Abstract: Provided is a system, method, and computer program product for in-situ pasteurization of electronics cooling liquid of an electronic liquid cooling loop. A processor may activate a cooling liquid pasteurization system that allows for pasteurization of the electronics cooling liquid. The processor may detect a temperature of the electronics cooling liquid, where heat generated by computer electronics of a computer system is transferred to the electronics cooling liquid. The processor may determine that the temperature of the electronics cooling liquid is within a target range that neutralizes bacteria. The processor may maintain the temperature of the electronics cooling liquid for a target time using the heat generated by the computer electronics of the computer system, where the target time corresponds to a pasteurization time frame for neutralizing bacteria in the electronics cooling liquid. The processor may deactivate the cooling liquid pasteurization system when the target time has been reached.

Abstract: Component positioning feedback within an electronic assembly is provided. The feedback process includes obtaining component position data from a plurality of sensors of the electronic assembly. The component position data facilitates in situ evaluation of positioning of the component within the electronic assembly. Further, the process includes determining, by data analysis of the component position data, a current positioning of the component of the electronic assembly relative to another component of the electronic assembly, and generating a position feedback signal based on the determined current positioning of the component of the electronic assembly relative to the other component of the electronic assembly.

Abstract: A computing system includes a motherboard with an array of card connectors, circuit boards connected to the array of card connectors, wherein the circuit boards include electronic components, constraining walls positioned around the circuit boards to form a housing over the motherboard, and expandable ducts. One of the expandable ducts is positioned in contact with one of the electronic components and constrained by a constraining wall when expanded, and each of the expandable ducts includes an inlet, an outlet, and a fluid flow path from the inlet to the outlet that is parallel to other fluid flow paths of other expandable ducts.

Abstract: Embodiments of the present disclosure provide a mesh cooling structure, methods and battery cooling systems for cooling a battery cell, such as used in computer systems. The disclosed mesh cooling structure, method and battery cooling system provide effective battery cell cooling with the cooling mesh structure installed with a given battery cell to improve capacity and performance of the battery cell. The disclosed cooling mesh structure can be provided with selected battery cells in a battery pack to provide optimal battery capacity for the battery pack.

Abstract: Embodiments of the present disclosure provide systems and methods for configuring battery packs, such as used in computer systems. The disclosed systems and methods provide an optimal battery configuration of battery cell types in the battery pack, improving battery performance and a functional operational period for the battery pack. The disclosed systems and methods select an optimal battery type for each position of the battery cells in a linear battery cell string of the battery pack.

Abstract: An apparatus for providing a safety and EMC compliant heat sink. The apparatus includes a heat sink configured to be attached to an internal power plane of a printed circuit board (PCB). The heat sink includes a plurality of fins extending outward from the heat sink. The apparatus further includes a compliance cage configured to be connected to a ground portion of the PCB, the compliance cage surrounding at least a portion of the heat sink. At least one capacitor plate contacting at least a portion of the compliance cage and extending inwards towards the heat sink and interleaving with the plurality of fins is present. Dielectric spacers are provided to fill a portion of the space between the capacitor plates and the heat sink fins.

Abstract: Apparatuses and methods of fabrication are provided which include a mechanical coolant pump to facilitate pumping a coolant through a coolant loop. The mechanical coolant pump is to couple to an individual and be physically powered by a specified movement of the individual to pump coolant. Coolant pumped by the mechanical coolant pump is circulated by the coolant pump through a device associated with the individual to cool the device.

Abstract: Aspects of the disclosure include a structure for thermal management of pluggable hardware modules, an optical transceiver, and a method of cooling a pluggable hardware module. One embodiment of the structure may comprise a socket assembly adapted to receive a hardware module. The socket assembly may comprise an integrated fluid reservoir containing a thermal interface material (TIM). The socket assembly may be further adapted to define a gap when the hardware module is plugged into the socket assembly. The structure may further comprise at least one dispensing port in fluid communication with the integrated fluid reservoir and the gap. The at least one dispensing port may be adapted to automatically distribute TIM from the integrated fluid reservoir into the gap when the hardware module is plugged into the socket assembly.

Abstract: A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surface; and a cold plate connected in thermal communication with the second major surface.

Abstract: An apparatus includes circuitry configured to maintain a record of a plurality of owners and at least one test operation owned by an owner; prompt automatically the owner in response to a failure of the one test operation; maintain a log of actions taken on the one test operation, and provide availability to the log of actions; update an estimated time to completion, and notify a management entity of the updated estimated time to completion; mark and prioritize an order related to the one test operation, in response to the estimated time to completion being within a threshold of a delivery date; rank the marked order with other marked orders by a risk of not being able to meet the delivery date; and notify the owner of the ranking with an urgent message, in response to the marked order failing to meet the delivery date.

Abstract: A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surface; and a cold plate connected in thermal communication with the second major surface.

Abstract: An apparatus includes circuitry configured to maintain a record of a plurality of owners and at least one test operation owned by an owner; prompt automatically the owner in response to a failure of the one test operation; maintain a log of actions taken on the one test operation, and provide availability to the log of actions; update an estimated time to completion, and notify a management entity of the updated estimated time to completion; mark and prioritize an order related to the one test operation, in response to the estimated time to completion being within a threshold of a delivery date; rank the marked order with other marked orders by a risk of not being able to meet the delivery date; and notify the owner of the ranking with an urgent message, in response to the marked order failing to meet the delivery date.

Abstract: Apparatuses and methods of fabrication are provided which include a mechanical coolant pump to facilitate pumping a coolant through a coolant loop. The mechanical coolant pump is to couple to an individual and be physically powered by a specified movement of the individual to pump coolant. Coolant pumped by the mechanical coolant pump is circulated by the coolant pump through a device associated with the individual to cool the device.