Patents by Inventor Yue Geng
Yue Geng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240113140Abstract: A ridge recognition substrate and a ridge recognition apparatus. The ridge recognition substrate includes: a base substrate including a photosensitive area, and a light-shielding area located on at least one side of the photosensitive area; a plurality of photosensitive devices, arranged in the photosensitive area in an array; each photosensitive device includes a first electrode, a photoelectric conversion structure and a second electrode arranged in layers, the photoelectric conversion structure is electrically connected with the first electrode, and the photoelectric conversion structure directly contacts with the second electrode; and dummy devices, arranged in the light-shielding area in an array, each dummy device including a third electrode, an equivalent dielectric layer and a fourth electrode, the third electrode and the first electrode is in the same layer, the fourth electrode is located at the side of the layer where the second electrode is located facing away from the base substrate.Type: ApplicationFiled: May 26, 2021Publication date: April 4, 2024Inventors: Yajie FENG, Cheng LI, Yue GENG, Kuiyuan WANG, Zhonghuan LI, Yi DAI, Chaoyang QI, Zefei LI, Congcong XI, Xiaoguan LI
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Publication number: 20240075732Abstract: In a peeling system and a peeling method for a flexible fingerprint component provided by the present invention, the flexible fingerprint component is formed on a rigid substrate, and the flexible fingerprint component comprises a flexible substrate, a photosensitive device layer and an optical film sequentially arranged on the flexible substrate, a first chip-on film bonded to the photosensitive device layer on a first side of the optical film, and a second chip-on film bonded to the photosensitive device layer on a second side of the optical film, wherein the optical film is provided with an extension portion beyond the flexible substrate, the second side of the optical film is located on a side opposite to the extension portion, and the first side of the optical film is located on a side adjacent to the extension portion.Type: ApplicationFiled: February 23, 2021Publication date: March 7, 2024Inventors: Yi DAI, Cheng LI, Yue GENG, Kuiyuan WANG, Chaoyang QI, Zefei LI, Yajie FENG, Xiaoguan LI, Zhonghuan LI
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Publication number: 20240071127Abstract: An optical sensor array substrate and an optical fingerprint reader are provided. The optical sensor array substrate includes a substrate including a detection area which includes a plurality of photosensitive pixels. Photosensitive pixel includes: a TFT arranged on the substrate; a storage capacitor arranged on the substrate and having a first capacitor plate, and a second capacitor plate electrically connected to the source or drain of the TFT; a photosensitive element, having one end electrically connected to the second capacitor plate; a first electrode layer electrically connected to another end of the photosensitive element. On the substrate, an orthographic projection of the second capacitor plate at least partially overlaps with that of the first electrode layer, and the first capacitor plate is located in the same layer and has the same material as the gate of the TFT.Type: ApplicationFiled: October 18, 2023Publication date: February 29, 2024Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Zefei Li, Chaoyang Qi, Yi Dai, Xiaoguan Li, Yingzi Wang
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Patent number: 11908226Abstract: A texture recognition device and a manufacturing method thereof are provided. The texture recognition device includes a backlight component and a photosensitive component. The photosensitive component is on a light-outputting side of the backlight component and configured to detect light emitted by the backlight component and reflected by a texture of a detection object to recognize an image of the texture of the detection object. The photosensitive component includes a plurality of photosensitive sensors and an antistatic layer on a side, away from the backlight component, of the plurality of photosensitive sensors, and orthographic projections of the plurality of photosensitive sensors on a plane where the antistatic layer is located are within the antistatic layer.Type: GrantFiled: November 28, 2019Date of Patent: February 20, 2024Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yajie Feng, Cheng Li, Yanna Xue, Xiaozhou Zhan, Yue Geng, Kuiyuan Wang, Haibo Huang, Jingfu Tao
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Patent number: 11865538Abstract: A biological detection chip, a biological detection device, and a detection method thereof are disclosed. The biological detection chip includes a first base substrate and a plurality of detection units arranged in an array along a row direction and a column direction on the first base substrate. Each of the plurality of detection units includes a thin film transistor and an electrode, the thin film transistor is on the first base substrate and includes a gate electrode, a source electrode, and a drain electrode, and the electrode is on a side of the thin film transistor away from the first base substrate and is connected to the drain electrode, and the electrode is configured to carry a biological material to be detected.Type: GrantFiled: March 27, 2019Date of Patent: January 9, 2024Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Wenliang Yao, Nan Zhao, Peizhi Cai, Fengchun Pang, Yue Geng, Le Gu, Yuelei Xiao, Hui Liao, Yingying Zhao, Bolin Fan
