Abstract: A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.

Abstract: The disclosed invention presents a self-tracking reference circuit that compensates for IR drops and achieves the target resistance state at different temperatures after write operations. The disclosed self-tracking reference circuit includes a replica access path, a configurable resistor network, a replica selector mini-array and a step current generator that track PVT variations to provide a PVT tracking level for RRAM verify operation.

Abstract: A method includes: obtaining impact values for characteristic conditions; selecting training data subsets respectively from training data sets according to the impact values; obtaining a candidate model and an evaluation value based on the training data subsets; supplementing the training data subsets according to the impact values; obtaining another candidate model and another evaluation value based on training data subsets thus supplemented; repeating the step of supplementing the training data subset, and the step of obtaining another candidate model and another evaluation value based on the training data subsets thus supplemented; and selecting one of the candidate models as a prediction model based on the evaluation values.

Abstract: A waterproof click pad device includes a click pad, a frame and a waterproof unit. The frame surrounds the click pad and surrounds an axis passing through the click pad. The waterproof unit is transverse to the axis and is in sheet form. The waterproof unit includes a frame adhesive member surrounding the axis and adhered to the frame, a first non-adhesive member surrounding the axis, connected to an inner periphery of the frame adhesive member and spaced apart from and located above the frame, a second non-adhesive member surrounding the axis, connected to an inner periphery of the first non-adhesive member and spaced apart from and located above the click pad and the frame, and an plate adhesive member connected to an inner periphery of the second non-adhesive member and adhered to the click pad.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A video processing circuit includes an input buffer, an online adaptation circuit, and an artificial intelligence (AI) super-resolution (SR) circuit. The input buffer receives input low-resolution (LR) frames and high-resolution (HR) frames from a video source over a network. The online adaptation circuit forms training pairs, and calculates an update to representative features that characterize the input LR frames using the training pairs. Each training pair formed by one of the input LR frames and one of the HR frames. The AI SR circuit receives the input LR frames from the input buffer and the representative features from the online adaptation circuit. Concurrently with calculating the update to the representative features, the AI SR circuit generates SR frames for display from the input LR frames based on the representative features. Each SR frame has a higher resolution than a corresponding one of the input LR frames.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: A video processing system includes an input port and a video processing circuit. The input port obtains device information of a display panel. The video processing circuit obtains an input frame and the device information, configures an image enhancement operation according to the device information, generates an output frame by performing the image enhancement operation upon the input frame, and transmits the output frame to the display panel for video playback.

Abstract: An image processing circuit stores a training database and models in memory. The image processing circuit includes an attribute identification engine to identify an attribute from an input image according to a model stored in the memory. By enhancing the input image based on the identified attribute, a picture quality (PQ) engine in the image processing circuit generates an output image for display. The image processing circuit further includes a data collection module to generate a labeled image based on the input image labeled with the identified attribute, and to add the labeled image to the training database. A training engine in the image processing circuit then re-trains the model using the training database.

Abstract: An image processing circuit performs super-resolution (SR) operations. The image processing circuit includes memory to store multiple parameter sets of multiple artificial intelligent (AI) models. The image processing circuit further includes an image guidance module, a parameter decision module, and an SR engine. The image guidance module operates to detect a representative feature in an image sequence including a current frame and past frames within a time window. The parameter decision module operates to adjust parameters of one or more AI models based on a measurement of the representative feature. The SR engine operates to process the current frame using the one or more AI models with the adjusted parameters to thereby generate a high-resolution image for display.

Abstract: A video processing circuit includes an input buffer, an online adaptation circuit, and an artificial intelligence (AI) super-resolution (SR) circuit. The input buffer receives input low-resolution (LR) frames and high-resolution (HR) frames from a video source over a network. The online adaptation circuit forms training pairs, and calculates an update to representative features that characterize the input LR frames using the training pairs. Each training pair formed by one of the input LR frames and one of the HR frames. The AI SR circuit receives the input LR frames from the input buffer and the representative features from the online adaptation circuit. Concurrently with calculating the update to the representative features, the AI SR circuit generates SR frames for display from the input LR frames based on the representative features. Each SR frame has a higher resolution than a corresponding one of the input LR frames.

Abstract: An image processing apparatus includes a super-resolution (SR) circuit and a resizer circuit. The SR circuit performs an SR operation upon a first image to generate a second image, wherein a resolution of the second image is not lower than a resolution of the first image, and the SR operation is based, at least in part, on one or more artificial intelligence (AI) models. The resizer circuit performs a resize operation upon the second image to generate a third image, wherein a resolution of the third image is not lower than the resolution of the second image, and no AI model is involved in the resize operation.

Abstract: Provided is a liposomal sustained-release composition for use in treatment of pulmonary disease. The liposomal sustained release composition comprises a liposome that includes a polyethylene glycol (PEG)-modified lipid and encapsulates a tyrosine kinase inhibitor. Tyrosine kinase inhibitor is stably entrapped in the liposome, and the resulting liposomal drug formulation can be aerosolized or nebulized for administration via inhalation. This aerosolized liposomal drug formulation yields consistent pharmacokinetic and pharmacodynamic profiles while achieving desired efficacy and safety.

Abstract: A gel-state electrolyte and a fabricating method thereof, and a lithium battery are described. The fabricating method of the gel-state electrolyte has steps of: adding a polyacrylonitrile type material and a polyalcohol type material to a liquid electrolyte to form a mixture, wherein the liquid electrolyte comprises a lithium salt; performing a crosslinking reaction by heating the mixture to between 70 and 80° C. for more than 4 hours, so as to form a transparent solution; and cooling the transparent solution to form the gel-state electrolyte. The fabricating method has a simple production process.

Abstract: A video processing system includes an input port and a video processing circuit. The input port obtains device information of a display panel. The video processing circuit obtains an input frame and the device information, configures an image enhancement operation according to the device information, generates an output frame by performing the image enhancement operation upon the input frame, and transmits the output frame to the display panel for video playback.