Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

Abstract: A method of determining a support structure depth of a support structure having a front and a back separated by the support structure depth includes: obtaining a point cloud of the support structure, and a mask indicating, for a plurality of portions of an image of the support structure captured from a capture pose, respective confidence levels that the portions depict the back of the support structure; selecting, from the point cloud, an initial set of points located within a field of view originating at the capture pose; selecting, from the initial set of points, an unoccluded subset of depth measurements, the depth measurements in the unoccluded subset corresponding to respective image coordinates; retrieving, from the mask, a confidence level for each of the depth measurements in the unoccluded subset; and based on the depth measurements in the unoccluded subset and the retrieved confidence levels, determining the support structure depth.

Abstract: A method of detecting objects on a support structure includes: obtaining a point cloud of the support structure supporting an object; obtaining a position of a back of the support structure in the point cloud; discarding a portion of the point cloud based on the position of the back of the support structure; generating a three-dimensional occupancy grid from the point cloud, the occupancy grid having a plurality of cells each indicating whether the cell is one of occupied and unoccupied; identifying a contiguous region of occupied cells in the occupancy grid corresponding to the object; and generating a detected object position based on the contiguous region.