Abstract: A thick document conveying device includes a paper pickup mechanism. The paper pickup mechanism has a pick roller base, a pick roller axle, a pick roller, a switching assembly, a first universal coupling, a driving mechanism, a second universal coupling, a bearing and a gear. The pick roller axle and the pick roller are located in the pick roller base. The switching assembly is located under the pick roller base. The first universal coupling is connected to the pick roller axle. The driving mechanism is sleeved on the first universal coupling. The second universal coupling is connected to the driving mechanism. The bearing is connected to the driving mechanism. The gear is connected to the bearing. As described above, both a thick document and a thin document can be adapted.

Abstract: A bonding tool includes a gas supply line that may extend directly between valves associated with one or more gas supply tanks and a processing chamber such that gas supply line is uninterrupted without any intervening valves or other types of structures that might otherwise cause a pressure buildup in the gas supply line between the processing chamber and the valves associated with the one or more gas supply tanks. The pressure in the gas supply line may be maintained at or near the pressure in the processing chamber so that gas provided to the processing chamber through the gas supply line does not cause a pressure imbalance in the processing chamber, which might otherwise cause early or premature contact between semiconductor substrates that are to be bonded in the processing chamber.

Abstract: A heat sink structure includes a base seat and at least one heat dissipation unit. The base seat has a first face and a second face. At least one extension column extends from the second face of the base seat. The heat dissipation unit is disposed above the base seat and spaced from the base seat by a gap. The extension column serves to restrict or secure the heat dissipation unit in horizontal and vertical directions. The heat dissipation unit with different structures provides multiple heat dissipation features to enhance the entire heat dissipation performance.

Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

Abstract: A manufacturing method of thermal module includes steps of: providing at least one aluminum heat conduction component and at least one copper heat conduction component; disposing a copper embedding layer, by means of physical or chemical processing, a copper embedding layer being disposed on a processed section or processed face of the aluminum heat conduction component, which processed section or processed face is correspondingly assembled with the copper heat conduction component; and welding and connecting, the surface of the aluminum heat conduction component, on which the copper embedding layer is disposed, being securely welded and connected with the copper heat conduction component so as to securely connect the aluminum heat conduction component with the copper heat conduction component. By means of the copper embedding layer, the aluminum heat conduction component can be welded and connected with other heat conduction components made of heterogeneous materials and the same material.

Abstract: A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.

Abstract: A thermal module structure includes an aluminum base having a heat pipe receiving groove formed on one side thereof; a heat dissipation unit including a plurality of radiation fin assemblies or heat sinks and being provided with a first heat pipe receiving section; a plurality of heat pipes made of a copper material and respectively having a heat absorption section and a horizontally extended condensation section; and a copper embedding layer provided on surfaces of the heat pipe receiving groove and the first heat pipe receiving section. The aluminum base and the heat dissipation unit are horizontally parallelly arranged. The heat absorption sections are fitted in the heat pipe receiving groove, and the condensation sections are extended through the first heat pipe receiving section. With the copper embedding layer, the aluminum base and the heat dissipation unit can be directly welded to the heat pipes.

Abstract: A heat sink structure with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one through hole and al least one groove, in which a copper embedding layer is provided for contacting with and connected to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.

Abstract: A thermal module assembling structure includes an aluminum base seat which has a heat absorption side, a heat conduction side and a connection section. The connection section is selectively disposed on the heat absorption side, the heat conduction side or embedded in the aluminum base seat (between the heat absorption side and the heat conduction side). The connection section is correspondingly connected with at least one copper heat pipe. A copper embedding layer is disposed on a portion of the connection section, which portion is in contact and connection with the copper heat pipe. A welding material layer is disposed between the copper embedding layer and the copper heat pipe, whereby the aluminum base seat and the copper heat pipe can be more securely connected with each other. The conventional chemical nickel plating is replaced with the copper embedding layer so as to improve the problem of environmental pollution, etc.

Abstract: A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.

Abstract: A heat sink assembly with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one area to be connected to other members of the heat sink assembly, such as a groove. A copper embedding layer is provided on a groove inner surface of the groove for connecting the aluminum fin assembly to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.

