequent processes.
    Type: Application
    Filed: July 13, 2023
    Publication date: October 3, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yuan-Chang NI, Yu-Cheng PAI, Yuan-Ping YEH, Chan-Yu YEH, Meng-Jou HE
  • Publication number: 20240316150
    Abstract: A method for prevention or treatment of diseases caused by a pathogen-associated molecular pattern (PAMP) from intestinal microorganisms, including administering a subject in need thereof a cationic polymer. The enteric coated formulation of the cationic polymer is applied to sequestrate the PAMP produced by intestinal microorganisms, to alleviate the related diseases. The diseases subjected to the treatment is inflammatory disorder, metabolic syndrome, type-2 diabetes, alcohol related diseases, non-alcoholic steatohepatitis, obesity, tissue damage, fatty liver, cirrhosis, inflammatory bowel diseases, multiple tumors and cancers, organ failure, or sepsis.
    Type: Application
    Filed: June 3, 2024
    Publication date: September 26, 2024
    Inventors: Yuan-Ping HAN, Yucheng Qi
  • Publication number: 20240282689
    Abstract: An electronic package, a packaging substrate and a fabricating method are provided, in which a conductive bump pad is formed on an electrical contact pad of the packaging substrate, so that when an electronic element is bonded to the packaging substrate via a solder material in a flip-chip process, the conductive bump pad can guide the flow of the solder material. Therefore, the problem of empty soldering caused by the solder material not effectively contacting with the electrical contact pad can be avoided.
    Type: Application
    Filed: May 30, 2023
    Publication date: August 22, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chan-Yu YEH, Yu-Cheng PAI, Yuan-Ping YEH, Yuan-Chang NI, Meng-Jou HE
  • Patent number: 12036327
    Abstract: Described herein is a composition for delivery of an active agent. The composition includes a peptide coacervate, wherein the peptide coacervate includes one or more peptides derived from histidine-rich proteins, and an active agent encapsulated in the peptide coacervate. Further provided are a method for encapsulation of an active agent in a peptide coacervate, a method for delivery of an active agent, and a method for treating or diagnosing a condition or disease in a subject in need thereof.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: July 16, 2024
    Assignee: NANYANG TECHNOLOGICAL UNIVERSITY
    Inventors: Ali Gilles Tchenguise Miserez, Yuan Ping, Zhi Wei Lim, Bartosz Piotr Gabryelczyk
  • Publication number: 20240164003
    Abstract: An electrostatic discharge device including at least two conductive materials isolated from each other and at least one electrostatic eliminator. The conductive materials are located outside two opposite side walls of an insulated fluid-carrying member and separated from the side walls thereof. When electrostatic charges are accumulated on the insulated fluid-carrying member, the electrostatic charges form an electrostatic voltage on the conductive materials. The electrostatic eliminator is electrically connected to the conductive materials and directly disconnected from a grounding terminal. The electrostatic eliminator releases and eliminates the electrostatic charges by the conductive materials to reduce the electrostatic voltage. In addition, the insulated fluid-carrying member can also be replaced by an insulation container. When the insulation container is used, induction electrodes can replace the conductive materials in the insulation container.
    Type: Application
    Filed: November 16, 2023
    Publication date: May 16, 2024
    Inventors: TAO-CHIN WEI, YUAN-PING LIU, YI-CHENG LIU
  • Patent number: 11938098
    Abstract: This document provides methods and materials involved in killing HIV infected cells (e.g., CD4 T cells). For example, methods and materials for using one or more Bcl-2 inhibitors (e.g., ABT-199) alone or in combination with one or more agents capable of reactivating HIV (e.g., latency reversing agent) to kill HIV infected cells (e.g., CD4 T cells) are provided.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: March 26, 2024
    Assignee: Mayo Foundation for Medical Education and Research
    Inventors: Andrew D. Badley, Amy M. Nguyen, Scott H. Kaufmann, Yuan-Ping Pang, Haiming Dai
  • Publication number: 20230141671
    Abstract: For a receiving surface coil (1) for detecting nuclear magnetic resonance signals from a patient a solution for an easy adaption of the receiving surface coil (1) to the anatomy of the patient shall be created. This is achieved by a receiving surface coil (1) for detecting nuclear magnetic resonance signals from a patient, the receiving surface coil (1) comprising: a flexible housing (13) with an opening (2), a set of RF loop elements (8, 9) housed in the flexible housing (13), wherein the set of RF loop elements (8, 9) comprises at least a central loop (9) element running around the opening (2) in the flexible housing (13) and a plurality of loop elements (8) arranged around the opening (2).
