Abstract: A system and method for management of updates across a plurality of enterprise computing devices. The system is configured to receive telemetry about the enterprise computing devices that will be used to develop a rollout strategy for upcoming updates. The system provides IT administrators with a user interface for modifying and customizing the rollout strategy. The proposed system and method can significantly improve the efficiency of regular update deployments to enterprise computing devices, and reduce the network cost associated with such deployments.

Abstract: Threat-modeling of an embedded system includes receiving a design of the embedded system, the design comprising a component; receiving a feature of the component; identifying an asset associated with the feature, where the asset is targetable by an attacker; identifying a threat to the feature based on the asset; obtaining an impact score associated with the threat; and outputting a threat report that includes at least one of a first description of the threat or a second description of a vulnerability, a respective feasibility score, a respective impact score, and a respective risk score.

Abstract: A system and method for management of updates across a plurality of enterprise computing devices. The system is configured to receive telemetry about the enterprise computing devices that will be used to develop a rollout strategy for upcoming updates. The system provides IT administrators with a user interface for modifying and customizing the rollout strategy. The proposed system and method can significantly improve the efficiency of regular update deployments to enterprise computing devices, and reduce the network cost associated with such deployments.

Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.

Abstract: Described are methods, systems, and computer program products for correlating operational information with subsequent action information. Operational information is received from a computing system performing one or more services. Pattern matching is performed for the operational information with data within a knowledge base. Based on the results of the pattern matching, a subsequent action associated with the operational information is determined.

Abstract: A power module for a motor traction inverter system of a vehicle includes a body portion configured to be inserted into a cooling device and having circuitry established thereat that generates heat during operation of the power module. The body portion has a surface area that is disposed in the cooling device and provides 360 degree direct cooling of the power module around the body portion for cooling the circuitry during operation of the power module. The power module may be transfer molded into a shape with a head terminal for sealing at the cooling device, and electrical connections of the power module share only one side surface or end of the power module, with all other sides and surfaces of the power module being disposed in the cooling device and used for cooling. The power module may not include thermal grease layers and may or may not be insulated.

Abstract: Several embodiments of a circuit device using principles of planar Litz wire construction are disclosed using flexible printed circuit boards on which a given set of conductors is located on one surface only. The FPCBs are folded at strategic locations to effectively cause conductors in adjacent parallel planes to effectively cross one another to realize the advantages of braided Litz wire conductors, but without the use of vias or circuit interconnections between opposite sides of any given FPCB or between different sections of a continuous FPCB wherein each section defines its own coil or coil set.

Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.

Abstract: An integrated power module having a dielectric substrate, a source conductor trace formed on the dielectric substrate, a drain conductor trace formed on the dielectric substrate, a gate conductor trace formed on the dielectric substrate, a transistor chip having a top surface and a bottom surface connected to the drain conductor trace, a back-contact resistor having a flat planar structure with a top surface and a bottom surface connected to the gate conductor trace, and a first wire bond connecting the top surface of the transistor chip to the top surface of the back-contact resistor.

Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.

Abstract: Power modules and power module arrays are disclosed. In one embodiment, a power module includes a module support, a high temperature module, and a module cap. The module support includes a frame member, a heat spreader, a first electrically conductive rail, and a second electrically conductive rail. The high temperature module includes a module substrate, a semiconductor device thermally and/or electrically coupled to a semiconductor surface of the module substrate, a first external connector, and a second external connector. The first and second electrically conductive rails are disposed within a through-hole of the first and second external connectors, respectively. The module cap includes a body portion, a plurality of posts, a first opening, and a second opening. The plurality of posts presses against at least the first external connector, the second external connector, and the module substrate such that the high temperature module is thermally coupled to the heat spreader.

Abstract: An integrated power module having a dielectric substrate, a source conductor trace formed on the dielectric substrate, a drain conductor trace formed on the dielectric substrate, a gate conductor trace formed on the dielectric substrate, a transistor chip having a top surface and a bottom surface connected to the drain conductor trace, a back-contact resistor having a flat planar structure with a top surface and a bottom surface connected to the gate conductor trace, and a first wire bond connecting the top surface of the transistor chip to the top surface of the back-contact resistor.

Abstract: Several embodiments of a circuit device using principles of planar Litz wire construction are disclosed using flexible printed circuit boards on which a given set of conductors is located on one surface only. The FPCBs are folded at strategic locations to effectively cause conductors in adjacent parallel planes to effectively cross one another to realize the advantages of braided Litz wire conductors, but without the use of vias or circuit interconnections between opposite sides of any given FPCB or between different sections of a continuous FPCB wherein each section defines its own coil or coil set.

Abstract: The formulation of a user interface that is used to access multiple network services. The user interface includes a common interface portion that is common amongst multiple network services. The user interface also includes a service-specific content portion that is specific at least one, but not all, of the network services. In one or more embodiments, the common interface may include navigation control(s) for navigating the service-specific content portion between network services while the common interface portion remains the same. Thus, the user interface may be used to present multiple network services while retaining a portion that has a common look.