Abstract: The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies; and a benchmark circuit disposed adjacent to the scribe line and electrically coupled to a first conductive contact and a second conductive contact. The benchmark circuit includes a first device-under-test (DUT); a second DUT; a first switching circuit configured to selectively couple the first DUT and the second DUT to the first conductive contact; and a second switching circuit configured to selectively couple the first DUT and the second DUT to the second conductive contact.

Abstract: A communication system and method are provided. In the communication system, a first electrical device has an end point which is configured to connect to a plurality of 3G dongles, wherein the 3G dongles have different IP addresses; a cloud server integrates the IP addresses to generate an integrated IP address when the cloud server detects that the first electrical device is connected to the 3G dongles; and a second electrical device transmits data packets with the first electrical device via the integrated IP address through the cloud server.

Abstract: A communication system and method are provided. In the communication system, a first electrical device has an end point which is configured to connect to a plurality of 3G dongles, wherein the 3G dongles have different IP addresses; a cloud server integrates the IP addresses to generate an integrated IP address when the cloud server detects that the first electrical device is connected to the 3G dongles; and a second electrical device transmits data packets with the first electrical device via the integrated IP address through the cloud server.

Abstract: A method for printing on a curved surface includes determining if a surface of a workpiece is curved, cutting an image to be printed into at least two printing areas if the surface is curved, and printing the printing area of the image on each surface of the workpiece. If the surfaces of the workpiece are not curved, the printing system directly prints the image on the workpiece. The printing system includes a rotating mechanism and a printer including an inkjet head having a plurality of nozzles. The workpiece is positioned on the rotating mechanism. The rotating mechanism rotates each surface of the workpiece to face the inkjet head and the inkjet head prints each printing area on it.

Abstract: A three-dimensional continuous printing method on a workpiece positioned on a rotation mechanism is described. The rotation mechanism rotates the print area of the surface of the workpiece to face the inkjet head of the printer. The inkjet head of the printer prints on the print area of the surface of the workpiece. A selection of additional print areas is offered. If the selection is requested, the rotation mechanism rotates the workpiece such that the desired print area faces the inkjet head of the printer, and selection of the other print area of the workpiece for print is confirmed. If not, the printing process is completed.

Abstract: A method for printing on a curved surface includes determining if a surface of a workpiece is curved, cutting an image to be printed into at least two printing areas if the surface is curved, and printing the printing area of the image on each surface of the workpiece. If the surfaces of the workpiece are not curved, the printing system directly prints the image on the workpiece. The printing system includes a rotating mechanism and a printer including an inkjet head having a plurality of nozzles. The workpiece is positioned on the rotating mechanism. The rotating mechanism rotates each surface of the workpiece to face the inkjet head and the inkjet head prints each printing area on it.