Patents by Inventor Yuanwei WANG
Yuanwei WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250117347Abstract: Provided are a distributed parallel computing based graph computing method, a distributed parallel computing system and a computer readable medium. A graph computing method comprises: obtaining data of a graph to be computed, the graph comprising a plurality of vertices and edges; storing the graph according to a compressed sparse row format, and storing the graph in a sparse matrix form, wherein all adjacent edges having a same vertex are continuously stored, and an offset array is used to support an index function thereof; and for subgraphs in which the degrees of both source vertices and target vertices are greater than a predetermined threshold, in forward graphs, performing segmentation according to target vertices, i.e., the column of a matrix, and in reverse graphs, performing segmentation according to source vertices, i.e.Type: ApplicationFiled: September 30, 2024Publication date: April 10, 2025Inventors: Huanqi CAO, Yuanwei WANG
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Publication number: 20250097282Abstract: Provided are a distributed parallel computing-based graph computing method, a distributed parallel computing system, and a computer readable medium.Type: ApplicationFiled: September 30, 2024Publication date: March 20, 2025Inventors: Huanqi CAO, Yuanwei WANG
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Publication number: 20240380695Abstract: The present disclosure relates to data packet routing methods and apparatuses. One example method includes when a data packet of a computation task type is received, determining a first computation task type corresponding to the data packet, determining, based on a pre-obtained first correspondence between a computation task type, other nodes, and computing performance, at least one other node corresponding to the first computation task type and computing performance corresponding to the at least one other node, determining a target node from the at least one other node based on the computing performance corresponding to the at least one other node and based on a link status between a local node and each of the at least one other node, determining an address of the target node as a destination address of the data packet, and forwarding the data packet based on the destination address.Type: ApplicationFiled: July 22, 2024Publication date: November 14, 2024Inventors: Fengxin SUN, Guanhua ZHUANG, Yuanwei WANG, Feng LI, Xiaomin YANG, Shuheng GU
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Patent number: 12074796Abstract: Examples in this disclosure relates to methods and apparatus for routing data packet. One example method includes receiving a data packet, determining a first computation task type corresponding to the data packet, determining, based on a pre-obtained first correspondence between the first computation task type, nodes, and a computing performance corresponding to each of the nodes, at least one of the nodes corresponding to the first computation task type and a first computing performance corresponding to the at least one of the nodes, determining a target node from the at least one of the nodes based on the first computing performance corresponding to the at least one of the nodes and a link status between a local node and each of the at least one of the nodes, determining an address of the target node as a destination address of the data packet, and forwarding the data packet based on the destination address.Type: GrantFiled: July 20, 2021Date of Patent: August 27, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Fengxin Sun, Guanhua Zhuang, Yuanwei Wang, Feng Li, Xiaomin Yang, Shuheng Gu
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Patent number: 11929550Abstract: A radio frequency (RF) connector includes an insulating portion configured in a cylindrical shape; an outer conducting portion configured in a cylindrical shape and disposed to surround an outer circumferential surface of the insulating portion; and an inner conducting portion disposed inside the insulating portion in a hollow shape and having both ends protruding from the insulating portion, the insulating portion electrically separating the outer conducting portion from the inner conducting portion.Type: GrantFiled: August 21, 2019Date of Patent: March 12, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Yiwei Ma, Rongbiao Su, Yuanwei Wang
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Patent number: 11289843Abstract: A test adapter for establishing a test connection with a circuit board is provided. The circuit board includes an inter-board connector or a planar contact in close contact with the inter-board connector. The test adapter includes a metal housing having a contact surface in contact with a flat surface of the circuit board, a connection end opposite to the contact surface, and a first cavity having a first opening at the center of the contact surface. The test adapter further comprises a first outer conductor and a first inner conductor arranged in the first cavity, and an insulating medium arranged between the first outer conductor and the first inner conductor.Type: GrantFiled: July 24, 2020Date of Patent: March 29, 2022Inventors: Yumei Wang, Fei Gao, Yuanwei Wang, Futing Lv
