Abstract: A photonic integrated circuit structure includes a semiconductor substrate. A waveguide is disposed above the semiconductor substrate and has an inclined plane. A mirror coating layer is conformally disposed on the inclined plane. A cladding layer covers the waveguide and the mirror coating layer. A hole is disposed in the semiconductor substrate or the cladding layer, and the hole overlaps the inclined plane in a vertical direction. In addition, an optical fiber is disposed in the hole to receive a reflected light from the mirror coating layer.

Abstract: A memory device is provided, including a memory array, a driver circuit, and recover circuit. The memory array includes multiple memory cells. Each memory cell is coupled to a control line, a data line, and a source line and, during a normal operation, is configured to receive first and second voltage signals. The driver circuit is configured to output at least one of the first voltage signal or the second voltage signal to the memory cells. The recover circuit is configured to output, during a recover operation, a third voltage signal, through the driver circuit to at least one of the memory cells. The third voltage signal is configured to have a first voltage level that is higher than a highest level of the first voltage signal or the second voltage signal, or lower than a lowest level of the first voltage signal or the second voltage signal.

Abstract: A bonding apparatus with a bonding head having vacuum channels and switchable channels, and the method of forming the same are provided. The bonding apparatus may include a vacuum pump, a blower, a controller communicatively coupled to the vacuum pump and the blower, and a bonding head. The bonding head may include a main body, a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump, and a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.

Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed over a substrate. A film is formed over the underlying structure. Surface topography of the film is measured and the surface topography is stored as topography data. A local etching is performed by using directional etching and scanning the substrate so that an entire surface of the film is subjected to the directional etching. A plasma beam intensity of the directional etching is adjusted according to the topography data.

Abstract: Disclosed is an intuitive electric lifting device for woodworking trimming machine, which includes an assembly base, a plurality of guide support rods, a driving motor, a screw and an intuitive control interface, wherein the intuitive control interface is electrically connected to the driving motor through a signal line. The intuitive control interface includes a casing, a display touch interface and a rotary-push button. The rotary-push button is arranged on one side of the display touch interface, protruding from the control side. The values are adjusted when the rotary-push button is rotated, and the action is executed or canceled when it is pressed. A mode status display box is provided, which specifically displays the adjusted values according to the selected control mode of the display touch interface and the rotation information of the rotary-push button in the control mode.

Abstract: A die bonding tool includes a bond head having a moveable component. The moveable component may be moveable between an extended position in which a lower surface of the moveable component protrudes below a lower surface of the bond head and a retracted position in which the lower surface of the moveable component does not protrude below the lower surface of the bond head. The moveable component may be used to control a shape of a semiconductor die secured to the lower surface of the bond head during a process of bonding the semiconductor die to a substrate. Accordingly, void areas and other bonding defects may be avoided and the bond formed between the semiconductor die and the target substrate may be improved.

Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.

Abstract: An optical member driving mechanism for connecting an optical member is provided, including a fixed portion and a first adhesive member. The fixed portion includes a first member and a second member, wherein the first member is fixedly connected to the second member via the first adhesive member.

Abstract: The present disclosure provides a semiconductor device with a plurality of semiconductor channel layers. The semiconductor channel layers include a first semiconductor layer and a second semiconductor layer disposed over the first semiconductor layer. A strain in the second semiconductor layer is different from a strain in the first semiconductor layer. A gate is disposed over the plurality of semiconductor channel layers.

Abstract: A method for eliminating divot formation includes forming an isolation layer; forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary; etching back the isolation layer; and etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.

Abstract: A power supply abutting device and the executed control method thereof. The power supply abutting device is used for connecting a woodworking cutting machine and a dust collector, and it controls the dust collector in combination with the woodworking cutting machine. The device includes a sensor and a controller, wherein the sensor is used for sensing the current of the power supplied from a first power source to the woodworking cutting machine, the controller judges whether the first power source supplies working current to the woodworking cutting machine based on the current, and controls the dust collector to start or stop operation in combination with the woodworking cutting machine without manual judgment and operation, and the sensor and the controller transmit signals in wireless mode.

