Abstract: A light collection system including a light concentrating device and a reflective curving-surface device is provided. The light concentrating device receives at least a portion of an incident light and forwardly emits the portion of the incident light after concentrating and passing it through a first focal region, so as to obtain a first-stage output light. The reflective curving-surface device has an entrance aperture for receiving the first-stage output light. The reflective curving-surface device includes a reflective inner curving surface, and at least a portion of the reflective inner curving surface has a second focal region. The first focal region and the second focal region are confocal or approximately confocal within a range. As a result, at least a portion of the first-stage output light is confocally converted into a forwardly emitted second-stage output light.

Abstract: A light collection system including a light concentrating device and a reflective curving-surface device is provided. The light concentrating device receives at least a portion of an incident light and forwardly emits the portion of the incident light after concentrating and passing it through a first focal region, so as to obtain a first-stage output light. The reflective curving-surface device has an entrance aperture for receiving the first-stage output light. The reflective curving-surface device includes a reflective inner curving surface, and at least a portion of the reflective inner curving surface has a second focal region. The first focal region and the second focal region are confocal or approximately confocal within a range. As a result, at least a portion of the first-stage output light is confocally converted into a forwardly emitted second-stage output light.

Abstract: A non-mask micro-flow etching process, comprising steps of: moving a nozzle capable of inkjetting an etchant over a substrate capable of being dissolved by the etchant; and inkjetting the etchant on the substrate from the nozzle. Means such as polishing and grinding are used to planarize the substrate by removing the flanges formed on the etched substrate. By the control of the size, the amount, the position, the moving direction and the traveling path of the nozzle, and the control of the droplet volume and the concentration of the etchant, as well as the matching of different substrates to a variety of etchants, micro-cups or micro-channels of any shape and formation can be formed to be adapted to electro-phoretic displays, semiconductor devices or any opto-electronic device requiring micro-structures.