Abstract: A light emitting device and a preparation method therefor, and a light emitting substrate and a preparation method therefor are provided. The light emitting device includes an underlay substrate, a light emitting functional layer disposed on the underlay substrate, and a reflective layer disposed on the underlay substrate and covering at least part of the light emitting functional layer, the reflective layer includes a first material layer and a second material layer, the first material layer and the second material layer are stacked along a thickness direction of the underlay substrate, the first material layer includes an atomic crystal material, the first material layer is at one side of the second material layer away from the underlay substrate, and a surface of the first material layer away from the second material layer is formed as a surface of the reflective layer away from the underlay substrate.

Abstract: A light-emitting device, a display apparatus and a backlight apparatus are provided. The light-emitting device includes a sub-light-emitting unit. The sub-light-emitting unit includes: a first semiconductor layer; a second semiconductor layer, stacked with the first semiconductor layer and having a material different from a material of the first semiconductor layer; a light-emitting layer, located between the first semiconductor layer and the second semiconductor layer; a current spreading layer, located on a side of the first semiconductor layer away from the second semiconductor layer; and an insulating layer, located between the current spreading layer and the first semiconductor layer. The current spreading layer and the second semiconductor layer are electrically connected with the first semiconductor layer through a via hole penetrating the insulating layer.

Abstract: A display substrate, which includes a plurality of first light-emitting diode chips, each first light-emitting diode chip includes a plurality of light-emitting structures, the first substrate comprises a first pixel and a second pixel, the first pixel comprises a light-emitting structure of one first type light-emitting diode chip and a light-emitting structure of one second type light-emitting diode chip, the second pixel comprises a light-emitting structure of one first type light-emitting diode chip and a light-emitting structure of one second type light-emitting diode chip, the first type light-emitting diode chip included in the first pixel and the first type light-emitting diode chip included in the second pixel are the same first type light-emitting diode chip, the second type light-emitting diode chip included in the first pixel and the second type light-emitting diode chip included in the second pixel are different second type light-emitting diode chips.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: Provided are a light-emitting device, a light-emitting substrate and a display device. The light-emitting device includes: a substrate; a first semiconductor layer, the first semiconductor layer being located on one side of the substrate; a light-emitting layer, the light-emitting layer being located on the side of the first semiconductor layer facing away from the substrate; and a second semiconductor layer, the second semiconductor layer being located on the side of the light-emitting layer facing away from the first semiconductor layer.

Abstract: A light emitting diode chip, including at least two light emitting structures spaced apart and sequentially connected in series on a base substrate. At least one of the light emitting structures includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, a first insulation layer, a current spreading layer and a first electrode stacked in sequence. The at least one light emitting structure includes a first via hole in the first insulation layer, the first electrode is electrically connected to the current spreading layer, and the current spreading layer is electrically connected to the second semiconductor layer through the first via hole. An orthographic projection of the first via hole on the base substrate falls within that of the current spreading layer, and the orthographic projection of the current spreading layer on the base substrate falls within that of the second semiconductor layer.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Abstract: Provided are a light-emitting chip, a light-emitting substrate, a display device, and a manufacturing method for a light-emitting substrate. The light-emitting chip includes: a substrate; a light-emitting structure, the light-emitting structure disposed on a side of the substrate; a reflective layer disposed on a side, facing away from the substrate, of the light-emitting structure; at least two sub-light-emitting auxiliary bonding layers disposed on a side, facing away from the light-emitting structure, of the reflective layer; and a raised portion, disposed on a side, facing away from the light-emitting structure, of the reflective layer, an orthographic projection of the raised portion on the substrate and an orthographic projection of the sub-light-emitting auxiliary bonding layers on the substrate do not overlap with each other, and a thickness of the raised portion is smaller than a thickness of each of the at least two sub-light-emitting auxiliary bonding layers.

Abstract: Provided is a light emitting diode chip, including: a base substrate; at least two light emitting units disposed on the base substrate, wherein the at least two light emitting units include adjacent first light emitting unit and second light emitting unit, and each of the first light emitting unit and the second light emitting unit includes: a first semiconductor layer disposed on the base substrate; a light emitting layer disposed on the first semiconductor layer away from the base substrate; and a second semiconductor layer disposed on the light emitting layer away from the base substrate, wherein the light emitting diode chip further includes a bridging part for conducting, and the bridging part is configured to electrically connect the second semiconductor layer of the first light emitting unit with the first semiconductor layer of the second light emitting unit.

