Patents by Inventor Yue-Guo Lin

Yue-Guo Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240304551
    Abstract: Devices with aluminum structures and methods of fabrication are provided. An exemplary device includes an interconnect structure and an aluminum structure electrically connected to the interconnect structure. The aluminum structure includes a first aluminum layer, a migration barrier layer over the first aluminum layer, and a second aluminum layer over the migration barrier layer.
    Type: Application
    Filed: March 7, 2023
    Publication date: September 12, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Pang Kuo, Sean Yang, Yue-Guo Lin, Tsai Hsi-Chen, Chi-Feng Lin, Hung-Wen Su