Patents by Inventor Yu-Chun Liu
Yu-Chun Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250117642Abstract: Disclosed is a methods and apparatus which can improve defect tolerability of a hardware-based neural network. In one embodiment, a method for performing a calculation of values on first neurons of a first layer in a neural network, includes: receiving a first pattern of a memory cell array; determining a second pattern of the memory cell array according to a third pattern; determining at least one pair of columns of the memory cell array according to the first pattern and the second pattern; switching input data of two columns of each of the at least one pair of columns of the memory cell array; and switching output data of the two columns in each of the at least one pair of columns of the memory cell array so as to determine the values on the first neurons of the first layer.Type: ApplicationFiled: December 16, 2024Publication date: April 10, 2025Inventors: Win-San KHWA, Yu-Der CHIH, Yi-Chun SHIH, Chien-Yin LIU
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Patent number: 12271654Abstract: An audio dose monitoring circuit includes: a sound level measuring circuit arranged to operably generate multiple sound level values, wherein the multiple sound level values respectively correspond to the sound levels generated by an audio playback device at multiple time points or the sound levels received by a microphone at multiple time points; an audio dose calculating circuit coupled with the sound level measuring circuit and arranged to operably generate an audio dose value corresponding to a measuring period based on the multiple sound level values and contents of a weighting table; a control circuit coupled with the audio dose calculating circuit and arranged to operably compare the audio dose value with a dose threshold to determine whether to generate a control signal or not; and an indication signal generating circuit coupled with the control circuit and arranged to operably generate a corresponding indication signal according to the control signal.Type: GrantFiled: March 10, 2022Date of Patent: April 8, 2025Assignee: REALTEK SEMICONDUCTOR CORP.Inventors: Yu Wei Liu, Chi Wu, Chia Chun Hung
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Publication number: 20250110662Abstract: A computer vision processing system is provided. The system includes one or more target devices and a processing unit. The target devices are configured to run the executable code of an image processing pipeline. The processing unit is configured to receive a series of application programming interface (API) calls and create a raw graph accordingly, redraw the raw graph into a compilable graph by sequentially processing each node, and compile the compilable graph into the executable code of the image processing pipeline. The series of API calls includes at least one tiling API call to set at least one of the nodes and at least one of the data objects as tileable. Each tileable node corresponds to multiple parallel processing nodes in multiple branches in the compilable graph, and each tileable data object corresponds to multiple tile data objects in the branches in the compilable graph.Type: ApplicationFiled: September 20, 2024Publication date: April 3, 2025Inventors: Po-Yuan JENG, Hung-Chun LIU, Yu-Chieh LIN, Chien-Han SU, Yung-Chih CHIU, Lei CHEN
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Patent number: 12251850Abstract: A mortise and tenon joint tooling guide includes a base seat, two templates, an adjusting plate and a clamping structure. The base seat has a platform and an opening through the platform. Each of the templates can be arranged on the platform at intervals in a movable form. Each of the templates is formed with a guiding edge on one side. The guiding edges face each other and are used to guide the machining tool going through the opening to process a workpiece to form a mortise or tenon. The adjusting plate is configured on the base seat, capable of moving back and forth, and is used to abut against the workpiece, and to correct the distance between the template and the surface. The clamping structure is configured on the base seat, and is used to clamp the workpiece, so as to relatively position the platform and the workpiece.Type: GrantFiled: July 11, 2022Date of Patent: March 18, 2025Inventor: Yu-Chun Liu
