Patents by Inventor Yudai OGATA

Yudai OGATA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912905
    Abstract: The present invention aims to provide an adhesive tape capable of exhibiting excellent adhesion to rough surfaces. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing an acrylic copolymer, the acrylic copolymer containing 30% by weight or more of a structural unit derived from n-heptyl (meth)acrylate and 0.01% by weight or more and 30% by weight or less of a structural unit derived from 1-methylheptyl (meth)acrylate.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: February 27, 2024
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Aya Adachi, Yudai Ogata, Noriyuki Uchida, Yoshito Arai
  • Publication number: 20230391944
    Abstract: The present invention aims to provide a compound capable of increasing the adhesion strength of adhesive compositions, particularly, even to low polarity adherends. The present invention also aims to provide a method for producing the compound, an adhesive composition containing the compound, and an adhesive tape including an adhesive layer containing the adhesive composition. Provided is a compound including: a structural unit (A) derived from a monomer (a) having a solvation free energy ?? with polytetrafluoroethylene of ?30 kcal/mol or less; and a structural unit (B) derived from at least one monomer (b) selected from the group consisting of a terpene monomer, a vinyl monomer, and a conjugated diene monomer.
    Type: Application
    Filed: August 27, 2021
    Publication date: December 7, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yudai OGATA, Akira SHIMOJITOSHO, Yuitsu SUGAMI
  • Patent number: 11802224
    Abstract: The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.
    Type: Grant
    Filed: March 22, 2022
    Date of Patent: October 31, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Aya Adachi, Yudai Ogata, Noriyuki Uchida, Yoshito Arai
  • Publication number: 20230340307
    Abstract: The present invention aims to provide a compound capable of increasing the adhesion strength of adhesive compositions, particularly, even to low polarity adherends. The present invention also aims to provide a method for producing the compound, an adhesive composition containing the compound, and an adhesive tape including an adhesive layer containing the adhesive composition. Provided is a compound including at least one structural unit (A) selected from the group consisting of a structural unit (A-1) and a structural unit (A-1?) that are represented by the following formulas: wherein each R1 represents a hydrogen atom, an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a polar functional group, an aliphatic hydrocarbon group containing a polar functional group, or an aromatic hydrocarbon group containing a polar functional group; n represents an integer of 2 or greater and 4 or less; and n? represents an integer of 2 or greater and 5 or less.
    Type: Application
    Filed: August 27, 2021
    Publication date: October 26, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Akira SHIMOJITOSHO, Yudai OGATA
  • Publication number: 20230212442
    Abstract: The present invention aims to provide an adhesive tape that is easily peelable while capable of maintaining high adhesion at high temperature. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing: an acrylic copolymer; and 0.
    Type: Application
    Filed: March 22, 2022
    Publication date: July 6, 2023
    Inventors: Aya ADACHI, Yudai OGATA, Noriyuki UCHIDA, Yoshito ARAI
  • Publication number: 20230212441
    Abstract: The present invention aims to provide an adhesive tape capable of exhibiting excellent adhesion to rough surfaces. The present invention also aims to provide a method for fixing an electronic device component or an in-vehicle device component using the adhesive tape and a method for producing an electronic device or an in-vehicle device. Provided is an adhesive tape including an adhesive layer containing an acrylic copolymer, the acrylic copolymer containing 30% by weight or more of a structural unit derived from n-heptyl (meth)acrylate and 0.01% by weight or more and 30% by weight or less of a structural unit derived from 1-methylheptyl (meth)acrylate.
    Type: Application
    Filed: March 22, 2022
    Publication date: July 6, 2023
    Inventors: Aya ADACHI, Yudai OGATA, Noriyuki UCHIDA, Yoshito ARAI
  • Publication number: 20230073854
    Abstract: The present invention aims to provide an adhesive sheet excellent in both shear strength and slurry resistance at high temperature and excellent in removability that enables removal without adhesive residue. The present invention also aims to provide a polishing pad with an adhesive sheet including the adhesive sheet.
    Type: Application
    Filed: February 16, 2021
    Publication date: March 9, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yudai OGATA, Kazuyuki FUKUYAMA, Tatsuya KOGISO
  • Publication number: 20230047920
    Abstract: The present invention aims to provide an adhesive composition that can exhibit excellent adhesion to both smooth surfaces and rough surfaces. The present invention also aims to provide an adhesive tape including an adhesive layer containing the adhesive composition, as well as a method for fixing and a method for producing an electronic device component or an in-vehicle component using the adhesive tape. Provided is an adhesive composition containing an acrylic copolymer containing a structural unit derived from n-heptyl (meth)acrylate.
    Type: Application
    Filed: December 17, 2020
    Publication date: February 16, 2023
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Aya ADACHI, Noriyuki UCHIDA, Shigekazu WATANABE, Yudai OGATA