Abstract: A method for manufacturing a transparent conductive film, including: 1) providing a conductive scraper including a slurry feeding mouth and a slurry discharging gap; 2) placing a transparent film including a prefabricated groove on a conductive moving table, moving the conductive moving table horizontally in relation to the conductive scraper, controlling the moving speed of the conductive moving table at between 0.1 and 1 m/min, and allowing the conductive slurry to flow out of the conductive scrapper via the slurry discharging gap; 3) applying a voltage between the conductive moving table and the conductive scraper, and driving the conductive slurry flowing out of the conductive scraper to fill the groove of the transparent film by an electrodynamic force produced by the voltage; and 4) curing the conductive slurry filled in the groove of the transparent film.

Abstract: A method for manufacturing an energy harvester including a piezoelectric polymer microstructure array. The method includes: preparing a micro-column array of a piezoelectric polymer on a substrate; supplying a plate electrode as an upper electrode, allowing the substrate and the upper electrode to form a pair of plate electrodes; applying a DC voltage between the pair of the plate electrodes; heating the substrate to a temperature higher than a glass transition temperature of the piezoelectric polymer and performing rheological formation of the micro-column array with the DC voltage still being applied until the column array of the piezoelectric polymer reaches the upper electrode to form a mushroom-shaped structure array; and cooling and solidifying the piezoelectric polymer to obtain the piezoelectric energy harvester.

Abstract: A method for manufacturing an energy harvester including a piezoelectric polymer microstructure array. The method includes: preparing a micro-column array of a piezoelectric polymer on a substrate; supplying a plate electrode as an upper electrode, allowing the substrate and the upper electrode to form a pair of plate electrodes; applying a DC voltage between the pair of the plate electrodes; heating the substrate to a temperature higher than a glass transition temperature of the piezoelectric polymer and performing rheological formation of the micro-column array with the DC voltage still being applied until the column array of the piezoelectric polymer reaches the upper electrode to form a mushroom-shaped structure array; and cooling and solidifying the piezoelectric polymer to obtain the piezoelectric energy harvester.

Abstract: A method for manufacturing a transparent conductive film, including: 1) providing a conductive scraper including a slurry feeding mouth and a slurry discharging gap; 2) placing a transparent film including a prefabricated groove on a conductive moving table, moving the conductive moving table horizontally in relation to the conductive scraper, controlling the moving speed of the conductive moving table at between 0.1 and 1 m/min, and allowing the conductive slurry to flow out of the conductive scrapper via the slurry discharging gap; 3) applying a voltage between the conductive moving table and the conductive scraper, and driving the conductive slurry flowing out of the conductive scraper to fill the groove of the transparent film by an electrodynamic force produced by the voltage; and 4) curing the conductive slurry filled in the groove of the transparent film.

Abstract: The present application relates to a full wafer nanoimprint lithography device comprises a wafer stage, a full wafer coated with a liquid resist, a demolding nozzle, a composite mold, an imprint head, a pressure passageway, a vacuum passageway and a UV light source. The present application also relates to an imprinting method using the full wafer nanoimprint lithography device comprises the following steps: 1) a pretreatment process; 2) an imprinting process; 3) a curing process; and 4) a demolding process. The device and the method can be used for high volume manufacturing photonic crystal LEDs, nano patterned sapphire substrates and the like in large scale patterning on the non-planar surface or substrate.

Abstract: The present application relates to a full wafer nanoimprint lithography device comprises a wafer stage, a full wafer coated with a liquid resist, a demolding nozzle, a composite mold, an imprint head, a pressure passageway, a vacuum passageway and a UV light source. The present application also relates to an imprinting method using the full wafer nanoimprint lithography device comprises the following steps: 1) a pretreatment process; 2) an imprinting process; 3) a curing process; and 4) a demolding process. The device and the method can be used for high volume manufacturing photonic crystal LEDs, nano patterned sapphire substrates and the like in large scale patterning on the non-planar surface or substrate.