Abstract: Methods for improving wafer bonding performance are disclosed herein. In some embodiments, a method for bonding a pair of semiconductor substrates is disclosed. The method includes: processing at least one of the pair of semiconductor substrates, and bonding the pair of semiconductor substrates together. Each of the pair of semiconductor substrates is processed by: performing at least one chemical vapor deposition (CVD), and performing at least one chemical mechanical polishing (CMP). One of the at least one CVD is performed after all CMP performed before bonding.

Abstract: A multi-part apparatus and a data transmission method thereof are provided. The method is adapted to a multi-part apparatus having a master apparatus and a separable slave apparatus. The master apparatus and the slave apparatus are attached to each other through magnetism, and each of them has a wireless transmission module and a plurality of pins disposed on a side. In this method, a variation of the magnetism is detected, so as to determine a relative position between the master apparatus and the slave apparatus. When the master apparatus and the slave apparatus are attached to each other with a shift, a wireless connection set up by the wireless transmission modules is used for data transmission; and when the master apparatus and the slave apparatus are connected to each other with the sides thereof, both the wireless connection and the pins are used for data transmission.

Abstract: A portable electronic device including a first body, a second body, and an assembling structure is provided. The assembling structure includes a first assembling unit and a second assembling unit. The first assembling unit is adapted to hidden in one of the first and the second bodies, and the second assembling unit is disposed and hidden in another one of the first and the second bodies. When the first body is close to the second body, the first assembling unit is protruded out of the first body or the second body, and assembled to the second assembling unit, such that the first and the second bodies are fixed to each other.

Abstract: Intelligent data management methods and systems are provided. Firstly, at least one event data is provided, wherein the event data at least includes identification data corresponding to at least one participant. Contact information corresponding to the participant is retrieved from a database according to the identification data corresponding to the participant. Then, a display interface is provided to simultaneously display the event data and the contact information corresponding to the participant. Then, an option interface is provided to select the contact information, wherein when the contact information is selected, a communication with participant is established based on the contact information.