Patents by Inventor Yuanyuan Ye

Yuanyuan Ye has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11921639
    Abstract: A method for caching data, and a host device and a storage system that caches data. The method includes determining a first file in a storage device as a first predetermined type of file; reallocating a logical address of a predetermined logical address region to the first file; and updating a first logical address to physical address (L2P) table, corresponding to the predetermined logical address region, in a cache of the host device. The updated first L2P table includes a mapping relationship between the logical address reallocated for the first file and a physical address of the first file.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: March 5, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Heng Zhang, Yuanyuan Ye, Huimei Xiong, Yunchang Liang
  • Publication number: 20230376421
    Abstract: A method for caching data, and a host device and a storage system that caches data. The method includes determining a first file in a storage device as a first predetermined type of file; reallocating a logical address of a predetermined logical address region to the first file; and updating a first logical address to physical address (L2P) table, corresponding to the predetermined logical address region, in a cache of the host device. The updated first L2P table includes a mapping relationship between the logical address reallocated for the first file and a physical address of the first file.
    Type: Application
    Filed: June 28, 2022
    Publication date: November 23, 2023
    Inventors: HENG ZHANG, YUANYUAN YE, HUIMEI XIONG, YUNCHANG LIANG
  • Patent number: 10996856
    Abstract: The present disclosure involves a hardware-supported 3D-stacked NVM data compression method and system, involving setting a first identifier to mark a compression state of written-back data, the method at least comprising steps of: dividing the written-back data into a plurality of sub-blocks and acquiring a plurality of first output results through OR operations among the sub-blocks, respectively, or acquiring a plurality of second output results through exclusive OR operations among the sub-blocks, and determining a compression strategy for the written-back data based on the first output results or the second output results; and setting a second identifier to mark a storing means of the written-back data so that the second identifier is in pair with the first identifier, and configuring a storage strategy for the written-back data that includes at least rotating the second identifier.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: May 4, 2021
    Assignee: HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Haikun Liu, Xiaofei Liao, Hai Jin, Yuanyuan Ye
  • Publication number: 20200278795
    Abstract: The present disclosure involves a hard-ware-supported 3D-stacked NVM data compression method and system, involving setting a first identifier to mark a compression state of written-back data, the method at least comprising steps of: dividing the written-back data into a plurality of sub-blocks and acquiring a plurality of first output results through OR operations among the sub-blocks, respectively, or acquiring a plurality of second output results through exclusive OR operations among the sub-blocks, and determining a compression strategy for the written-back data based on the first output results or the second output results; and setting a second identifier to mark a storing means of the written-back data so that the second identifier is in pair with the first identifier, and configuring a storage strategy for the written-back data that includes at least rotating the second identifier.
    Type: Application
    Filed: January 23, 2020
    Publication date: September 3, 2020
    Inventors: Haikun Liu, Xiaofei Liao, Hai Jin, Yuanyuan Ye