Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through the base layer, a conduction part arranged on the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, an acoustic wave sensor mounted on the top surface of the base layer to face toward the sound hole, a processor chip mounted on the top surface of the base layer and electrically connected to the acoustic wave sensor and the conduction part, and one or multiple electronic components electrically bonded to the cover plate.

Abstract: A MEMS microphone package includes a substrate including a sound hole, a first conduction part and a second conduction part, a sidewall connected with one end thereof to the substrate and having a conducting line electrically connected to the second conduction part, a cover plate connected to an opposite end of the sidewall and defining a chamber therein and having a solder pad and a fifth contact in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted on the substrate inside the chamber and electrically connected to the first conduction part and the second conduction part, and a acoustic wave sensor mounted on the substrate inside the chamber to face toward the sound hole and electrically connected to the first conduction part using flip-chip technology.

Abstract: A microelectromechanical microphone package structure includes a substrate, sidewall, lid, sound wave transducer and processing module. The substrate has a plate, sound aperture penetrating the plate, and conduction portion disposed on the plate. The sidewall has one end disposed on the plate and has a conduction circuit electrically connected to the conduction portion. A chamber is defined between the lid, sidewall and plate. The lid has at least one solder pad and a third contact in electrical conduction with each other. The third contact is electrically connected to the conduction circuit. The sound wave transducer is disposed on the plate and in the chamber and aligned with the sound aperture. The processing module, which is disposed on the plate and in the chamber and electrically connected to the sound wave transducer and conduction portion, includes a processing chip and electronic component which are stacked and disposed on the plate.

Abstract: A MEMS microphone package includes a substrate including a base layer, a sound hole cut through opposing top and bottom surfaces of the base layer, a conduction part arranged on the base layer and a notch located on the top surface of the base layer, a sidewall connected with one end thereof to the top surface of the base layer and having a conducting line electrically connected to the conduction part, a cover plate connected to an opposite end of the sidewall and having a solder pad and a third contact disposed in conduction with the solder pad and electrically connected to the conducting line, a processor chip mounted in the notch and electrically connected to the conduction part, and an acoustic wave sensor mounted on the base layer to face toward the sound hole and electrically connected to the processor chip.

Abstract: Systems and methods for generating a three-dimensional gas map includes a remote vehicle including reflective material. A positioning stage including multidimensional movement to track the remote vehicle. A light head to reflect light off of the remote vehicle. A controller to analyze received light to determine gas content and generate a three-dimensional gas map.

Abstract: Systems and methods for generating a three-dimensional gas map includes a remote vehicle including reflective material. A positioning stage including multidimensional movement to track the remote vehicle. A light head to reflect light off of the remote vehicle. A controller to analyze received light to determine gas content and generate a three-dimensional gas map.

Abstract: Active components in an optical spectroscopy based sensor are moved to a remote site and the light is guided between the remote site and the sensing site through optical fibers.

Abstract: A spectroscopy system and method includes illuminating a target with a wideband light pulse that includes an entire testing wavelength spectrum. The light pulse is transformed with a dispersive medium to introduce a frequency-based time delay to the light pulse after the light pulse has interacted with a target. The dispersed light pulse is converted to a time-domain electrical signal with a photodiode. The time-domain electrical signal is converted into a spectral profile of the target.

Abstract: The invention uses a point-to-multi-point (P2MP) discovery process conducted in a passive optical network PON system to identify each sensor that returns a probe pulse identified with a respective sensor without adding any equipment at the remote sensors. The sensors provide with the returned signal information indicative of measured gas leakage in the air in the sensor.

Abstract: An optical phase scrambler is coupled to a laser source to randomly modulate the optical phase. Since the optical phase is continuously changing in a random fashion, at the output of an etalon interferometer formed in the optical path, the two or more components in the interference always have certain time delay between each other, resulting in a random phase different between each other. Therefore, after interference, the fringe amplitude varies randomly as well. Then at the receiver side, the fringe noise is greatly reduced after averaging over time.

