Abstract: The disclosure describes a screen window liquid metal pad disposed between two opposing elements of an electronic device so as to provide a thermal pathway for an efficient heat transfer from one element to the other, comprising: a screen window and a liquid metal, wherein the screen window includes a frame with a window and a thermal conductive mesh; wherein the frame includes a top piece and a bottom piece, a peripheral portion of the thermal conductive mesh is fixed between the top and bottom pieces through an adhesive and the remaining portion forms a window screen covering the window of the frame; and wherein the liquid metal fills in and covers at least part of a middle portion of the window screen.

Abstract: The disclosure describes a structural thermal interface pad between two opposing elements such as a flip chip and a heatsink of an electronic device to provide a thermal pathway for heat transfer from one to the other, comprising: a structural sheet and a filling material, wherein the structural sheet includes a first structure and a second structure, the first structure is an array of small holes, the second structure is an array of convex and/or concave bowls, and the filling material fills in a space of the structural sheet, covering at least a portion of the structural sheet. The disclosure also describes a structural thermal interface pad, comprising: a structural pillow and a filling material, wherein the structural pillow includes three layers of sheets, where the two outer sheets form an envelope, enclosing the middle sheet inside, and the middle sheet includes a first structure and a second structure.

Abstract: The present disclosure describes an electronic device with a direct vapor chamber, wherein the direct vapor chamber includes a heat generating element, like a flip chip of the electronic device, as a portion of it so that a conventional TIM is avoided when using a conventional vapor chamber. The electronic device, comprising: a flip chip and a direct vapor chamber which includes an upper part, a lower part, a two-phase heat dissipating structure, and a working liquid. The lower part includes the flip chip as a portion of it, the upper part and the lower part form a closed chamber, the two phase heat dissipating structure is formed inside the closed chamber, and the working liquid works in the two phase heat dissipating structure to directly dissipate a heat from the flip chip to the upper part through a phase change manner.

Abstract: The disclosure describes a 3D (3-dimensional) water block for cooling a heat source of an electronic system such as a semiconductor chip package, comprising: a box with a base plate, a 3D heat exchanger and a circulating liquid; wherein the base plate is attached onto the heat source through a thermal interface material, the 3D heat exchanger includes a heat pipe or vapor chamber structure and a plurality of fin layers, which are attached to the heat pipe or vapor chamber structure so as to form a plurality of channels among them; wherein the heat pipe or vapor chamber structure includes a bottom portion attached to the base plate and a top portion extending upwards from the base plate; and wherein the circulating liquid flows through the plurality of channels for taking away heat from the 3D heat exchanger to an ambient.

Abstract: The disclosure describes a heat-dissipating object allowing for a liquid metal TIM to transfer heat from an electronic device, comprising: a base plate, a storage-tube with a self-sealing plug structure, one or more additional self-sealing plug structures at the base plate, and a sealing ring, wherein the sealing ring is for providing a sealed gap, and the self-sealing plug structures are for filling a liquid metal into the sealed gap and a portion of the storage tube, and then sealing the liquid in them. A heat sink as a heat-dissipating object and a flip chip package as an electronic device are particularly described in details, and a method for filling a liquid into the sealed gap and a portion of the storage tube of the electronic device is also described.

Abstract: The disclosure describes a lidded flip chip package allowing for a thermal interface material (TIM) with fluidity, like a liquid metal, including: a lid, a sealing ring for forming a sealed gap between a flip chip and the lid, a storage tunnel as a reservoir for accepting or releasing a liquid metal from or to the sealed gap, and an injection tunnel for filling a liquid metal into the sealed gap, wherein a self-sealing plug structure is integrated with the storage tunnel and the injection tunnel, the sealed gap is completely filled with a liquid metal, and a portion of the storage tunnel is filled with the same liquid metal and its remaining portion is filled with a gas. The disclosure also describes a method for filling a liquid metal into the lidded flip chip package based on the self-sealing plug structure.

Abstract: The disclosure describes a lid allowing for a thermal interface material with fluidity, like a liquid metal, in a lidded flip chip package, including: a lid, a sealing ring for forming a sealed gap between a flip chip and the lid, a storage tunnel in the lid for accepting or releasing a liquid from or to the sealed gap, a connecting hole connecting the sealed gap with the storage tunnel, an injection hole with a plug, wherein a plug structure is formed at an outer end of the storage tunnel for opening or closing it, a slippery skin is arranged on an inner surface of the storage tunnel for a better flow of a liquid metal in it, the sealed gap is completely filled with a liquid metal, and a portion of the storage tunnel is filled with the same liquid metal and its remaining portion is filled with a gas.