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Patent number: 12255374Abstract: A frequency selective coupler configured as a harmonic rejection filter includes an electromagnetic element configured to electromagnetically couple to a signal path between an output of a power amplifier and an antenna, an impedance network coupled between an isolated port of the coupler and ground, the impedance network configured to provide a harmonic filter response, and an electrically unconnected coupled port connected to the electromagnetic element.Type: GrantFiled: February 25, 2022Date of Patent: March 18, 2025Assignee: QUALCOMM IncorporatedInventors: Yu-Chun Liu, Xiaomin Yang, Arjun Ravindran
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Publication number: 20250081964Abstract: Present invention teaches the method of using a keratin hydrolysis peptide (“KHP”) solution to accelerate the ripening and color change of the coffee fruits, to increase the reducing sugar content, and to decrease the chlorogenic acid content in coffee beans. By selectively choosing specific weights of feathers and water, and treating the mixture, though one embodiment does not have water mixed in, to a high-temperature high-pressure hydrolysis process, the resulting solution is confirmed to contain at least 253 peptides and then applied to the leaf surface of coffee plants at different growth stages. Optionally, the KHP solution can be diluted by water, as taught in the specification, before applying to the leaf surface of the coffee plants.Type: ApplicationFiled: December 11, 2023Publication date: March 13, 2025Applicant: CH Biotech R&D Co., Ltd.Inventors: Iou-Zen CHEN, Chuan LEE, Pei-Chun LIAO, Yu-Yi WU, Feng-Ju HO, Tsai-Yu YANG, Cyun-Jhe YAN, Yu-Lun LIU
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Publication number: 20250076580Abstract: A photonic integrated circuit structure includes a semiconductor substrate. A waveguide is disposed above the semiconductor substrate and has an inclined plane. A mirror coating layer is conformally disposed on the inclined plane. A cladding layer covers the waveguide and the mirror coating layer. A hole is disposed in the semiconductor substrate or the cladding layer, and the hole overlaps the inclined plane in a vertical direction. In addition, an optical fiber is disposed in the hole to receive a reflected light from the mirror coating layer.Type: ApplicationFiled: August 31, 2023Publication date: March 6, 2025Applicant: Vanguard International Semiconductor CorporationInventors: Ming-Cheng Lo, Jui-Chun Chang, Shih-Chang Huang, Wu-Hsi Lu, Yu-Che Tsai, Shih-Hao Liu, Yen-Shih Ho
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Patent number: 12243589Abstract: A memory device is provided, including a memory array, a driver circuit, and recover circuit. The memory array includes multiple memory cells. Each memory cell is coupled to a control line, a data line, and a source line and, during a normal operation, is configured to receive first and second voltage signals. The driver circuit is configured to output at least one of the first voltage signal or the second voltage signal to the memory cells. The recover circuit is configured to output, during a recover operation, a third voltage signal, through the driver circuit to at least one of the memory cells. The third voltage signal is configured to have a first voltage level that is higher than a highest level of the first voltage signal or the second voltage signal, or lower than a lowest level of the first voltage signal or the second voltage signal.Type: GrantFiled: August 30, 2022Date of Patent: March 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Pei-Chun Liao, Yu-Kai Chang, Yi-Ching Liu, Yu-Ming Lin, Yih Wang, Chieh Lee
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Publication number: 20250062274Abstract: A bonding apparatus with a bonding head having vacuum channels and switchable channels, and the method of forming the same are provided. The bonding apparatus may include a vacuum pump, a blower, a controller communicatively coupled to the vacuum pump and the blower, and a bonding head. The bonding head may include a main body, a first vacuum channel in the main body, wherein the first vacuum channel is connected to the vacuum pump, and a first switchable channel in the main body, wherein the first switchable channel is connected to the vacuum pump and the blower.Type: ApplicationFiled: August 18, 2023Publication date: February 20, 2025Inventors: Jen-Hao Liu, Amram Eitan, Chih-Yuan Chiu, Chi-Chun Peng, Yu-Hong Du
