Abstract: An electromedical apparatus, a method for manufacturing the electromedical apparatus and a method for deploying the electromedical apparatus. The electromedical apparatus includes an electrical component arranged to facilitate an electrical signal transmission between an electrical device and a target; and a mechanical component physically connected to the electrical component; wherein the mechanical component includes a fluidic structure arranged to modify at least one physical property of the mechanical component, so as to facilitate a deployment of the electromedical apparatus on the target.

Abstract: A semiconductor chip package and a semiconductor chip packaging method are provided. The package includes: a semiconductor chip having a functional region, a protective substrate located on one side of the semiconductor chip and covering the functional region, and a support unit located between the protective substrate and the semiconductor chip and enclosing the functional region. The support unit includes an outer support member and an inner support member located inside the outer support member. A receiving cavity is formed between the inner support member, the semiconductor chip and the protective substrate. A hollow cavity is formed between the inner support member, the outer support member, the semiconductor chip and the protective substrate. The inner support member is provided with at least one first ventilating structure, through which the receiving cavity is in communication with the hollow cavity.

Abstract: A semiconductor chip package and a semiconductor chip packaging method are provided. The package includes: a semiconductor chip having a functional region, a protective substrate located on one side of the semiconductor chip and covering the functional region, and a support unit located between the protective substrate and the semiconductor chip and enclosing the functional region. The support unit includes an outer support member and an inner support member located inside the outer support member. A receiving cavity is formed between the inner support member, the semiconductor chip and the protective substrate. A hollow cavity is formed between the inner support member, the outer support member, the semiconductor chip and the protective substrate. The inner support member is provided with at least one first ventilating structure, through which the receiving cavity is in communication with the hollow cavity.

Abstract: The invention discloses an acrylic acid-modified epoxy polyester resin and the preparation process thereof. The resin comprises 100 pbw of a copolymer (A) formed from an unsaturated fatty acid-modified polyester and a bisphenol A type epoxy resin, and 20-40 pbw of poly(meth)acrylic acid (ester) (B). The preparation process comprises the following steps: (1) alcoholyzing a drying oil with a polyol; (2) adding successively, to the product from step (1), a dibasic anhydride, a fatty acid containing a conjugated double bond and an epoxy resin, and esterifying to obtain an epoxy polyester; and (3) copolymerizing the epoxy polyester from step (2) and an acrylic monomer. This invention also provides a water-based emulsion containing said resin, and a water-based paint exhibiting excellent antirust property and having low production cost.

Abstract: The invention discloses an acrylic acid-modified epoxy polyester resin and the preparation process thereof. The resin comprises 100 pbw of a copolymer (A) formed from an unsaturated fatty acid-modified polyester and a bisphenol A type epoxy resin, and 20-40 pbw of poly(meth)acrylic acid (ester) (B). The preparation process comprises the following steps: (1) alcoholyzing a drying oil with a polyol; (2) adding successively, to the product from step (1), a dibasic anhydride, a fatty acid containing a conjugated double bond and an epoxy resin, and esterifying to obtain an epoxy polyester; and (3) copolymerizing the epoxy polyester from step (2) and an acrylic monomer. This invention also provides a water-based emulsion containing said resin, and a water-based paint exhibiting excellent antirust property and having low production cost.