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Publication number: 20240005694Abstract: Provided in the present disclosure are a print recognition module and a display apparatus. The print recognition module includes: a base substrate; a driving circuit layer located on one side of the base substrate and including a plurality of driving transistors arranged in an array; a first insulating layer located on the side of the driving circuit layer that is away from the base substrate and including a plurality of first via holes running through the thickness thereof; a connecting electrode layer located on the side of the first insulating layer that is away from the driving circuit layer and including a plurality of connecting electrodes which are in one-to-one correspondence with first electrodes of the driving transistors; and a plurality of photoelectric conversion portions located on the side of the connecting electrode layer that is away from the first insulating layer.Type: ApplicationFiled: May 27, 2021Publication date: January 4, 2024Inventors: Yue GENG, Kuiyuan WANG, Zhonghuan LI, Cheng LI, Yi DAI, Yajie FENG, Chaoyang QI, Zefei LI, Xiaoguan LI, Congcong XI
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Publication number: 20230395625Abstract: A print recognition substrate and a print recognition apparatus. The print recognition substrate includes a base substrate, which includes a data line and a gate line crossing each other; a light shielding structure, located on the base substrate, and including a metal layer, and an orthographic projection of the light shielding structure on the base substrate does not overlap with orthographic projections of the data line and the gate line on the base substrate; a photoelectric conversion structure, located on the side of the light shielding structure away from the base substrate, and an orthographic projection of the photoelectric conversion structure on the base substrate is located in an orthographic projection of the light shielding structure on the base substrate, and a distance between an edge of the photoelectric conversion structure and an edge of the light shielding structure is less than or equal to 3 ?m.Type: ApplicationFiled: June 3, 2021Publication date: December 7, 2023Inventors: Yajie FENG, Cheng LI, Yue GENG, Kuiyuan WANG, Zhonghuan LI, Yi DAI, Chaoyang QI, Zefei LI, Xiaoguan LI, Congcong XI
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Patent number: 11830278Abstract: An optical sensor array substrate and an optical fingerprint reader are provided. The optical sensor array substrate includes a substrate including a detection area which includes a plurality of photosensitive pixels. Photosensitive pixel includes: a TFT arranged on the substrate; a storage capacitor arranged on the substrate and having a first capacitor plate, and a second capacitor plate electrically connected to the source or drain of the TFT; a photosensitive element located on one side of the storage capacitor away from the substrate, and having one end electrically connected to the second capacitor plate; a first electrode layer located on one side of the photosensitive element away from the substrate and electrically connected to another end of the photosensitive element. An orthographic projection of the second capacitor plate on the substrate at least partially overlaps with an orthographic projection of the first electrode layer on the substrate.Type: GrantFiled: November 30, 2020Date of Patent: November 28, 2023Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Zefei Li, Chaoyang Qi, Yi Dai, Xiaoguan Li, Yingzi Wang
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Patent number: 11731125Abstract: A patterning method of a film is disclosed. The method including: providing a film including a first surface; forming n etching barrier layers on the first surface of the film, and n is an integer larger than or equal to 2; and performing n etching processes on the film to form a recessed structure on the first surface using the n etching barrier layers as masks, the recessed structure includes n bottom surfaces respectively having different depths. Two adjacent etching processes of the n etching processes include a previous etching process and a subsequent etching process, and after the previous etching process is completed, a part of the n etching barrier layers is removed to form a mask for the subsequent etching process; a material of the part of the n etching barrier layers which is removed is different from a material of the mask of the subsequent etching process.Type: GrantFiled: January 3, 2019Date of Patent: August 22, 2023Assignees: BEIJING BOE SENSOR TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Yue Geng, Yuelei Xiao, Hui Liao, Peizhi Cai, Jian Li, Shenkang Wu