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Patent number: 12230507Abstract: In a method of manufacturing a semiconductor device, an underlying structure is formed over a substrate. A film is formed over the underlying structure. Surface topography of the film is measured and the surface topography is stored as topography data. A local etching is performed by using directional etching and scanning the substrate so that an entire surface of the film is subjected to the directional etching. A plasma beam intensity of the directional etching is adjusted according to the topography data.Type: GrantFiled: April 25, 2023Date of Patent: February 18, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ya-Wen Yeh, Yu-Tien Shen, Shih-Chun Huang, Po-Chin Chang, Wei-Liang Lin, Yung-Sung Yen, Wei-Hao Wu, Li-Te Lin, Pinyen Lin, Ru-Gun Liu
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Publication number: 20250050529Abstract: Disclosed is an intuitive electric lifting device for woodworking trimming machine, which includes an assembly base, a plurality of guide support rods, a driving motor, a screw and an intuitive control interface, wherein the intuitive control interface is electrically connected to the driving motor through a signal line. The intuitive control interface includes a casing, a display touch interface and a rotary-push button. The rotary-push button is arranged on one side of the display touch interface, protruding from the control side. The values are adjusted when the rotary-push button is rotated, and the action is executed or canceled when it is pressed. A mode status display box is provided, which specifically displays the adjusted values according to the selected control mode of the display touch interface and the rotation information of the rotary-push button in the control mode.Type: ApplicationFiled: August 9, 2023Publication date: February 13, 2025Inventor: Yu-Chun LIU
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Publication number: 20250054786Abstract: A die bonding tool includes a bond head having a moveable component. The moveable component may be moveable between an extended position in which a lower surface of the moveable component protrudes below a lower surface of the bond head and a retracted position in which the lower surface of the moveable component does not protrude below the lower surface of the bond head. The moveable component may be used to control a shape of a semiconductor die secured to the lower surface of the bond head during a process of bonding the semiconductor die to a substrate. Accordingly, void areas and other bonding defects may be avoided and the bond formed between the semiconductor die and the target substrate may be improved.Type: ApplicationFiled: August 7, 2023Publication date: February 13, 2025Inventors: Chih-Yuan Chiu, Chi-Chun Peng, Yu-Hong Du, Hui-Ting Lin, Jen-Hao Liu, Amram Eitan
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Patent number: 12224359Abstract: A sensor package structure includes a substrate, a sensor chip and a ring-shaped solder mask frame those are disposed on the substrate, a ring-shaped support disposed on a top side of the annular solder mask frame, and a light permeable member that is disposed on the ring-shaped support. The sensor chip is electrically coupled to the substrate. A top surface of the sensor chip has a sensing region, and the sensing region is spaced apart from an outer lateral side of the sensor chip by a distance less than 300 ?m. The ring-shaped solder mask frame surrounds and contacts the outer lateral side of the sensor chip. The light permeable member, the ring-shaped support, and the sensor chip jointly define an enclosed space.Type: GrantFiled: February 16, 2023Date of Patent: February 11, 2025Assignee: TONG HSING ELECTRONIC INDUSTRIES, LTD.Inventors: Fu-Chou Liu, Jui-Hung Hsu, Yu-Chiang Peng, Chien-Chen Lee, Ya-Han Chang, Li-Chun Hung
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Patent number: 12216326Abstract: An optical member driving mechanism for connecting an optical member is provided, including a fixed portion and a first adhesive member. The fixed portion includes a first member and a second member, wherein the first member is fixedly connected to the second member via the first adhesive member.Type: GrantFiled: March 26, 2021Date of Patent: February 4, 2025Assignee: TDK TAIWAN CORP.Inventors: Hsiang-Chin Lin, Shou-Jen Liu, Guan-Bo Wang, Kai-Po Fan, Chan-Jung Hsu, Shao-Chung Chang, Shih-Wei Hung, Ming-Chun Hsieh, Wei-Pin Chin, Sheng-Zong Chen, Yu-Huai Liao, Sin-Hong Lin, Wei-Jhe Shen, Tzu-Yu Chang, Kun-Shih Lin, Che-Hsiang Chiu, Sin-Jhong Song
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Patent number: 12211906Abstract: A method for eliminating divot formation includes forming an isolation layer; forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary; etching back the isolation layer; and etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.Type: GrantFiled: May 3, 2023Date of Patent: January 28, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Wen Tseng, Po-Wei Liu, Hung-Ling Shih, Tsung-Yu Yang, Tsung-Hua Yang, Yu-Chun Chang
