Patents by Inventor Yue Seng Fatt

Yue Seng Fatt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Block-Molded Semiconductor Device Singulation Methods and Systems
    Publication number: 20090188359
    Abstract: The invention discloses methods and systems for singulation of block-molded arrays of semiconductor devices. Preferred embodiments include methods and associated systems for securing a block-molded array of semiconductor devices into a mounting ring with light-sensitive tape. Tape-deactivating is used to render exposed regions of the light-sensitive tape less tacky. The mounting ring containing the block-molded array is secured on a cutting table and the array is singulated into individual devices. Aspects of the invention also include the use of tape-deactivating light for making the light-sensitive tape less tacky to facilitate removal of the individual devices after singulation.
    Type: Application
    Filed: April 3, 2009
    Publication date: July 30, 2009
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mohamad Ashraf Bin Mohd ARSHAD, Yue Seng FATT
  • Block-molded semiconductor device singulation methods and systems
    Patent number: 7531432
    Abstract: The invention discloses methods and systems for singulation of block-molded arrays of semiconductor devices. Preferred embodiments include methods and associated systems for securing a block-molded array of semiconductor devices into a mounting ring with light-sensitive tape. Tape-deactivating is used to render exposed regions of the light-sensitive tape less tacky. The mounting ring containing the block-molded array is secured on a cutting table and the array is singulated into individual devices. Aspects of the invention also include the use of tape-deactivating light for making the light-sensitive tape less tacky to facilitate removal of the individual devices after singulation.
    Type: Grant
    Filed: February 14, 2007
    Date of Patent: May 12, 2009
    Assignee: Texas Instruments Incorporated
    Inventors: Mohamad Ashraf Bin Mohd Arshad, Yue Seng Fatt
  • Block-Molded Semiconductor Device Singulation Methods and Systems
    Publication number: 20080194081
    Abstract: The invention discloses methods and systems for singulation of block-molded arrays of semiconductor devices. Preferred embodiments include methods and associated systems for securing a block-molded array of semiconductor devices into a mounting ring with light-sensitive tape. Tape-deactivating is used to render exposed regions of the light-sensitive tape less tacky. The mounting ring containing the block-molded array is secured on a cutting table and the array is singulated into individual devices. Aspects of the invention also include the use of tape-deactivating light for making the light-sensitive tape less tacky to facilitate removal of the individual devices after singulation.
    Type: Application
    Filed: February 14, 2007
    Publication date: August 14, 2008
    Inventors: Mohamad Ashraf Bin Mohd Arshad, Yue Seng Fatt