Abstract: A sample analysis system and method, a sample image analysis system, and a hematology analyzer, the sample analysis system including at least one hematology analyzer, a controller, a first transport device, a sample slide preparation device and a sample image capturing device, wherein one of the hematology analyzers is configured to analyze a first test blood sample of a subject so as to obtain a sample analysis result; the controller is configured to control the first transport device to transport the first blood sample to the sample slide preparation device when the sample analysis result meets a preset condition; the sample slide preparation device is configured to prepare a sample slide of the first blood sample; the sample image capturing device is configured to image a sample region in the sample slide so as to obtain a sample image; and the controller is further configured to generate a retest instruction when the sample image includes information indicating that the first blood sample is an abnormal s

Abstract: Embodiments of the present invention relate to a sample image photographing method and a corresponding sample image photographing apparatus.

Abstract: A device for analyzing cell morphology and a method for identifying cells are provided. A digital camera photographs a cell image of a blood sample under a low-magnification objective lens. A processor identifies and positions suspected cells of preset type in the cell image to obtain an identification result. Based on the identification result and a target number, the processor determines a number of suspected cells of preset type to be identified and positioned under the low-magnification objective lens. The digital camera further photographs, under a high-magnification objective lens, the suspected cells of preset type identified and positioned, and then the processor identifies whether the suspected cells of preset type photographed are cells of preset type, to count the number of cells of preset type photographed under the high-magnification objective lens and obtain a statistical value. If the statistical value?the target number, photographing is stopped.

Abstract: Provided are cell image analysis devices and sample analysis methods. A sample smear of a test sample is imaged by an imaging device in an assigned analysis mode to obtain first cell images of the test sample, which are identified and analyzed by a control device. If it is identified that there is preset abnormality in the sample smear, an analysis mode different from the assigned analysis mode and corresponding to the present abnormality is determined as an additional analysis mode, and the imaging device is controlled to image the sample smear in the additional analysis mode. The additional analysis mode matches with the preset abnormality, so that the imaging device is allowed to obtain cell images in the additional analysis mode, to identify and analyze the cell images matching the preset abnormality, thereby increasing processing efficiency and accuracy of processing result.

Abstract: A target cell statistical method, apparatus and system are provided. A cell image of a blood specimen is acquired by a cell image analysis apparatus. The blood specimen is derived from a blood sample to be tested. A number of target cells and a number of reference cells in the cell image are automatically identified by the cell image analysis apparatus. A number of reference cells in the blood sample to be tested is acquired by the cell image analysis apparatus, and a number of target cells in the blood sample to be tested is calculated by the cell image analysis apparatus, based on the number of target cells and the number of reference cells in the cell image and the number of reference cells in the blood sample to be tested.

Abstract: Embodiments of wafer bonding method and structures thereof are disclosed. The wafer bonding method can include performing a plasma activation treatment on a front surface of a first and a front surface of a second wafer; performing a silica sol treatment on the front surfaces of the first and the second wafers; performing a preliminary bonding process of the first and second wafer; and performing a heat treatment of the first and the second wafers to bond the front surface of the first wafer to the front surface of the second wafers.

Abstract: Embodiments of apparatus for flipping a semiconductor device and method of using the same are disclosed. In an example, an apparatus for flipping a semiconductor device includes at least one fixture and a rotation unit connected to the at least one fixture. The at least one fixture is configured to hold the semiconductor device by simultaneously pressing a first surface and a second surface of the semiconductor device. The first surface is opposite to the second surface. The rotation unit is configured to rotate the at least one fixture to flip the semiconductor device held by the at least one fixture.

Abstract: Embodiments of wafer bonding methods are disclosed. In an example, a first plasma activation treatment based on oxygen or an inert gas is performed on a front surface of a first wafer and a front surface of a second wafer. After the first plasma activation treatment, a second plasma activation treatment based on water molecules is performed on the front surface of the first wafer and the front surface of the second wafer. After the second plasma activation treatment, the first wafer and the second wafer are bonded such that the treated front surface of the first wafer is in physical contact with the treated front surface of the second wafer.

Abstract: Embodiments of wafer bonding method and structures thereof are disclosed. The wafer bonding method can include performing a plasma activation treatment on a front surface of a first and a front surface of a second wafer; performing a silica sol treatment on the front surfaces of the first and the second wafers; performing a preliminary bonding process of the first and second wafer; and performing a heat treatment of the first and the second wafers to bond the front surface of the first wafer to the front surface of the second wafers.

Abstract: Embodiments of wafer bonding methods are disclosed. In an example, a first plasma activation treatment based on oxygen or an inert gas is performed on a front surface of a first wafer and a front surface of a second wafer. After the first plasma activation treatment, a second plasma activation treatment based on water molecules is performed on the front surface of the first wafer and the front surface of the second wafer. After the second plasma activation treatment, the first wafer and the second wafer are bonded such that the treated front surface of the first wafer is in physical contact with the treated front surface of the second wafer.