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Patent number: 11708604Abstract: A gene sequencing substrate and a method for manufacturing the same, and a gene sequencing device are provided. It belongs to the technical field of gene sequencing, and can solve the problem of high cost of the high-throughput sequencing chip in the prior art. The gene sequencing substrate of the present disclosure comprises a plastic material with concave structures as base substrate, and the concave structures serve as reaction cells. Since the base substrate has plasticity, the concave structures can be formed by a simple process to reduce the cost of the gene sequencing substrate. Meanwhile, a first protective layer may be provided on the inner wall of the concave structures for preventing the inner wall of the concave structures from being corroded by the reaction liquid.Type: GrantFiled: December 24, 2018Date of Patent: July 25, 2023Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Peizhi Cai, Fengchun Pang, Yue Geng, Le Gu, Chuncheng Che
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Patent number: 11699772Abstract: Disclosed are an array substrate and a preparation method thereof, and a digital microfluidic chip. The preparation method includes: forming a plurality of photoelectric detection devices on a silicon-based substrate; transferring the photoelectric detection devices to a base substrate by adopting a micro transfer printing process; and forming a plurality of transparent driving electrodes on the base substrate, wherein the transparent driving electrodes are insulated from the photoelectric detection devices.Type: GrantFiled: March 19, 2020Date of Patent: July 11, 2023Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Xue Dong, Yue Geng, Peizhi Cai
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Patent number: 11691147Abstract: A digital microfluidic chip and a digital microfluidic system. The digital microfluidic chip comprises: an upper substrate and a lower substrate arranged opposite to each other; multiple driving circuits and multiple addressing circuits disposed between the lower substrate and the upper substrate; and a control circuit, electrically connected to the driving circuits and the addressing circuits. The control circuit is configured to apply, in a driving stage, a driving voltage to each driving circuit, such that a droplet is controlled to move inside a droplet accommodation space according to a set path, measure, in a detection stage, after a bias voltage is applied to each addressing circuit, a charge loss amount of each addressing circuit, and to determine the position of the droplet according to the charge loss amount. The charge loss amount of each addressing circuit is related to the intensity of received external light.Type: GrantFiled: July 26, 2019Date of Patent: July 4, 2023Assignees: Beijing BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Mingyang Lv, Yue Li, Yanchen Li, Jinyu Li, Dawei Feng, Yu Zhao, Dong Wang, Wang Guo, Hailong Wang, Yue Geng, Peizhi Cai, Fengchun Pang, Le Gu, Chuncheng Che, Haochen Cui, Yingying Zhao, Nan Zhao, Yuelei Xiao, Hui Liao
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Patent number: 11684916Abstract: A chip for polymerase chain reaction, a method of operating a chip for polymerase chain reaction, and a reaction device are provided. The chip includes: a sample adding region, a mixing region, a temperature cycling region in a sequential arrangement, and at least one driving unit group. The at least one driving unit group includes a plurality of driving units and is configured to drive a liquid drop to move and sequentially pass through the sample adding region, the mixing region, and the temperature cycling region.Type: GrantFiled: January 9, 2019Date of Patent: June 27, 2023Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Wenliang Yao, Nan Zhao, Haochen Cui, Peizhi Cai, Fengchun Pang, Yue Geng, Le Gu, Yuelei Xiao, Hui Liao, Yingying Zhao, Chuncheng Che
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Publication number: 20230177866Abstract: An optical sensor array substrate and an optical fingerprint reader are provided. The optical sensor array substrate includes a substrate including a detection area which includes a plurality of photosensitive pixels. Photosensitive pixel includes: a TFT arranged on the substrate; a storage capacitor arranged on the substrate and having a first capacitor plate, and a second capacitor plate electrically connected to the source or drain of the TFT; a photosensitive element located on one side of the storage capacitor away from the substrate, and having one end electrically connected to the second capacitor plate; a first electrode layer located on one side of the photosensitive element away from the substrate and electrically connected to another end of the photosensitive element. An orthographic projection of the second capacitor plate on the substrate at least partially overlaps with an orthographic projection of the first electrode layer on the substrate.Type: ApplicationFiled: November 30, 2020Publication date: June 8, 2023Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Zefei Li, Chaoyang Qi, Yi Dai, Xiaoguan Li, Yingzi Wang
