Abstract: Methods and systems for improving fusion bonding are disclosed. Plasma treatment is performed on a substrate prior to the fusion bonding, which leaves residual charge on the substrate to be fusion bonded. The residual charge is usually dissipated through an electrically conductive silicone cushion on a loading pin. In the methods, the amount of residual voltage on a test silicon wafer is measured. If the residual voltage is too high, this indicates the usable lifetime of the silicone cushion has passed, and the electrically conductive silicone cushion is replaced. This ensures the continued dissipation of residual charge during use in production, improving the quality of fusion bonds between substrates.

Abstract: An assembly structure of a chair includes: a chair frame having a front bar, a rear bar, a first side bar and a second side bar; and a chair seat detachably assembled with the chair frame and having a seat portion, a front engaging portion disposed at a front end of the seat portion to engage with the front bar, a rear engaging portion disposed at a rear end of the seat portion to engage with the rear bar, a first abutting portion disposed at one side of the seat portion to engage with and abut against the first side bar, and a second abutting portion disposed at another side of the seat portion to engage with and abut against the second side bar.