Patents by Inventor Yuan Feng LIU

Yuan Feng LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11995197
    Abstract: In a method for encryption of sensitive data, an encrypted user private key is received in a Trusted Execution Environment (TEE) in a worker node in a container management system, the encrypted user private key being an encrypted version of a user private key for decrypting a message from a user in the container management system. The user private key is obtained in the TEE, and the encrypted user private key being decrypted into the user private key with a provider private key that is received from an encryption manager for managing the container management system. With these embodiments, the user private key may be transmitted to the worker node safely, such that the worker node may use the user private key to decrypt messages from the user. Therefore, the security level of the container management system may be increased.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: May 28, 2024
    Assignee: International Business Machines Corporation
    Inventors: Qi Feng Huo, Yan Song Liu, Da Li Liu, Lei Li, Yuan Yuan Wang
  • Patent number: 11989282
    Abstract: A system may include a memory and a processor in communication with the memory. The processor may be configured to perform operations that include generating a key pair and encrypting a data credential with a public key to make a data credential secret. The operations may further include storing the data credential secret in a cluster on a host and deploying a workload on the cluster. The operations may also include establishing an empty bundle in the host and generating a pod trusted execution environment.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: May 21, 2024
    Assignee: International Business Machines Corporation
    Inventors: Da Li Liu, Qi Feng Huo, Yuan Yuan Wang, Lei Li, Yan Song Liu
  • Patent number: 11991882
    Abstract: A method for fabricating a memory device includes: providing a substrate; forming a first dielectric layer over the substrate; forming a plurality of conductive layers and a plurality of dielectric layers alternately and horizontally disposed on the substrate; forming a channel column structure on the substrate and in the plurality of conductive layers and the plurality of dielectric layers, where a side wall of the channel column structure is in contact with the plurality of conductive layers; forming a second dielectric layer covering the first dielectric layer; and forming, in the first and second dielectric layers, a conductive column structure adjacent to the channel column structure and in contact with one of the plurality of conductive layers, where the conductive column structure includes a liner insulating layer as a shell layer.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: May 21, 2024
    Assignee: MACRONIX International Co., Ltd.
    Inventors: Yao-An Chung, Yuan-Chieh Chiu, Ting-Feng Liao, Kuang-Wen Liu, Kuang-Chao Chen
  • Patent number: 11984419
    Abstract: Package structures and methods for manufacturing the same are provided. The package structure includes a first bump structure formed over a first substrate. The first bump structure includes a first pillar layer formed over the first substrate and a first barrier layer formed over the first pillar layer. In addition, the first barrier layer has a first protruding portion laterally extending outside a first edge of the first pillar layer. The package structure further includes a second bump structure bonded to the first bump structure through a solder joint. In addition, the second bump structure includes a second pillar layer formed over a second substrate and a second barrier layer formed over the second pillar layer. The first protruding portion of the first barrier layer is spaced apart from the solder joint.
    Type: Grant
    Filed: July 26, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Cheng-Hung Chen, Yu-Nu Hsu, Chun-Chen Liu, Heng-Chi Huang, Chien-Chen Li, Shih-Yen Chen, Cheng-Nan Hsieh, Kuo-Chio Liu, Chen-Shien Chen, Chin-Yu Ku, Te-Hsun Pang, Yuan-Feng Wu, Sen-Chi Chiang
  • Publication number: 20240143373
    Abstract: Virtual machine management is provided. A virtual machine is started automatically based on a custom resource definition of the virtual machine in response to the receiving the custom resource definition of the virtual machine. A container is generated to run an application workload in the virtual machine based on a container configuration file in response to the virtual machine starting. The application workload is deployed on the container automatically based on a container image corresponding to the container. The application workload is run on the container automatically in accordance with a definition of the application workload.