Abstract: The disclosure describes a lidded flip chip package, including a lid with a tray structure, wherein a tray is formed at an upper side of the lid, a heat spreader is mounted in the tray through a sealing ring so as to form a sealed gap between the tray and the heat spreader, another sealing ring is mounted at a lower side of the top piece of the lid so as to form another sealed gap between a flip chip and the lid, through-holes are formed through the tray so as to connect the first sealed gap with the second sealed gap, and a thermal interface material having fluidity is completely filled in the first sealed gap and at least partially filled in the second sealed gap. A lidded flip chip package including a lid with a two-step tray is one preferred embodiment of the present disclosure.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.

Abstract: The disclosure describes a lid allowing for a liquid thermal interface material (TIM) in a lidded flip chip package. The lid includes a reservoir structure so that a liquid system can be formed in the lidded flip chip package, allowing for a liquid TIM in the gap between the lid and the flip chip. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a tunnel for taking in a liquid material and releasing it again from and to the gap according to the change of the gap volume. The lid further includes an injection hole and a plug for filling and removing liquid into or from the gap and reservoir. The lid further includes a plurality of pins, which extrude downwards from the bottom surface of the lid so as to strongly bond with the substrate of the flip chip package through an adhesive.

Abstract: The disclosure describes a lid allowing for a liquid thermal interface material (TIM) in a lidded flip chip package. The lid includes a reservoir structure so that a liquid system can be formed in the lidded flip chip package, allowing for a liquid TIM in the gap between the lid and the flip chip. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a tunnel for taking in a liquid material and releasing it again from and to the gap according to the change of the gap volume. The lid further includes an injection hole and a plug for filling and removing liquid into or from the gap and reservoir. The lid further includes a plurality of pins, which extrude downwards from the bottom surface of the lid so as to strongly bond with the substrate of the flip chip package through an adhesive.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a tube for taking in a liquid material and releasing it again when needed. A heat-dissipating object, including a heat sink, a cold plate and a vapor chamber and an electronic device, including a flip chip package and a lidded flip chip package are particularly described in details of the embodiments of the present invention.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a tube for taking in a liquid material and releasing it again when needed. A heat-dissipating object, including a heat sink, a cold plate and a vapor chamber and an electronic device, including a flip chip package and a lidded flip chip package are particularly described in details of the embodiments of the present invention.

Abstract: The disclosure describes a method for making a hybrid cloth integrated column and further making TSV substrates, which comprises the key processing steps: forming a hybrid cloth by using metal wires and supportive wires, which contains at least one 2D array of parallel metal wires in one direction; forming a column of layered structure, which contains at least a plurality of layers of hybrid cloths, wherein all the 2D arrays of parallel metal wires are fixed in the column of layered structure and are arranged into a 3D array of parallel metal wires; making all the layers of the column of layered structure into a solid entity so as to form a hybrid cloth integrated column; and slicing the hybrid cloth integrated column to make TSV substrates.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.

Abstract: The disclosure describes a heat-dissipating object having a reservoir structure so that a reservoir system can be formed in an electronic device, allowing for a liquid TIM (thermal interface material) in the gap between the heat-dissipating object and the heat-generating object of the electronic device. The reservoir structure comprises a seal ring, a connecting hole and a reservoir which is a space for taking in a liquid material and releasing it again when needed. As a specific case of the heat-dissipating object and the electronic device, a lid having a reservoir structure and a lidded flip chip package based on the lid are particularly described in details of the embodiments of the present invention.

Abstract: The disclosure describes a method for making a hybrid cloth integrated column and further making TSV substrates, which comprises the key processing steps: forming a hybrid cloth by using metal wires and supportive wires, which contains at least one 2D array of parallel metal wires in one direction; forming a column of layered structure, which contains at least a plurality of layers of hybrid cloths, wherein all the 2D arrays of parallel metal wires are fixed in the column of layered structure and are arranged into a 3D array of parallel metal wires; making all the layers of the column of layered structure into a solid entity so as to form a hybrid cloth integrated column; and slicing the hybrid cloth integrated column to make TSV substrates.

Abstract: A microelectronic package comprises at least one substrate and at least one semiconductor die. The substrate includes a multi-region core layer and one or more metal and insulating layers which are stacked on upper and lower sides of the core layer, wherein the core layer includes one or more inner cores with a lower CTE for better matching with the low CTE of semiconductor dies and an outer core with a higher CTE for better matching with the high CTE of PCB on which the package is mounted. Each inner core is positioned at a corresponding die shadow region, and the outer core is positioned outside each die shadow region. The ceramic or glass and organic materials may be respectively selected for the inner and outer cores. The microelectronic package based on the substrate may better meet the reliability requirements on both component and board level.