Patents by Inventor Yuchao BAI

Yuchao BAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D printer based on liquid-solid chemical reaction deposition and operating methods thereof
    Patent number: 11969944
    Abstract: The invention discloses a 3D printer based on liquid-solid chemical reaction deposition and operating methods thereof, comprising a sealed forming chamber, a powder container, a forming container, a powder spreading mechanism, and a three-axis linkage mechanism in the sealed forming chamber. The three-axis linkage mechanism moves a nozzle in the sealed forming chamber according to a movement path planning of a control system of the 3D printer. A liquid supply device is provided outside the sealed forming chamber. The liquid supply device contains a gel-like reactant. The nozzle is a liquid nozzle. The liquid nozzle communicates with the liquid supply device through a following conduit.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: April 30, 2024
    Assignee: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
    Inventors: Yongqiang Yang, Yuchao Bai
  • 3D PRINTER BASED ON LIQUID-SOLID CHEMICAL REACTION DEPOSITION AND OPERATING METHODS THEREOF
    Publication number: 20200353683
    Abstract: The invention discloses a 3D printer based on liquid-solid chemical reaction deposition and operating methods thereof, comprising a sealed forming chamber, a powder container, a forming container, a powder spreading mechanism, and a three-axis linkage mechanism in the sealed forming chamber. The three-axis linkage mechanism moves a nozzle in the sealed forming chamber according to a movement path planning of a control system of the 3D printer. A liquid supply device is provided outside the sealed forming chamber. The liquid supply device contains a gel-like reactant. The nozzle is a liquid nozzle. The liquid nozzle communicates with the liquid supply device through a following conduit.
    Type: Application
    Filed: October 25, 2018
    Publication date: November 12, 2020
    Applicant: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
    Inventors: Yongqiang YANG, Yuchao BAI