Abstract: A display module includes a display panel, at least one bonding circuit board, a plurality of chip-on-films, and a plurality of buffer devices. The at least one bonding circuit board each include first differential lines, and a first differential line includes a P-polarity differential sub-line and an N-polarity differential sub-line. An end of a chip-on-film is connected to the first differential line, and the other end of the chip-on-film is connected to the display panel. The buffer devices are arranged on the bonding circuit board, a buffer device is connected to ends, proximate to the chip-on-film, of the P-polarity differential sub-line and the N-polarity differential sub-line, and the buffer device is configured to reduce signal reflection between the first differential line and the chip-on-film.

Abstract: A multichip interconnecting packaging structure includes a glass frame, a first line layer and a second line layer respectively provided on the first surface and the second surface of the glass frame, a first via post penetrating through the glass frame, a cavity penetrating through the glass frame, a chip connecting device embedded in the cavity, a first insulating layer filling the cavity to cover the chip connecting device, and a first chip and a second chip provided on the surface of the first line layer, wherein a terminal of the chip connecting device is connected to the first line layer, the first line layer and the second line layer are in conductive communication through the first via post, the first chip and the second chip are connected to the chip connecting device through the first line layer to interconnect the first chip with the second chip.

Abstract: A multilayer embedded packaging structure according to an embodiment includes a first dielectric layer and a second dielectric layer on the first dielectric layer. The first dielectric layer includes a first wiring layer. The second dielectric layer includes a first copper pillar layer and a device placement port frame penetrating through the second dielectric layer in a height direction, and a second wiring layer on the first copper pillar layer. A second copper pillar layer is on the second wiring layer. The first wiring layer and the second wiring layer are conductively connected via the first copper pillar layer. A first device is mounted to the bottom of the device placement port frame, a second device is mounted to the second dielectric layer, and a third device is mounted to an end of the second copper pillar layer.

Abstract: A temporary carrier plate according to an embodiment of the present disclosure includes a first carrier core layer, a first copper foil layer on the first carrier core layer, a second carrier core layer on the first copper foil layer, and a second copper foil layer on the second carrier core layer, wherein the first copper foil layer includes physically press-fitted first outer-layer copper foil and first inner-layer copper foil, and the second copper foil layer includes physically press-fitted second outer-layer copper foil and second inner-layer copper foil.

Abstract: An image display device includes an aggregate of convex lenses arranged on a surface thereof with a predetermined lens pitch Px in at least one direction Dx (in which x is a suffix representing the direction); and a display unit displaying a plurality of element images on a focus surface of the convex lenses or near the focal plane surface in a manner aligned along the surface to thereby display the element images aligned in the direction Dx with an image pitch wx different from the pitch Px. By using the image display device, a moiré stripe formed by shift in pitches between a plurality of convex lenses and a plurality of element images is stereoscopically displayed as an image or displayed as an image of animation, and the element images are composed of an aggregation of a plurality of parallax or frame component images.