Patents by Inventor Yuan-Wei Yang

Yuan-Wei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084445
    Abstract: A leak check is performed on a semiconductor wafer processing tool that includes a process chamber and process gas lines, and a semiconductor wafer is processed using the semiconductor wafer processing tool if the leak check passes. Each gas line includes a mass flow controller (MFC) and normally closed valves including an upstream and downstream valves upstream and downstream of the MFC. Leak checking includes: leak checking up to the downstream valves of the gas lines with the upstream valves closed and the downstream valves of the gas lines closed; and leak checking up to the upstream valve of each the process gas line with the upstream valves of the of the process gas lines closed and with the downstream valve of the of the process gas line being leak checked open and the downstream valve of every other process gas line closed.
    Type: Application
    Filed: January 4, 2023
    Publication date: March 14, 2024
    Inventors: Chih-Wei Chou, Yuan-Hsin Chi, Chih-Hao Yang, Hung-Chih Wang, Yu-Chi Liu, Sheng-Yuan Lin
  • Patent number: 4781625
    Abstract: Disclosed is an electrical connector transferring device, comprising: a first plastic member having at least one row of first upper through holes and at least one row of first lower through holes; a second plastic member having at least one row of second upper through holes corresponding with said one row of first lower through holes, and at least one row of second lower through holes corresponding with said one row of first upper through holes; a first intermediate block having a set of first grooves corresponding with to said one row of first upper through holes, and a set of second grooves corresponding with said one row of first lower through holes, said first intermediate block being assembled to said first plastic member; a second intermediate block having a set of third grooves corresponding with said one row of second lower through holes, and a set of fourth grooves corresponding with said one row of second upper through holes, said second intermediate block being assembled between said first intermed
    Type: Grant
    Filed: December 29, 1987
    Date of Patent: November 1, 1988
    Assignee: Ming Fortune Industry Co., Ltd.
    Inventor: Yuan-Wei Yang