Patents by Inventor YUAN ZI YIN

YUAN ZI YIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packaging with reduced cracking defects
    Patent number: 10636719
    Abstract: A method of forming a package includes providing a die, which includes a substrate having a circuit, a first passivation layer on the substrate, a plurality of pads on the first passivation layer, and a second passivation layer disposed on the first passivation layer and covering the plurality of pads. The method also includes forming one or more trenches by etching the second passivation layer that overlies a portion of the first passivation layer on the outside of the plurality of pads, and forming an organic polymer overlying the die after the one or more trenches are formed, thereby forming the package.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: April 28, 2020
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventor: Yuan Zi Yin
  • METHOD AND APPRATUS FOR SEMICONDUCTOR PACKAGING
    Publication number: 20170309536
    Abstract: A method of forming a package includes providing a die, which includes a substrate having a circuit, a first passivation layer on the substrate, a plurality of pads on the first passivation layer, and a second passivation layer disposed on the first passivation layer and covering the plurality of pads. The method also includes forming one or more trenches by etching the second passivation layer that overlies a portion of the first passivation layer on the outside of the plurality of pads, and forming an organic polymer overlying the die after the one or more trenches are formed, thereby forming the package.
    Type: Application
    Filed: April 10, 2017
    Publication date: October 26, 2017
    Inventor: YUAN ZI YIN