Abstract: A method, computer system, and a computer program product for processing digital content is provided. The present invention may include building a sensitive sentence classification model. The present invention may include receiving a digital content, wherein the digital content is intended for one or more groups of content consumers. The present invention may include processing the digital content using the sensitive sentence classification model. The present invention may include generating a consumer specific digital content for each of the one or more groups of content consumers.

Abstract: Disclosed is a methods and apparatus which can improve defect tolerability of a hardware-based neural network. In one embodiment, a method for performing a calculation of values on first neurons of a first layer in a neural network, includes: receiving a first pattern of a memory cell array; determining a second pattern of the memory cell array according to a third pattern; determining at least one pair of columns of the memory cell array according to the first pattern and the second pattern; switching input data of two columns of each of the at least one pair of columns of the memory cell array; and switching output data of the two columns in each of the at least one pair of columns of the memory cell array so as to determine the values on the first neurons of the first layer.

Abstract: A round bar cutting device includes a tool rest that is penetrated by a perforation for a round bar to pass through in axial direction. A virtual axis is defined to pass through the radial center of the perforation in the extension direction of the perforation. Four planer tools protrude from the tool rest. The planer tools are spaced apart around the axis as the center. A first edge is formed on one side of the planer tools towards the axis respectively, so as to cut a square bar which moves towards the perforation among the planer tools and rotates round the axis to form the round bar. The cutting device can fully cut the entire section of the square bar in the axial direction into the round bar, and the material utilization efficiency of the square bar is increased.

Abstract: A workpiece guiding device having a base, a supporting component and a limiting component, wherein the base is formed with a loading surface to load the workpiece. The loading surface is formed with a first long slot facing downward. A supporting component is movably configured on the loading surface. The bottom of the supporting component is formed with a second long slot facing upward. The first and second long slots are opposite each other in the vertical direction, forming a long first space. The limiting component is removably configured in the first space. The radial periphery of the limiting component enters the long slots. One side of the supporting component is defined as a supporting side, which is used to receive the lateral pressing by the workpiece. The workpiece guiding device enhances the convenience in adjusting the position of the supporting component at a regularly used tooling angle.

Abstract: The present disclosure is generally related to semiconductor devices, and more particularly to field-effect transistors (FETs). A substrate includes fin-like protruding portions in which source/drain regions are formed on the fin-like protruding portions of the substrate. The source/drain regions are laterally adjacent and electrically coupled to the nanostructure channels. A dielectric material is partially filling spaces between the fin-like protruding portions and partially are coupled to the source/drain regions. A barrier layer is on the dielectric material and covers portions of the source/drain regions. A source/drain contact is formed in the barrier layer and is partially in contact with the source/drain regions. The barrier layer and the dielectric material that formed below the MD contact in spaces between the source/drain regions result in a reduction of parasitic capacitance of the metal contacts such as gate-drain capacitance (Cgd).

Abstract: A braking mechanism of a wheeled device is provided, including: a main body, configured to be connected to the wheeled device including at least one wheel; an adjusting member, disposed on the main body and including a rod and a first abutting member adjustably positioned on the rod; a braking member, movably disposed on the main body; and an elastic member, abutted between the first abutting member and the braking member so that the braking member is biased by the force of the elastic member toward the at least one wheel to frictionally contact the at least one wheel.

Abstract: A mortise and tenon joint tooling guide includes a base seat, two templates, an adjusting plate and a clamping structure. The base seat has a platform and an opening through the platform. Each of the templates can be arranged on the platform at intervals in a movable form. Each of the templates is formed with a guiding edge on one side. The guiding edges face each other and are used to guide the machining tool going through the opening to process a workpiece to form a mortise or tenon. The adjusting plate is configured on the base seat, capable of moving back and forth, and is used to abut against the workpiece, and to correct the distance between the template and the surface. The clamping structure is configured on the base seat, and is used to clamp the workpiece, so as to relatively position the platform and the workpiece.