Abstract: Described is a resin mixture for an organosilicon-containing composition suitable for use as an adhesive and capable of rapid curing at low temperature. The composition comprises about 10 to 80 wt. % of an organic compound component and about 20 to 90 wt. % of one of boron nitride, silica or silver. The organic compound component comprises the reaction product of about 40 to 90 wt. %, of the reaction product of cyclic olefin and cyclic siloxane and about 10 to 60 wt. % rubber in liquid form. The resin mixture includes unsaturated liquid rubber having an attached functional group, and an average molecular weight of about 2,000 to 10,000.