Patents by Inventor Yuan Tzuo LUO

Yuan Tzuo LUO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and method for manufacturing the same
    Patent number: 11244909
    Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The first electronic device and the second electronic device are disposed side by side. A gap between the first electronic device and the second electronic device is greater than or equal to about 150 ?m.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 8, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Fan-Yu Min, Chen-Hung Lee, Wei-Hang Tai, Yuan-Tzuo Luo, Wen-Yuan Chuang, Chun-Cheng Kuo, Chin-Li Kao
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210287999
    Abstract: A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device and a second electronic device. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The first electronic device and the second electronic device are disposed side by side. A gap between the first electronic device and the second electronic device is greater than or equal to about 150 ?m.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 16, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Fan-Yu MIN, Chen-Hung LEE, Wei-Hang TAI, Yuan-Tzuo LUO, Wen-Yuan CHUANG, Chun-Cheng KUO, Chin-Li KAO
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200381338
    Abstract: A semiconductor device package includes a carrier, an electronic component, a package body and a ring structure. The electronic component is disposed on the carrier. The electronic component has a side surface. The package body is disposed on the carrier. The package body exposes at least a portion of the side surface of the electronic component. The ring structure is disposed on the package body and surrounds the portion of the side surface of the electronic component exposed from the package body.
    Type: Application
    Filed: June 3, 2019
    Publication date: December 3, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Tang-Yuan CHEN, Yuan Tzuo LUO, Shao-Cheng YEN, Meng-Kai SHIH, Chih-Pin HUNG