Abstract: A preparation method for a circuit board connection structure includes: providing a circuit board module that including a first outer wiring layer, and the first outer wiring layer including solder pads; forming a first pyrolytic adhesive layer and an inner wiring layer on the first outer wiring layer; forming a second pyrolytic adhesive layer and a second copper foil layer on the inner wiring layer; defining a plurality of through holes each configured to expose one of the solder pads; forming a copper plating layer on the second copper foil layer; etching the copper plating layer and the second copper foil layer to form a second outer wiring layer, thereby obtaining an intermediate body; heating and washing the intermediate body to remove the first pyrolytic adhesive layer and the second pyrolytic adhesive layer. The present application also provides a circuit board connection structure.

Abstract: A multi-mixer system includes an amplifier module and a plurality of channels. The amplifier module is arranged for receiving signals from an antenna or antenna arrays to generate a plurality of radio frequency (RF) input signals. The plurality of channels are coupled to the amplifier module, wherein the plurality of channels receive the RF input signals, respectively, and each of the channels includes a mixer for mixing one of the RF input signals with a local oscillating signal to generate a mixed signal. In addition, at least one of the channels includes an interference reduction circuit positioned between the amplifier module and the mixer.

Abstract: An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.

Abstract: An integrated circuit apparatus includes a substrate, an IC chip disposed above the substrate, and an electromagnetic shielding layer disposed on a surface of the substrate. The IC chip includes an electromagnetic coupling device. The electromagnetic shielding layer and the electromagnetic coupling device partially overlap in a vertical projection direction of the surface of the substrate.

Abstract: A multi-mixer system includes an amplifier module and a plurality of channels. The amplifier module is arranged for receiving signals from an antenna or antenna arrays to generate a plurality of radio frequency (RF) input signals. The plurality of channels are coupled to the amplifier module, wherein the plurality of channels receive the RF input signals, respectively, and each of the channels includes a mixer for mixing one of the RF input signals with a local oscillating signal to generate a mixed signal. In addition, at least one of the channels includes an interference reduction circuit positioned between the amplifier module and the mixer.

Abstract: A multi-mixer system includes an amplifier module and a plurality of channels. The amplifier module is arranged for receiving signals from an antenna or antenna arrays to generate a plurality of radio frequency (RF) input signals. The plurality of channels are coupled to the amplifier module, wherein the plurality of channels receive the RF input signals, respectively, and each of the channels includes a mixer for mixing one of the RF input signals with a local oscillating signal to generate a mixed signal. In addition, at least one of the channels includes an interference reduction circuit positioned between the amplifier module and the mixer.

Abstract: A multi-mixer system includes an amplifier module and a plurality of channels. The amplifier module is arranged for receiving signals from an antenna or antenna arrays to generate a plurality of radio frequency (RF) input signals. The plurality of channels are coupled to the amplifier module, wherein the plurality of channels receive the RF input signals, respectively, and each of the channels includes a mixer for mixing one of the RF input signals with a local oscillating signal to generate a mixed signal. In addition, at least one of the channels includes an interference reduction circuit positioned between the amplifier module and the mixer.

Abstract: A second-order intermodulation distortion calibration apparatus is provided. The calibration apparatus is applied to a radio-frequency (RF) transceiver, which includes a transmitter for providing an RF signal, and a receiver that is at the same time a target to be calibrated. The calibration apparatus includes a calibrator. The calibrator utilizes a logic circuit in the transmitter to generate two modulation signals having different frequencies, and utilizes two transmission paths to up-convert and combine the two modulation signals to an RF transmission signal. The calibrator further channels the RF transmission signal to the receiver to accordingly adjust second-order non-linear behaviors of the receiver and to detect a signal strength of a second-order crossover component caused by the receiver due to the second-order non-linearity. After the calibration process, the calibrator provides a control signal to minimize the signal strength of the second-order crossover component.

Abstract: A direct-conversion transmitter including an oscillator, a frequency divider, a transmitter, and a filter is provided. The oscillator generates an oscillating signal with an original frequency. The frequency divider performs frequency dividing on the oscillating signal, so as to generate a carrier signal. The transmitter receives the carrier signal from the frequency divider and generates an output signal based on the carrier signal and a data signal. The filter is coupled between the frequency divider and the transmitter. The filter filters out an interference signal fed-back from the transmitter to the oscillator, wherein the interference signal may cause the oscillating signal to float.

Abstract: A direct-conversion transmitter including an oscillator, a frequency divider, a transmitter, and a filter is provided. The oscillator generates an oscillating signal with an original frequency. The frequency divider performs frequency dividing on the oscillating signal, so as to generate a carrier signal. The transmitter receives the carrier signal from the frequency divider and generates an output signal based on the carrier signal and a data signal. The filter is coupled between the frequency divider and the transmitter. The filter filters out an interference signal fed-back from the transmitter to the oscillator, wherein the interference signal may cause the oscillating signal to float.

Abstract: A second-order intermodulation distortion calibration apparatus is provided. The calibration apparatus is applied to a radio-frequency (RF) transceiver, which includes a transmitter for providing an RF signal, and a receiver that is at the same time a target to be calibrated. The calibration apparatus includes a calibrator. The calibrator utilizes a logic circuit in the transmitter to generate two modulation signals having different frequencies, and utilizes two transmission paths to up-convert and combine the two modulation signals to an RF transmission signal. The calibrator further channels the RF transmission signal to the receiver to accordingly adjust second-order non-linear behaviors of the receiver and to detect a signal strength of a second-order crossover component caused by the receiver due to the second-order non-linearity. After the calibration process, the calibrator provides a control signal to minimize the signal strength of the second-order crossover component.