Abstract: The present disclosure provides a wafer repair method, system, apparatus and device, and a storage medium, relating to the field of semiconductor devices. The method includes: a laser equipment acquires test data for repairing a predetermined wafer; the laser equipment sending the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; and the laser equipment obtaining the repair data in the predetermined format to repair the predetermined wafer.

Abstract: The present application provides laser machine automatic operating method and system, which method comprises: basing on feature information to judge whether a wafer has completed operation on a laser machine, if yes, skipping over the laser machine to perform the next procedure, if not, executing step; processing the wafer on the laser machine, wherein the laser machine generates record information, and the record information is related to operation information of the wafer on the laser machine; and acquiring the record information, and basing on the record information to generate feature information, the feature information serving as judging criteria in step.

Abstract: A method and apparatus for controlling a tester, related medium and electronic device are provided. The apparatus includes a vibration data collector attached on a side wall of the tester to collect vibration data from the tester during operation thereof. The method includes: receiving the vibration data collected by the vibration data collector; comparing the vibration data with a predetermined threshold to generate a comparison result; and controlling an operating state of the tester based on the comparison result. This method may timely identify any instability of the tester and prompt for repair if necessary. It substantially reduces the time and material costs associated with a test, and thus reduces the non-chip-attributable defect rate.

Abstract: A method and apparatus for controlling a tester, related medium and electronic device are provided. The apparatus includes a vibration data collector attached on a side wall of the tester to collect vibration data from the tester during operation thereof. The method includes: receiving the vibration data collected by the vibration data collector; comparing the vibration data with a predetermined threshold to generate a comparison result; and controlling an operating state of the tester based on the comparison result. This method may timely identify any instability of the tester and prompt for repair if necessary. It substantially reduces the time and material costs associated with a test, and thus reduces the non-chip-attributable defect rate.