Patents by Inventor Yucai Huang

Yucai Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card
    Patent number: 7847380
    Abstract: Provided are a tape substrate for a smart card, a method of fabricating the same, and a semiconductor module and a smart card using the tape substrate. The tape substrate includes at least one tape unit. The at least one tape unit includes a chip mounting unit defining a region on which a semiconductor chip is to be mounted, a plurality of pin electrode units arranged around the chip mounting unit and separated from one another, a border unit encircling the chip mounting unit and the pin electrode units, and a cutting unit disposed between the chip mounting unit and the border unit and between the pin electrode units and the border unit. The cutting unit includes a plurality of connection lines connecting the chip mounting unit and the pin electrode units to the border unit.
    Type: Grant
    Filed: September 17, 2008
    Date of Patent: December 7, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yucai Huang
  • TAPE SUBSTRATE AND SEMICONDUCTOR MODULE FOR SMART CARD, METHOD OF FABRICATING THE SAME, AND SMART CARD
    Publication number: 20090079053
    Abstract: Provided are a tape substrate for a smart card, a method of fabricating the same, and a semiconductor module and a smart card using the tape substrate. The tape substrate includes at least one tape unit. The at least one tape unit includes a chip mounting unit defining a region on which a semiconductor chip is to be mounted, a plurality of pin electrode units arranged around the chip mounting unit and separated from one another, a border unit encircling the chip mounting unit and the pin electrode units, and a cutting unit disposed between the chip mounting unit and the border unit and between the pin electrode units and the border unit. The cutting unit includes a plurality of connection lines connecting the chip mounting unit and the pin electrode units to the border unit.
    Type: Application
    Filed: September 17, 2008
    Publication date: March 26, 2009
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Yucai HUANG