Abstract: The present disclosure provides a light-emitting device, a light-emitting module and a preparation method thereof. The light-emitting device includes: a light-emitting structure; an electrode structure provided on the light-emitting structure; and a die-bonding structure, at least a portion of which covers a surface of the electrode structure facing away from the light-emitting structure, where the die-bonding structure includes a doping material for inhibiting generation of an intermetallic compound. The present disclosure is capable of improving the die-bonding rework yield and reducing the risk of failure of a display module.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Abstract: The present disclosure provides a light emitting chip and a producing method thereof, and a light emitting apparatus. The light emitting chip includes a patterned substrate; a light emitting unit, wherein the light emitting unit includes an electron injection layer, a luminescent layer and a hole injection layer; a first electrode, wherein the first electrode is connected to the electron injection layer; a second electrode, wherein the second electrode is connected to the hole injection layer; a first passivation layer, wherein the first passivation layer partially covers the light emitting unit, the first electrode and the second electrode, the first passivation layer includes a first opening, and the light emitting unit partially exposes from the first opening; and a heat dissipating layer, wherein the heat dissipating layer covers the first passivation layer, and a part of the light emitting unit exposing from the first passivation layer.

Abstract: A light emitting device and a preparation method therefor, and a light emitting substrate and a preparation method therefor are provided. The light emitting device includes an underlay substrate, a light emitting functional layer disposed on the underlay substrate, and a reflective layer disposed on the underlay substrate and covering at least part of the light emitting functional layer, the reflective layer includes a first material layer and a second material layer, the first material layer and the second material layer are stacked along a thickness direction of the underlay substrate, the first material layer includes an atomic crystal material, the first material layer is at one side of the second material layer away from the underlay substrate, and a surface of the first material layer away from the second material layer is formed as a surface of the reflective layer away from the underlay substrate.

Abstract: The present disclosure provides a flexible circuit board, a light bar, a light source and a display device. The light source includes a flexible circuit board having at least one effective welding portion and a light bar having at least one effective pad, the at least one effective welding portion being in one-to-one correspondence with the at least one effective pad, and the effective welding portion being fixed to a corresponding effective pad to transmit a signal loaded by itself to the corresponding effective pad. The flexible circuit board further includes at least one auxiliary welding portion, the light bar further includes at least one auxiliary pad that is in one-to-one correspondence with the at least one auxiliary welding portion, and the auxiliary welding portion is fixed to a corresponding auxiliary pad to enhance the firm fixing between the flexible circuit board and the light bar.

Abstract: The present disclosure provides a floating touch camera module, a display device and a touch method. The floating touch camera module includes: a lens with a light collection surface and a light emitting surface; an image sensor at one side of the light emitting surface of the lens, the image sensor configured to receive light rays from the lens and form sensing information; and an infrared cut filter film at one side of a light incident surface of the image sensor and configured to filter out infrared light rays. The infrared cut filter film is movable relative to the lens between a first position at which the infrared cut filter film directly faces the lens and a second position at which the infrared cut filter film is offset from the lens, thereby enabling the floating touch camera module to switch between a photographing mode and a touch mode.

Abstract: A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Abstract: A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Abstract: A backlight structure is provided in embodiments of the disclosure, including: a base plate; a light guide plate, on a surface of the base plate at a side thereof and having a plurality of through-holes passing therethrough; a plurality of LED chips, on a surface of the base plate at the same side as the light guide plate, each of the plurality of LED chips being located in one-to-one correspondence within one of the plurality of through-holes of the light guide plate; a fluorescent powder filler filling the plurality of through-holes; a plurality of reflecting elements, on a first surface of the light guide plate facing away from the base plate, respectively, and covering the plurality of through-holes which open outwards at the first surface of the light guide plate, respectively; and a plurality of light extracting structures, on the first surface of the light guide plate, respectively, and configured to guide light to exit therefrom.