    Type: Application
    Filed: November 2, 2022
    Publication date: May 2, 2024
    Inventors: Yuan Yuan Wang, Qi Feng Huo, Da Li Liu, Lei Li, Yan Song Liu
  • Patent number: 11928503
    Abstract: Embodiments are directed to deploying a workload on the best/highest performance node. Nodes configured to accommodate a request for a workload are selected. Information is collected on each of the selected nodes and the workload. Predicted response times expected for the workload running on each of the selected nodes are determined. The workload is deployed on a node of the selected nodes, the node having a corresponding predicted response time for the workload, the workload being deployed on the node based at least in part on the corresponding predicted response time.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: March 12, 2024
    Assignee: International Business Machines Corporation
    Inventors: Qi Feng Huo, Yuan Yuan Wang, Da Li Liu, Lei Li, Yan Song Liu
  • Publication number: 20240072997
    Abstract: User data security is provided. Encrypted user data are identified in a virtual machine. A private key of a public/private cryptographic key pair corresponding to a user is retrieved. The encrypted user data is decrypted within the virtual machine utilizing the private key corresponding to the user to form decrypted user data. The encrypted user data are replaced in the virtual machine with the decrypted user data. The decrypted user data is processed in the virtual machine to perform a service in a cloud environment.
    Type: Application
    Filed: August 29, 2022
    Publication date: February 29, 2024
    Inventors: Qi Feng Huo, Yuan Yuan Wang, Da Li Liu, Yan Song Liu, Lei Li
  • Patent number: 11575118
    Abstract: A method for forming a current collector is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: February 7, 2023
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yuan-Feng Liu, Ze-Cheng Hou, Lu Chen, Lin Zhu, Wen-Zhen Li
  • Patent number: 11312105
    Abstract: An aluminum matrix composite is provided. The aluminum matrix composite comprises at least one reinforcement layer and an aluminum layer. The at least one reinforcement layer comprises a plurality of reinforcement sheets. The plurality of reinforcement sheets are uniformly dispersed in at least a portion of the aluminum layer.
    Type: Grant
    Filed: January 27, 2021
    Date of Patent: April 26, 2022
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yuan-Feng Liu, Ze-Cheng Hou, Lu Chen, Lin Zhu, Wen-Zhen Li
  • Patent number: 11225044
    Abstract: A method for forming a porous copper composite is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: January 18, 2022
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yuan-Feng Liu, Ze-Cheng Hou, Lu Chen, Lin Zhu, Wen-Zhen Li
  • Patent number: 11196035
    Abstract: An anode of the lithium ion battery is provided. The anode of the lithium ion battery comprises a nanoporous copper substrate and a copper oxide nanosheet array. The copper oxide nanosheet array is disposed on one surface of the nanoporous copper substrate, and the nanoporous copper substrate is chemically bonded to the copper oxide nanosheet array.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: December 7, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yuan-Feng Liu, Ze-Cheng Hou, Lu Chen, Lin Zhu, Wen-Zhen Li
  • Patent number: 11158843
    Abstract: A method for making nanoporous nickel composite material comprises: providing a cathode plate and a copper-containing anode plate, electroplating a copper material layer a surface of the cathode plate; laying a carbon nanotube layer on the copper material layer, and forming an overlapped structure of the copper material layer and the carbon nanotube laye; the cathode plate and the overlapped structure are used as a cathode, and a nickel-containing anode plate is used as an anode, plating a nickel material layer on the overlapped structure to form sandwich structure; repeating steps S1 to S3 to obtain a carbon nanotube-reinforced copper-nickel alloy; rolling and annealing the carbon nanotube-reinforced copper-nickel alloy; and etching the carbon nanotube-reinforced copper-nickel alloy to form the nanoporous nickel composite material.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: October 26, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ze-Cheng Hou, Yuan-Feng Liu, Lin Zhu, Wen-Zhen Li
  • Publication number: 20210146656
    Abstract: An aluminum matrix composite is provided. The aluminum matrix composite comprises at least one reinforcement layer and an aluminum layer. The at least one reinforcement layer comprises a plurality of reinforcement sheets.
