Abstract: Techniques are provided for placing and routing vias that conduct signals through a connector between two electrical units. Vias that conduct a first set of signals are placed next to vias that provide return paths for the first set of signals to reduce cross-talk or impedance. Vias that conduct input or output signals can be placed next to vias that provide return paths for the input or output signals to reduce cross-talk. The vias that provide the return paths can conduct, for example, ground signals, power supply signals, or both. Vias that conduct power supply signals can be placed next to vias that provide return paths for the power supply signals to reduce impedance. The vias that provide the return paths for the power supply signals can conduct, for example, ground signals. The via configurations reduce cost and increase yield, and the via configurations are modular.