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Publication number: 20210352014Abstract: Examples in this disclosure relates to methods and apparatus for routing data packet. One example method includes receiving a data packet, determining a first computation task type corresponding to the data packet, determining, based on a pre-obtained first correspondence between the first computation task type, nodes, and a computing performance corresponding to each of the nodes, at least one of the nodes corresponding to the first computation task type and a first computing performance corresponding to the at least one of the nodes, determining a target node from the at least one of the nodes based on the first computing performance corresponding to the at least one of the nodes and a link status between a local node and each of the at least one of the nodes, determining an address of the target node as a destination address of the data packet, and forwarding the data packet based on the destination address.Type: ApplicationFiled: July 20, 2021Publication date: November 11, 2021Inventors: Fengxin SUN, Guanhua ZHUANG, Yuanwei WANG, Feng LI, Xiaomin YANG, Shuheng GU
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Publication number: 20210328333Abstract: A radio frequency (RF) connector includes an insulating portion configured in a cylindrical shape; an outer conducting portion configured in a cylindrical shape and disposed to surround an outer circumferential surface of the insulating portion; and an inner conducting portion disposed inside the insulating portion in a hollow shape and having both ends protruding from the insulating portion, the insulating portion electrically separating the outer conducting portion from the inner conducting portion.Type: ApplicationFiled: August 21, 2019Publication date: October 21, 2021Inventors: Yiwei MA, Rongbiao SU, Yuanwei WANG
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Publication number: 20210305743Abstract: A test adapter for establishing a test connection with a circuit board is provided. The circuit board includes an inter-board connector or a planar contact in close contact with the inter-board connector. The test adapter includes a metal housing having a contact surface in contact with a flat surface of the circuit board, a connection end opposite to the contact surface, and a first cavity having a first opening at the center of the contact surface. The test adapter further comprises a first outer conductor and a first inner conductor arranged in the first cavity, and an insulating medium arranged between the first outer conductor and the first inner conductor.Type: ApplicationFiled: July 24, 2020Publication date: September 30, 2021Inventors: Yumei WANG, Fei GAO, Yuanwei WANG, Futing LV
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Patent number: 9920452Abstract: The present invention relates to method of preparing a monocrystalline diamond abrasive grain comprising the steps of: sufficiently dispersing a micron-scale monocrystalline diamond and at least a micron-scale metal powder in a sol containing at least a nano-scale metal powder, and controlling the suitable ratio of the two kinds of metal powder with different order of magnitude of particle size, accordingly the micron-scale metal powder can be stuffed into voids among the monocrystalline diamond grains, and only a suitable amount of nano-scale metal powder is required to let the micron-scale metal powder and nano-scale metal powder coat together on the surface of the micron-scale diamond to form an integral and uniform coating layer including at least two kinds of metal grains, thus the resulting monocrystalline diamond abrasive grains have a unique rough-surface morphology, a plurality of contact points and contact surfaces resenting in the grinding process and good self-sharpening.Type: GrantFiled: July 29, 2014Date of Patent: March 20, 2018Assignee: BEIJING POLYSTAR HITECH CO., LTD.Inventors: Zhenyu Wang, Xiaogang Hu, Yuanwei Wang
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Publication number: 20160281264Abstract: The present invention relates to method of preparing a monocrystalline diamond abrasive grain comprising the steps of: sufficiently dispersing a micron-scale monocrystalline diamond and at least a micron-scale metal powder in a sol containing at least a nano-scale metal powder, and controlling the suitable ratio of the two kinds of metal powder with different order of magnitude of particle size, accordingly the micron-scale metal powder can be stuffed into voids among the monocrystalline diamond grains, and only a suitable amount of nano-scale metal powder is required to let the micron-scale metal powder and nano-scale metal powder coat together on the surface of the micron-scale diamond to form an integral and uniform coating layer including at least two kinds of metal grains, thus the resulting monocrystalline diamond abrasive grains have a unique rough-surface morphology, a plurality of contact points and contact surfaces resenting in the grinding process and good self-sharpening.Type: ApplicationFiled: July 29, 2014Publication date: September 29, 2016Applicant: BEIJING POLYSTAR HITECH CO., LTD.Inventors: Zhenyu WANG, Xiaogang HU, Yuanwei WANG