Patents by Inventor Yue-Feng Meng

Yue-Feng Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for making nanoporous copper
    Patent number: 10844508
    Abstract: A method of making a nanoporous copper is provided. A copper alloy layer and at least one active metal layer are provided. The copper alloy layer comprises a first surface and a second surface. The at least one active metal layer is located on the first surface and the second surface to form a structure. The structure is processed to form a composite structure. A process of folding and pressing the composite structure is repeated to form a precursor. The precursor is corroded to form the nanoporous copper.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: November 24, 2020
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yue-Feng Meng, Lun-Qiao Xiong, Yuan-Feng Liu, Ze-Cheng Hou, Hong-Ying Fu, Lin Zhu, Wen-Zhen Li
  • METHOD FOR MAKING NANOPOROUS COPPER
    Publication number: 20190203376
    Abstract: A method of making a nanoporous copper is provided. A copper alloy layer and at least one active metal layer are provided. The copper alloy layer comprises a first surface and a second surface. The at least one active metal layer is located on the first surface and the second surface to form a structure. The structure is processed to form a composite structure. A process of folding and pressing the composite structure is repeated to form a precursor. The precursor is corroded to form the nanoporous copper.
    Type: Application
    Filed: September 21, 2018
    Publication date: July 4, 2019
    Inventors: Yue-Feng Meng, LUN-QIAO XIONG, Yuan-Feng Liu, Ze-Cheng Hou, HONG-YING FU, LIN ZHU, WEN-ZHEN LI