Abstract: An analyzer operable with an optical network is responsive to a probe signal reflected by a sensor in the network to convey information about targeted matter in air in the sensor. Multiple sensors at different locations in the network can be associated with respective selective optical wavelength filtering thereby enabling the analyzer to associated respective ones of the sensors.

Abstract: Active components in an optical spectroscopy based sensor are moved to a remote site and the light is guided between the remote site and the sensing site through optical fibers.

Abstract: A long haul transmission system uses a digital signal processor DSP instead of an additional optical phase conjugate copier because the optical phase conjugate copier requires high quality optical carrier regeneration to recover the pump and optical PLL to maintain phase matching between signal and pump. Therefore, the use of DSP to process the signal and idler at receiver end greatly simplifies the system setup, increases the system stability and decreases the system cost.

Abstract: The present invention provides a panchromatic sharpening method of spectral image based on fusion of overall structural information and spatial detail information, comprising: performing brightness linear stretching on a panchromatic image, so as to set the variance of the panchromatic image to be equal to the variance of said spectral image; respectively interpolating N components of the spectral image so as to generate an interpolation image series having the same resolution as that of the panchromatic image; subtracting the interpolation image series from the panchromatic image after said linear stretching to obtain difference images; performing Gauss filtering on the difference images, thereby obtaining difference tendency images; and, respectively subtracting the difference tendency image series from the panchromatic image after said linear stretching, thus obtaining fused images.

Abstract: The present invention provides a panchromatic sharpening method of spectral image based on fusion of overall structural information and spatial detail information, comprising: performing brightness linear stretching on a panchromatic image, so as to set the variance of the panchromatic image to be equal to the variance of said spectral image; respectively interpolating N components of the spectral image so as to generate an interpolation image series having the same resolution as that of the panchromatic image; subtracting the interpolation image series from the panchromatic image after said linear stretching to obtain difference images; performing Gauss filtering on the difference images, thereby obtaining difference tendency images; and, respectively subtracting the difference tendency image series from the panchromatic image after said linear stretching, thus obtaining fused images.

Abstract: A long haul transmission system uses a digital signal processor DSP instead of an additional optical phase conjugate copier because the optical phase conjugate copier requires high quality optical carrier regeneration to recover the pump and optical PLL to maintain phase matching between signal and pump. Therefore, the use of DSP to process the signal and idler at receiver end greatly simplifies the system setup, increases the system stability and decreases the system cost.

Abstract: An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.

Abstract: An MEM microphone carrier module is composed of a substrate and a cover plate. The substrate includes a space layer, a bottom layer, a recession recessed from a top side of the space layer, and a groove formed in the recession. The bottom layer has a metallic plate defining a predetermined pattern and exposed outside a surface thereof. The bottom layer is a single-layer structure formed by the molding of the metallic plate and the insulating glue, such that the substrate is thinner to need lower production cost and take less assembly time than the prior art.

Abstract: A MEMS module package includes a carrier, a lid capped on the carrier, a spacer disposed between the carrier and the lid, and a chip mounted on the spacer and electrically connected with the carrier. The spacer has a channel in communication between a chamber and a receiving hole of the lid, and the chip is received in the chamber of the lid and corresponding to the channel of the spacer. Therefore, an external signal can be transmitted from the receiving hole of the lid into the chamber of the lid through the channel of the spacer so as be received by the chip.

Abstract: This invention relates generally to the field of nucleic acid analysis. In particular, the invention provides a method for typing a target gene, using, inter alia, a chip comprising a support suitable for use in nucleic acid hybridization having immobilized thereon an oligonucleotide probe complementary to said target nucleotide sequence and at least one of the following oligonucleotide control probes: a positive control probe, a negative control probe, a hybridization control probe and an immobilization control probe. Oligonucleotide probes or probes arrays for typing a HLA target gene are also provided.