Abstract: A foldable baffle structure is mounted to a tray of a scanner or a printer. The foldable baffle structure includes two limiting components mounted to the tray. Each limiting component includes a sliding element, a stopping element, a guiding element and a pivoting element. Middles of the two sliding elements of the two limiting components have two accommodating spaces penetrating through top surfaces and bottom surfaces of the two sliding elements. The two stopping elements of the two limiting components are mounted in the accommodating spaces of the two limiting components. A middle of one end surface of the stopping element protrudes outward to form a pivoting portion. The guiding element is mounted around an outside of the pivoting portion. The pivoting element is pivotally disposed in the stopping element.

Abstract: A thick document conveying device includes a paper pickup mechanism. The paper pickup mechanism has a pick roller base, a pick roller axle, a pick roller, a switching assembly, a first universal coupling, a driving mechanism, a second universal coupling, a bearing and a gear. The pick roller axle and the pick roller are located in the pick roller base. The switching assembly is located under the pick roller base. The first universal coupling is connected to the pick roller axle. The driving mechanism is sleeved on the first universal coupling. The second universal coupling is connected to the driving mechanism. The bearing is connected to the driving mechanism. The gear is connected to the bearing. As described above, both a thick document and a thin document can be adapted.

Abstract: A paper blocking device includes a pick roller, a cover plate, a paper blocking component, a driving mechanism, a gear mechanism and a motor. The cover plate has a pick roller window penetrated the cover plate. The pick roller is positioned in the pick roller window. The paper blocking component is coupled to the cover plate. The driving mechanism has a driving shaft and a cam being connected to the driving shaft. The cam is connected to the paper blocking component. The gear mechanism is connected to the driving shaft. The motor is connected to the gear mechanism. As described above, the paper blocking device can block papers and align the leading edges of papers.

Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

Abstract: A heat sink structure includes a base seat and at least one heat dissipation unit. The base seat has a first face and a second face. At least one extension column extends from the second face of the base seat. The heat dissipation unit is disposed above the base seat and spaced from the base seat by a gap. The extension column serves to restrict or secure the heat dissipation unit in horizontal and vertical directions. The heat dissipation unit with different structures provides multiple heat dissipation features to enhance the entire heat dissipation performance.

Abstract: A thermal module includes a base seat, at least two heat pipes and multiple heat dissipation units. Each heat pipe has a heat absorption end and a heat dissipation end outward extending from the heat absorption end. The heat absorption ends are disposed on the base seat. The heat dissipation ends of the at least two heat pipes are positioned above the base seat at different heights and misaligned from each other. The multiple heat dissipation units are connected with the heat dissipation ends of the heat pipes and arranged at intervals. By means of arranging the multiple heat dissipation unit at intervals as multiple layers, the heat dissipation areas is enlarged to prevent the airflow from being interrupted so as to effectively greatly enhance the heat dissipation efficiency.

Abstract: A foldable baffle structure is mounted to a tray of a scanner or a printer. The foldable baffle structure includes two limiting components mounted to the tray. Each limiting component includes a sliding element, a stopping element, a guiding element and a pivoting element. Middles of the two sliding elements of the two limiting components have two accommodating spaces penetrating through top surfaces and bottom surfaces of the two sliding elements. The two stopping elements of the two limiting components are mounted in the accommodating spaces of the two limiting components. A middle of one end surface of the stopping element protrudes outward to form a pivoting portion. The guiding element is mounted around an outside of the pivoting portion. The pivoting element is pivotally disposed in the stopping element.

Abstract: A heat transfer member reinforcement structure includes a main body. The main body has a first side, a second side and a reinforcement member. The reinforcement member is selectively disposed between the first and second sides or inlaid in a sink formed on the first side. The reinforcement member is connected with the main body to enhance the structural strength of the main body.

Abstract: A heat transfer component reinforcement structure includes a main body. The main body has a pair of first lateral sides and a pair of second lateral sides and a reinforcement member. The reinforcement member is correspondingly externally connected with the main body in at least one manner selected from the group consisting of that the reinforcement members are engaged, latched and connected with the first lateral sides and the second lateral sides of the main body and the reinforcement members are engaged, latched and connected with the junctions between the first and second lateral sides in four corners. The reinforcement member is connected with the main body to enhance the structural strength of the main body.