Abstract: Embodiments of wafer bonding method and structures thereof are disclosed. The wafer bonding method can include performing a plasma activation treatment on a front surface of a first and a front surface of a second wafer; performing a silica sol treatment on the front surfaces of the first and the second wafers; performing a preliminary bonding process of the first and second wafer; and performing a heat treatment of the first and the second wafers to bond the front surface of the first wafer to the front surface of the second wafers.

Abstract: Embodiments of apparatus for flipping a semiconductor device and method of using the same are disclosed. In an example, an apparatus for flipping a semiconductor device includes at least one fixture and a rotation unit connected to the at least one fixture. The at least one fixture is configured to hold the semiconductor device by simultaneously pressing a first surface and a second surface of the semiconductor device. The first surface is opposite to the second surface. The rotation unit is configured to rotate the at least one fixture to flip the semiconductor device held by the at least one fixture.

Abstract: An electronic device includes a body, a driven component, a first magnetic component and a second magnetic component. The driven component is slidably disposed in the body. The first magnetic component is disposed at the driven component. The second magnetic component is located at one side of the driven component, and the first magnetic component and the second magnetic component are disposed corresponding to each other. The second magnetic component is configured to generate a magnetic attraction force or a magnetic repulsion force to the first magnetic component, so as to position the driven component based on the magnetic attraction force or the magnetic repulsion force between the first magnetic component and the second magnetic component.

Abstract: An electronic device includes a body, a driven component, a first magnetic component and a second magnetic component. The driven component is slidably disposed in the body. The first magnetic component is disposed at the driven component. The second magnetic component is located at one side of the driven component, and the first magnetic component and the second magnetic component are disposed corresponding to each other. The second magnetic component is configured to generate a magnetic attraction force or a magnetic repulsion force to the first magnetic component, so as to position the driven component based on the magnetic attraction force or the magnetic repulsion force between the first magnetic component and the second magnetic component.

Abstract: Embodiments of wafer bonding method and structures thereof are disclosed. The wafer bonding method can include performing a plasma activation treatment on a front surface of a first and a front surface of a second wafer; performing a silica sol treatment on the front surfaces of the first and the second wafers; performing a preliminary bonding process of the first and second wafer; and performing a heat treatment of the first and the second wafers to bond the front surface of the first wafer to the front surface of the second wafers.

Abstract: Provided is an LED clock having multiple LEDs to illuminate the clock indirectly. The multiple LEDs do not aim towards the viewers directly. The present invention provides comfort for the viewers' eyes when the viewers look at the LED clock. In addition, the LED clock also can be used as a floor lamp. This new function as a floor lamp enhances the supplementary value of the LED clock effectively.

Abstract: Various embodiments of the present invention provide systems and methods for determining changes in fly-height. For example, various embodiments of the present invention provide storage devices that include a storage medium having servo data thereon. A read/write head assembly is disposed in relation to the storage medium. A servo based fly-height adjustment circuit receives the servo data via the read/write head assembly, and calculates a first harmonics ratio based on the received data and compares the first harmonics ratio with a second harmonics ratio to determine an error in the distance between the read/write head assembly and the storage medium.

Abstract: Various embodiments of the present invention provide systems and methods for estimating signal and noise powers in a received signal set. For example, one embodiment of the present invention provides a method for determining signal power and noise power. The method uses a storage medium that includes a Na×Nw data pattern. The Na×Nw data pattern includes Na bits repeated Nw times. Both Na and Nw are each greater than one. The methods further include performing an initial read of the Na×Nw data pattern, which is stored to a first register.

Abstract: Various embodiments of the present invention provide systems and methods for estimating noise components in a received signal set. For example, one embodiment of the present invention provides a noise estimation circuit that includes a data detector circuit and a noise component calculation circuit. The data detector circuit receives a series of data samples and provides a detected output, and the noise component calculation circuit provides an electronics noise power output and a media noise power output each calculated based at least in part on the detected output and the series of data samples.

Abstract: Various embodiments of the present invention provide systems and methods for data processing. As an example, a data processing circuit is discussed that includes: a data buffer, an inter-track interference response circuit, and an inter-track interference signal estimator circuit. The data buffer is operable to store a previous track data set. The inter-track interference response circuit is operable to estimate an inter-track interference response from the previous track data set based at least in part on the previous track data set and a current track data set. The inter-track interference signal estimator circuit is operable to calculate an inter-track interference from the previous track data set based at least in part on the previous track data set and the inter-track interference response from the previous track data set.