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Patent number: 12211897Abstract: The present disclosure provides a semiconductor device with a plurality of semiconductor channel layers. The semiconductor channel layers include a first semiconductor layer and a second semiconductor layer disposed over the first semiconductor layer. A strain in the second semiconductor layer is different from a strain in the first semiconductor layer. A gate is disposed over the plurality of semiconductor channel layers.Type: GrantFiled: July 31, 2023Date of Patent: January 28, 2025Assignees: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., NATIONAL TAIWAN UNIVERSITYInventors: Chung-En Tsai, Chia-Che Chung, Chee-Wee Liu, Fang-Liang Lu, Yu-Shiang Huang, Hung-Yu Yeh, Chien-Te Tu, Yi-Chun Liu
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Publication number: 20250028847Abstract: A method, computer system, and a computer program product for processing digital content is provided. The present invention may include building a sensitive sentence classification model. The present invention may include receiving a digital content, wherein the digital content is intended for one or more groups of content consumers. The present invention may include processing the digital content using the sensitive sentence classification model. The present invention may include generating a consumer specific digital content for each of the one or more groups of content consumers.Type: ApplicationFiled: July 19, 2023Publication date: January 23, 2025Inventors: Yu-Siang Chen, Ching-Chun Liu, JOEY H.Y. TSENG, Amanda PL Yang
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Publication number: 20250025952Abstract: A power supply abutting device and the executed control method thereof. The power supply abutting device is used for connecting a woodworking cutting machine and a dust collector, and it controls the dust collector in combination with the woodworking cutting machine. The device includes a sensor and a controller, wherein the sensor is used for sensing the current of the power supplied from a first power source to the woodworking cutting machine, the controller judges whether the first power source supplies working current to the woodworking cutting machine based on the current, and controls the dust collector to start or stop operation in combination with the woodworking cutting machine without manual judgment and operation, and the sensor and the controller transmit signals in wireless mode.Type: ApplicationFiled: July 17, 2023Publication date: January 23, 2025Inventor: Yu-Chun LIU
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Patent number: 12205017Abstract: Disclosed is a methods and apparatus which can improve defect tolerability of a hardware-based neural network. In one embodiment, a method for performing a calculation of values on first neurons of a first layer in a neural network, includes: receiving a first pattern of a memory cell array; determining a second pattern of the memory cell array according to a third pattern; determining at least one pair of columns of the memory cell array according to the first pattern and the second pattern; switching input data of two columns of each of the at least one pair of columns of the memory cell array; and switching output data of the two columns in each of the at least one pair of columns of the memory cell array so as to determine the values on the first neurons of the first layer.Type: GrantFiled: August 8, 2023Date of Patent: January 21, 2025Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Win-San Khwa, Yu-Der Chih, Yi-Chun Shih, Chien-Yin Liu
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Publication number: 20240383168Abstract: A round bar cutting device includes a tool rest that is penetrated by a perforation for a round bar to pass through in axial direction. A virtual axis is defined to pass through the radial center of the perforation in the extension direction of the perforation. Four planer tools protrude from the tool rest. The planer tools are spaced apart around the axis as the center. A first edge is formed on one side of the planer tools towards the axis respectively, so as to cut a square bar which moves towards the perforation among the planer tools and rotates round the axis to form the round bar. The cutting device can fully cut the entire section of the square bar in the axial direction into the round bar, and the material utilization efficiency of the square bar is increased.Type: ApplicationFiled: May 15, 2023Publication date: November 21, 2024Inventor: Yu-Chun LIU