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Publication number: 20230178578Abstract: The re is provided a fingerprint identification module, including a substrate having a fingerprint identification area and a peripheral area; a photoelectric sensing structure in the fingerprint identification area, and including pixel units; each pixel unit includes a thin film transistor having a gate electrode coupled to a corresponding gate line and a first electrode coupIed to a corresponding signal sensing line; the fingerprint identification area includes a photosensitive region, the pixel unit in the photosensitive region further includes a photoelectric sensor including a third electrode, a photosensitive pattern and a fourth electrode which are sequentially stacked along a direction away from the substrate, and the third electrode is coupled to a second electrode of the thin film transistor in the same pixel unit as that where the photoelectric sensor is located; an area ratio of the photoelectric sensor to the pixel unit corresponding thereto ranges from 40% to 90%.Type: ApplicationFiled: November 30, 2020Publication date: June 8, 2023Inventors: Kuiyuan WANG, Cheng LI, Yue GENG, Chaoyang QI, Yi DAI, Zefei LI, Xiaoguan LI, Yajie FENG, Yingzi WANG
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Publication number: 20230149920Abstract: The present disclosure provides a micro-fluidic chip, a method for fabricating the same, and a micro-fluidic device. The micro-fluidic chip includes: an upper substrate and a lower substrate assembled to form a cell with a gap between the upper substrate and the lower substrate, the gap being configured to accommodate a droplet; a driving electrode on an upper substrate side or a lower substrate side, the driving electrode being configured to control the droplet to move in a powered-on state, wherein the micro-fluidic chip further includes a laser source on the upper substrate side or the lower substrate side and configured to provide illumination for detection of the droplet.Type: ApplicationFiled: April 24, 2020Publication date: May 18, 2023Inventors: Yue GENG, Xue DONG
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Patent number: 11583856Abstract: A bio-information detection substrate and a gene chip are provided. The substrate includes a first main surface, the first main surface includes a test region and a dummy region located around the test region, at least one accommodation region is disposed on the first main surface, and the accommodation region is located in the dummy region.Type: GrantFiled: April 2, 2019Date of Patent: February 21, 2023Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.Inventors: Shenkang Wu, Dongsheng Huang, Tingze Dong, Jianxing Shang, Yizhe Li, Yue Geng, Jian Li, Guowei Chen, Hongliang Xu, Kuohai Wang, Chang Dai, Na Wei, Xin Li, Xiao Xin, Chao Sun
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Patent number: 11587966Abstract: A fingerprint acquisition apparatus includes a plurality of photoelectric conversion units and a first shading pattern. The first shading pattern includes at least one first shading block including a first opening, and an orthographic projection of the first opening in the first shading block on the base substrate is within an orthographic projection of a target photoelectric conversion unit corresponding to the first shading block on the base substrate.Type: GrantFiled: August 16, 2021Date of Patent: February 21, 2023Assignees: Beijing BOE Sensor Technology Co., LTD, BOE Technology Group Co., LTD.Inventors: Yajie Feng, Cheng Li, Yue Geng, Kuiyuan Wang, Chaoyang Qi, Yi Dai, Zefei Li
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Patent number: 11577246Abstract: A microfluidic device and a detection method for the microfluidic device are provided. The microfluidic device includes a driving substrate configured to drive a movement of a droplet; and a position detector configured to detect a position of the droplet on the driving substrate.Type: GrantFiled: May 13, 2019Date of Patent: February 14, 2023Assignees: Beijing BOE Sensor Technology Co., Ltd., BOE Technology Group Co., Ltd.Inventors: Le Gu, Peizhi Cai, Fengchun Pang, Yue Geng, Yingying Zhao, Haochen Cui, Yuelei Xiao, Hui Liao, Wenliang Yao, Nan Zhao
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Publication number: 20230025263Abstract: A texture recognition device and a manufacturing method thereof are provided. The texture recognition device includes a backlight component and a photosensitive component. The photosensitive component is on a light-outputting side of the backlight component and configured to detect light emitted by the backlight component and reflected by a texture of a detection object to recognize an image of the texture of the detection object. The photosensitive component includes a plurality of photosensitive sensors and an antistatic layer on a side, away from the backlight component, of the plurality of photosensitive sensors, and orthographic projections of the plurality of photosensitive sensors on a plane where the antistatic layer is located are within the antistatic layer.Type: ApplicationFiled: November 28, 2019Publication date: January 26, 2023Inventors: Yajie FENG, Cheng LI, Yanna XUE, Xiaozhou ZHAN, Yue GENG, Kuiyuan WANG, Haibo HUANG, Jingfu TAO