Patents by Inventor Yuchun DENG

Yuchun DENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230178877
    Abstract: A printed-circuit board assembly (PCBA), a radio unit, and a base station. The PCBA comprises a printed circuit board and a plurality of electronic devices disposed on the printed circuit board. The PCBA further comprises a dielectric layer and a conductive layer that cover the electronic devices to shield the plurality of electronic devices, wherein the dielectric layer is arranged between the electronic devices and the conductive layer. According to the disclosure, the dielectric layer and conductive layer disposed on one side of the printed circuit board can shield the electronic devices, which makes it unnecessary to provide a shielding cover made of metal, thus decreasing the weight and volume of the PCBA and reducing the cost. Moreover, the PCBA is easy to manufacture, as the dielectric layer and the conductive layer can be bonded to the printed circuit board through a known process such as vacuum thermoforming.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 8, 2023
    Inventors: Yuchun Deng, Qingxue Xu, Chenglong Yin, Deyu Liu
  • Patent number: 11107665
    Abstract: The present disclosure provides a feeding structure, an upper electrode assembly, and a physical vapor deposition chamber and device. In the present disclosure a RF power is fed through the center of a first introduction member of the feeding structure and is evenly distributed onto a target by a plurality of distribution members.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: August 31, 2021
    Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
    Inventors: Yuchun Deng, Chao Zhang, Peng Chen, Guoqing Qiu, Mengxin Zhao
  • Publication number: 20210263648
    Abstract: A storage array includes a memory and a physical disk, and a plurality of logical disks are created on the physical disk. Each logical disk corresponds to a setting ratio which a preset ratio of a loaded portion of metadata of the logical disk that is loaded into the memory to all the metadata of the logical disk. When metadata about to-be-manipulated data in a manipulated logical disk of the plurality of logical disks is to be written into the memory, the disk array determines whether a current ratio of a loaded portion of metadata of the manipulated logical disk that is loaded into the memory to all the metadata of the manipulated logical disk reaches a setting ratio corresponding to the manipulated logical disk. When the current ratio reaches the setting ratio, the disk array evicts a part of the metadata of the manipulated logical disk in the memory, and stores the metadata about the to-be-manipulated data to the memory.
    Type: Application
    Filed: May 12, 2021
    Publication date: August 26, 2021
    Inventors: Yuchun DENG, Yumin DU
  • Patent number: 10886142
    Abstract: A method includes maintaining a pressure in the process chamber at a threshold before and after a wafer is transferred into the process chamber and during the annealing process of the wafer. Not only the temperature fluctuation caused by the turbulent flow of the gas during the annealing process of the wafer can be avoided, but also the time for the temperature in the chamber to recover and stabilize can be shortened, thereby improving the equipment productivity.
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: January 5, 2021
    Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
    Inventors: Zhimin Bai, Qiang Li, Bin Deng, Yuchun Deng, Hougong Wang, Peijun Ding
  • Publication number: 20200135438
    Abstract: The present disclosure provides a feeding structure, an upper electrode assembly, and a physical vapor deposition chamber and device. In the present disclosure a RF power is fed through the center of a first introduction member of the feeding structure and is evenly distributed onto a target by a plurality of distribution members.
    Type: Application
    Filed: December 23, 2019
    Publication date: April 30, 2020
    Inventors: Yuchun DENG, Chao ZHANG, Peng CHEN, Guoqing QIU, Mengxin ZHAO
  • Publication number: 20190259628
    Abstract: A method includes maintaining a pressure in the process chamber at a threshold before and after a wafer is transferred into the process chamber and during the annealing process of the wafer. Not only the temperature fluctuation caused by the turbulent flow of the gas during the annealing process of the wafer can be avoided, but also the time for the temperature in the chamber to recover and stabilize can be shortened, thereby improving the equipment productivity.
    Type: Application
    Filed: May 1, 2019
    Publication date: August 22, 2019
    Inventors: Zhimin BAI, Qiang LI, Bin DENG, Yuchun DENG, Hougong WANG, Peijun DING