Abstract: A multilayer polymer capacitor (MLPC), including a casing, a multilayer core, an electroplated positive terminal, a first electroplated negative terminal, and a second electroplated negative terminal. The casing includes a casing body and a cover plate. The casing body is provided with an accommodating cavity, whose bottom is provided with a through hole. The multilayer core is provided in the accommodating cavity. An anode lead-out part and a cathode lead-out part are provided at two ends of the accommodating cavity, respectively. The electroplated positive terminal and the first electroplated negative terminal are provided on outer side surfaces of two ends of the casing, respectively. The second electroplated negative terminal is provided on an outer bottom surface of the casing, and is electrically connected to the multilayer core.

Abstract: A PCI-E expansion card module is configured to insert in a slot with a rotation switch. The PCI-E expansion card module includes a PCI-E expansion card body and an unlock mechanism. The PCI-E expansion card body includes an inserting portion and a positioning hook. The unlock mechanism is disposed beside the PCI-E expansion card body, and the unlock mechanism includes a pushing member. When the PCI-E expansion card body is inserted into the slot, the rotation switch is on a moving path of the pushing member. The pushing member moves and pushes the rotation switch to release a limitation of the PCI-E expansion card body.

Abstract: A method for packaging a chip, the chip is packaged by disposing positioning post on the surface of the carrier, and the groove matching the positioning post is formed on the surface of the chip. During melting the first solder pastes and the second solder pastes , due to the interaction between the positioning post and the groove, the chip will not be deflected due to the tension of the first solder pastes and the second solder pastes, so that a chip packaging structure meets the expected requirements. The chip packaging structure is further provided in the present disclosure.

Abstract: A preparation method for a circuit board connection structure includes: providing a circuit board module that including a first outer wiring layer, and the first outer wiring layer including solder pads; forming a first pyrolytic adhesive layer and an inner wiring layer on the first outer wiring layer; forming a second pyrolytic adhesive layer and a second copper foil layer on the inner wiring layer; defining a plurality of through holes each configured to expose one of the solder pads; forming a copper plating layer on the second copper foil layer; etching the copper plating layer and the second copper foil layer to form a second outer wiring layer, thereby obtaining an intermediate body; heating and washing the intermediate body to remove the first pyrolytic adhesive layer and the second pyrolytic adhesive layer. The present application also provides a circuit board connection structure.

Abstract: A method for manufacturing a fan-out chip packaging structure with decreased use of a crack-inducing hot-soldering process includes a first carrier plate with first and a second outer wiring layers. Two first conductive posts are formed on the first outer wiring layer, one end of each post is electrically connected to the first outer wiring layer. A receiving groove is formed between first conductive posts, and a sidewall of each post is surrounded by a first insulating layer. An embedded component is laid in the receiving groove and a second carrier plate is formed on the first insulating layer, wherein the second carrier plate carries third and fourth outer wiring layers. A first outer component is connected to the second outer wiring layer, and a second outer component is connected to the fourth outer wiring layer.

Abstract: A PCI-E expansion card module is configured to insert in a slot with a rotation switch. The PCI-E expansion card module includes a PCI-E expansion card body and an unlock mechanism. The PCI-E expansion card body includes an inserting portion and a positioning hook. The unlock mechanism is disposed beside the PCI-E expansion card body, and the unlock mechanism includes a pushing member. When the PCI-E expansion card body is inserted into the slot, the rotation switch is on a moving path of the pushing member. The pushing member moves and pushes the rotation switch to release a limitation of the PCI-E expansion card body.

Abstract: A method for manufacturing a fan-out chip packaging structure with decreased use of a crack-inducing hot-soldering process includes a first carrier plate with first and a second outer wiring layers. Two first conductive posts are formed on the first outer wiring layer, one end of each post is electrically connected to the first outer wiring layer. A receiving groove is formed between first conductive posts, and a sidewall of each post is surrounded by a first insulating layer. An embedded component is laid in the receiving groove and a second carrier plate is formed on the first insulating layer, wherein the second carrier plate carries third and fourth outer wiring layers. A first outer component is connected to the second outer wiring layer, and a second outer component is connected to the fourth outer wiring layer.

Abstract: An expansion card assembly, including an expansion card body and a connector. The expansion card body includes a notch recessed into an edge thereof. The connector includes a housing. The housing includes a top surface, a bottom surface, and an engaging portion disposed on the bottom surface. The bottom surface is close to the expansion card body. The engaging portion is exposed out of the notch. The engaging portion connects the connector with an external power cord. A user operates the engaging portion at the bottom surface of the housing of the connector with fingers. Therefore, the expansion card assembly and the connector solve the problem that the too narrow space between the top surface of the housing and the other components makes it difficult for the user to stretch fingers into the space between the top surface of the housing and the other component.

Abstract: The present invention relates to a method for preparing a titanium oxide film and a method for preparing a composite film comprising a titanium oxide film. Particularly, the present invention relates to a method for preparing the titanium oxide film which serves as a passivation layer for the oxide semiconductor. In the present method for preparing the passivation layer, a low-reactive metal alkoxide compound is used as a precursor to form the passivation layer by the atomic layer deposition. Therefore, the deterioration of the oxide semiconductor during the preparation process may be avoided.

Abstract: A stereo projection optical system includes a polarization converter, a 2-way wheel, a retarder, and an image engine. The polarization converter is configured for converting an incident light into a polarized light which have single polarization. The 2-way wheel includes a reflective region and a transmissive region. The reflective region is configured for reflecting the polarized light and the transmissive region is configured for transmitting the polarized light. The retarder is positioned to receive an emergent light from one of the reflective region and the transmissive region. The image engine is positioned to receive light output of the 2-way wheel and the retarder and configured for emitting the light output comprising spatial information. The stereo projection optical systems provide viewers three-dimensional images formed by two alternative polarized light beams whose polarizations are perpendicular to each other utilizing the 2-way wheel.

Abstract: A stereo projection optical system includes a polarization converter, a 2-way wheel, a retarder, and an image engine. The polarization converter is configured for converting an incident light into a polarized light which have single polarization. The 2-way wheel includes a reflective region and a transmissive region. The reflective region is configured for reflecting the polarized light and the transmissive region is configured for transmitting the polarized light. The retarder is positioned to receive an emergent light from one of the reflective region and the transmissive region. The image engine is positioned to receive light output of the 2-way wheel and the retarder and configured for emitting the light output comprising spatial information. The stereo projection optical systems provide viewers three-dimensional images formed by two alternative polarized light beams whose polarizations are perpendicular to each other utilizing the 2-way wheel.