    Type: Application
    Filed: April 12, 2021
    Publication date: May 11, 2023
    Inventors: Yuan Ping Li, Deyi Qiu, Biao Xie, Yu Zhao, Bing Wu
  • Patent number: 11347640
    Abstract: A data storage device includes a memory device and a memory controller. The memory controller is arranged to configure a plurality of first memory blocks to receive data from a host device. The first memory blocks form at least a first superblock. When an amount of data stored in the first memory blocks reaches a specific value, the memory controller moves the data from the first memory blocks to a plurality of second memory blocks in a predetermined procedure. The second memory blocks form at least a second superblock. The second superblock includes the second memory blocks located in different memory chips. The data stored in two adjacent logical pages in the first superblock is written in two second memory blocks located in different memory chips.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: May 31, 2022
    Assignee: Silicon Motion, Inc.
    Inventors: Yuan-Ping Liu, Yi-Hua Li, Tzu-Yi Yang
  • Publication number: 20220126550
    Abstract: The present disclosure provides a laminate film for protecting oxygen-sensitive materials. The laminate film includes an ethylene vinyl alcohol polymer layer and an oxygen scavenging layer. The oxygen scavenging layer includes a first polyamide, a second polyamide, and a metal salt catalyst. The first polyamide includes a crystallizable polyamide homopolymer, a crystallizable polyamide copolymer, or a blend thereof. The second polyamide includes an m-xylylene diamine moiety, an isophthalic acid moiety, and a polyamide monomeric diacid precursor moiety.
    Type: Application
    Filed: January 6, 2022
    Publication date: April 28, 2022
    Inventors: Simon J. Porter, Yuan-Ping Robert Ting
  • Patent number: D979534
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: February 28, 2023
    Inventors: Toshiyuki Tanaka, Tzu-Wei Tai, Yuan-Ping Chu, Chao-Long Chou
  • Patent number: D980230
    Type: Grant
    Filed: February 10, 2021
    Date of Patent: March 7, 2023
    Assignee: Dell Products L.P.
    Inventors: Tzuwei Tai, Toshiyuki Tanaka, Chao-Long Chou, Yuan-Ping Chu, Michael Ellis Smith
  • Patent number: D1008251
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: December 19, 2023
    Assignee: Dell Products L.P.
    Inventors: Yuan-Ping Chu, Cecilia Hsiao Sun, Paul J. Doczy
  • Patent number: D1008278
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: December 19, 2023
    Assignee: Dell Products L.P.
    Inventors: Tzu-Wei Tai, Chao-Long Chou, Yuan-Ping Chu, Toh Kim Cheong, Michael Ellis Smith
  • Patent number: D1026896
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: May 14, 2024
    Assignee: Dell Products L.P.
    Inventors: Yuan-Ping Chu, Cecilia Hsiao Sun, Paul J. Doczy
  • Patent number: D1044795
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: October 1, 2024
    Assignee: Dell Products L.P.
    Inventors: Yuan-Ping Chu, Cecilia Hsiao Sun, Paul J. Doczy
  • Patent number: D1062727
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: February 18, 2025
    Assignee: Dell Products L.P.
    Inventors: Tzu-Wei Tai, Toshiyuki Tanaka, Chao Long Chou, Yuan-Ping Chu, Derric Christopher Hobbs, Michael Ellis Smith