    Type: Application
    Filed: January 27, 2021
    Publication date: May 20, 2021
    Inventors: YUAN-FENG LIU, Ze-Cheng Hou, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Patent number: 10940672
    Abstract: A method for forming an aluminum matrix composite is provided. At least one reinforcement layer and an aluminum layer are provided. The at least one reinforcement layer is disposed on at least one surface of the aluminum layer to form a first composite structure. The first composite structure is pressed to form a second composite structure. A process of alternatively folding and pressing the second composite structure is repeated to form the aluminum matrix composite.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: March 9, 2021
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yuan-Feng Liu, Ze-Cheng Hou, Lu Chen, Lin Zhu, Wen-Zhen Li
  • Patent number: 10844508
    Abstract: A method of making a nanoporous copper is provided. A copper alloy layer and at least one active metal layer are provided. The copper alloy layer comprises a first surface and a second surface. The at least one active metal layer is located on the first surface and the second surface to form a structure. The structure is processed to form a composite structure. A process of folding and pressing the composite structure is repeated to form a precursor. The precursor is corroded to form the nanoporous copper.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: November 24, 2020
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yue-Feng Meng, Lun-Qiao Xiong, Yuan-Feng Liu, Ze-Cheng Hou, Hong-Ying Fu, Lin Zhu, Wen-Zhen Li
  • Publication number: 20200321602
    Abstract: A method for making nanoporous nickel composite material comprises: providing a cathode plate and a copper-containing anode plate, electroplating a copper material layer a surface of the cathode plate; laying a carbon nanotube layer on the copper material layer, and forming an overlapped structure of the copper material layer and the carbon nanotube laye; the cathode plate and the overlapped structure are used as a cathode, and a nickel-containing anode plate is used as an anode, plating a nickel material layer on the overlapped structure to form sandwich structure; repeating steps S1 to S3 to obtain a carbon nanotube-reinforced copper-nickel alloy; rolling and annealing the carbon nanotube-reinforced copper-nickel alloy; and etching the carbon nanotube-reinforced copper-nickel alloy to form the nanoporous nickel composite material.
    Type: Application
    Filed: April 26, 2019
    Publication date: October 8, 2020
    Inventors: Ze-Cheng Hou, YUAN-FENG LIU, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20200280049
    Abstract: A method for forming a current collector is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.
    Type: Application
    Filed: April 23, 2019
    Publication date: September 3, 2020
    Inventors: YUAN-FENG LIU, Ze-Cheng Hou, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20200276784
    Abstract: A method for forming a porous copper composite is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.
    Type: Application
    Filed: April 23, 2019
    Publication date: September 3, 2020
    Applicants: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUAN-FENG LIU, Ze-Cheng Hou, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Publication number: 20200164620
    Abstract: A method for forming an aluminum matrix composite is provided. At least one reinforcement layer and an aluminum layer are provided. The at least one reinforcement layer is disposed on at least one surface of the aluminum layer to form a first composite structure. The first composite structure is pressed to form a second composite structure. A process of alternatively folding and pressing the second composite structure is repeated to form the aluminum matrix composite.
    Type: Application
    Filed: February 27, 2019
    Publication date: May 28, 2020
    Inventors: YUAN-FENG LIU, Ze-Cheng Hou, LU CHEN, LIN ZHU, WEN-ZHEN LI
  • Patent number: 10637324
    Abstract: An electric actuator includes a motor having a rotary shaft. The electric actuator further includes a vibration damping gasket mounted on the motor. The vibration damping gasket includes an annular body attached around the motor and an end wall formed on one end of the annular body, and the end wall defines a through hole allowing the rotary shaft to pass therethrough. The motor further includes an outer housing, and the annular body of the vibration damping gasket is attached around the outer housing. The end wall of the vibration damping gasket contacts with the end surface of the outer housing. The vibration damping gasket is made from a resilient material. The electric actuator can effectively reduce the mechanical vibration, improve a buffering effect thereof, and hence reduce the noise.
    Type: Grant
    Filed: March 21, 2017
    Date of Patent: April 28, 2020
    Assignee: JOHNSON ELECTRIC INTERNATIONAL AG
    Inventors: Dao Long Xiao, Jing Xin Shi, Yuan Feng Liu, Si Jun Zhao, Hong Min Wei, Shu Ze Li, Bin Liu, Xiang Chun Duan, Hui Juan Xing, Fei Fei Huang