Abstract: The present invention discloses a semiconductor device with an asymmetric channel extension structure capable of storing charges, improving gate oxide reliability, reducing parasitic capacitance and adjusting its channel extension current or turn-on resistance. A gate dielectric is formed on the semiconductor substrate. A gate is formed on the gate dielectric. A first isolation layer is formed over the sidewall of the gate. Dielectric spacers are formed on the sidewall of the first isolation layer. And at least one of the p-n junctions of source and drain regions is formed under the dielectric spacers. A fringing field induced extension region formed adjacent to asymmetric channel under gate dielectric and close to at least one of said doped regions. A threshold voltage adjustment implantation region formed under gate dielectric An anti-punch-through implantation region formed under threshold voltage adjustment implantation region.

Abstract: The present invention discloses a semiconductor device, the device comprising a semiconductor layer on a substrate. A gate oxide and a gate electrode are formed on the semiconductor substrate. A gate conductive layer is formed on the gate electrode. A first doped region is formed in the semiconductor layer. A dielectric spacer is optionally formed onto the sidewall of the gate electrode and part of the semiconductor layer. A second doped region is formed from a predetermined distance to the gate electrode, wherein the predetermined distance is no less than the distance between the first doped region and the gate electrode. A third doped region is formed adjacent to the first doped region in the semiconductor layer and between the first doped region and the second doped region.

Abstract: The present invention discloses a semiconductor device with tailored extension structure comprising a semiconductor substrate. A gate dielectric is formed on the semiconductor substrate. A gate is formed on the gate dielectric. A first isolation layer is formed over the sidewall of the gate. Dielectric spacers are formed on the sidewall of the first isolation layer. And at least one of the p-n junctions of source and drain regions is formed under the dielectric spacers and therefore forming the fringing field induced extension region. Silicide layer is formed on the gate or the doped regions. The first dielectric layer is formed over the silicide layer, dielectric spacer and portion of semiconductor substrate. The second dielectric layer is formed over the first dielectric layer. A metal plug or interconnecting structure is formed in the first dielectric layer and second dielectric layer to electrically connect to at least one of doped regions.

Abstract: A memory unit comprising a gate electrode, a gate dielectric under said gate electrode, an active area and a metal-semiconductor compound layer is provided. The active area comprises a first source/drain region, a second source/drain region, a normal field channel region formed under said gate electrode, a fringing field channel region formed between said first source/drain region and said normal field channel region, a pocket implantation region formed under the fringing or normal field channel regions and an extension doping region formed between said second source/drain region and said normal field channel region. The metal-semiconductor compound layer is formed over said gate electrode, first source/drain region and second source/drain region.

Abstract: The present invention discloses a semiconductor device, the device comprising a semiconductor layer on a substrate. A gate oxide and a gate electrode are formed on the semiconductor substrate. A gate conductive layer is formed on the gate electrode. A first doped region is formed in the semiconductor layer. A dielectric spacer is optionally formed onto the sidewall of the gate electrode and part of the semiconductor layer. A second doped region is formed from a predetermined distance to the gate electrode, wherein the predetermined distance is no less than the distance between the first doped region and the gate electrode. A third doped region is formed adjacent to the first doped region in the semiconductor layer and between the first doped region and the second doped region.