Abstract: A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Abstract: A composition for forming a gasket comprises a curable elastomer material and 0.1-20 weight % (e.g., 4-10 weight %) carbon nanotubes dispersed throughout the elastomer material. A dispensed bead of elastomer material exhibits a Slump ratio of at least 0.7. The composition provides the correct balance of rheology/dispensing characteristics, seal characteristics, and contamination profile characteristics required in form-in-place gasket applications, while simultaneously providing a conductive form-in-place gasket.