Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

Abstract: A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area (110) for providing a chip (113) and a substrate pick-and-place area (120) for placing a substrate (123), the blue tape pick-and-place area (110) and the substrate pick-and-place area (120) being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (210), a chip alignment and fine-tuning area (220), and a chip batch-bonding area (230) in a direction running from the blue tape pick-and-place area (110) to the substrate pick-and-place area (120).

Abstract: A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

Abstract: A reaction force diversion mechanism, a motor device and a photolithography machine are disclosed. The photolithography machine includes an illumination unit, a mask stage, a projection objective, a main baseplate, a wafer stage and a main carrier frame. The illumination unit and the mask stage are disposed above the main baseplate, and the main carrier frame is arranged above a ground base. Both of the wafer stage and the main baseplate are supported on the main carrier frame, and vibration dampers are deployed between the main carrier frame and the ground base. Reaction force diversion mechanisms are disposed between the wafer stage and the ground base and between the mask stage and the ground base. The reaction force diversion mechanisms can divert reaction forces generated from movement of the two motion stages onto the ground base while blocking vibration propagating from the ground base toward the motion stages.

Abstract: A universal chip batch-bonding apparatus and method. The apparatus comprises a material pick-and-place area and a transfer work area. The material pick-and-place area comprises a blue tape pick-and-place area (110) for providing a chip (113) and a substrate pick-and-place area (120) for placing a substrate (123), the blue tape pick-and-place area (110) and the substrate pick-and-place area (120) being separately arranged at two ends of the transfer work area. The transfer work area sequentially comprises a chip pickup and separation area (210), a chip alignment and fine-tuning area (220), and a chip batch-bonding area (230) in a direction running from the blue tape pick-and-place area (110) to the substrate pick-and-place area (120).

Abstract: A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.

Abstract: A motion stage device, an exposure device and a lithography machine are disclosed. The motion stage device includes: Y-direction motors (203), a mover of each Y-direction motor (203) movable in a horizontal Y-direction; X-direction motors provided on X-direction guide rails (105), the X-direction guide rails (105) is in connection with the movers of the Y-direction motors (203) and movable in the horizontal Y-direction under actuation of the Y-direction motors (203), the X-direction motors having movers (107b) movable in a horizontal X-direction; an inner frame (102), supporting the X-direction guide rails (105); and a motion stage (108, 106), disposed on the movers (107b) of the X-direction motor. This motion stage device possesses improved modal and vibration characteristics because of a reduced load on the Y-direction motors (203).

Abstract: A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.

Abstract: A chip bonding device is disclosed, including a first motion stage (110), a second motion stage (200), a chip pickup element (160), a transfer carrier (170), a chip adjustment system (1000), a bonding stage (420) and a control system (500). A chip bonding method is also disclosed, in which a set of chips are temporarily retained on the transfer carrier (170) and their positions on the transfer carrier (170) are accurately adjusted by using the chip adjustment system (1000), followed by bonding the chips on the transfer carrier (170) simultaneously onto the substrate (430). With this batch bonding approach, flip-chips can be bonded with greatly enhanced efficiency. Moreover, picking up and bonding chips in batches can balance times for chip picking up, fine chip position tuning and chip bonding, thereby ensuring high bonding accuracy while increasing the throughput.

Abstract: A motion stage device, an exposure device and a lithography machine are disclosed. The motion stage device includes: Y-direction motors (203), a mover of each Y-direction motor (203) movable in a horizontal Y-direction; X-direction motors provided on X-direction guide rails (105), the X-direction guide rails (105) is in connection with the movers of the Y-direction motors (203) and movable in the horizontal Y-direction under actuation of the Y-direction motors (203), the X-direction motors having movers (107b) movable in a horizontal X-direction; an inner frame (102), supporting the X-direction guide rails (105); and a motion stage (108, 106), disposed on the movers (107b) of the X-direction motor. This motion stage device possesses improved modal and vibration characteristics because of a reduced load on the Y-direction motors (203).

Abstract: A reaction force diversion mechanism, a motor device and a photolithography machine are disclosed. The photolithography machine includes an illumination unit, a mask stage, a projection objective, a main baseplate, a wafer stage and a main carrier frame. The illumination unit and the mask stage are disposed above the main baseplate, and the main carrier frame is arranged above a ground base. Both of the wafer stage and the main baseplate are supported on the main carrier frame, and vibration dampers are deployed between the main carrier frame and the ground base. Reaction force diversion mechanisms are disposed between the wafer stage and the ground base and between the mask stage and the ground base. The reaction force diversion mechanisms can divert reaction forces generated from movement of the two motion stages onto the ground base while blocking vibration propagating from the ground base toward the motion stages.

Abstract: A wafer edge protection apparatus, including an electrical control module having a servomotor, a vertical motion mechanism and a protection mechanism. The protection mechanism includes: a shaft coupler, in fixed connection with a shaft of the servomotor and having a plurality of first connecting components; and a transmission sleeve, in fixed connection with the vertical motion mechanism and having a plurality of second connecting components in movable connection with the plurality of first connecting components.

Abstract: A fine-motion module for use in a wafer stage of a photolithography tool includes: a base (201); a fine-motion plate (210); a plurality of vertical motors (203), fixed between the base and the fine-motion plate; a plurality of gravity compensators (202), each having one end fixed on the base and the other end configured to support the fine-motion plate; a plurality of absolute-position sensors (205, 211), configured to measure an absolute position of the fine-motion plate and to adjust pressures in the gravity compensators based on the obtained absolute-position measurements such that the absolute position of the fine-motion plate is changed to a predetermined initial vertical position; and a plurality of relative-position sensors (204, 207), configured to measure a relative position of the fine-motion plate to the base and to control the fine-motion plate based on the obtained relative-position measurements, thereby moving the fine-motion plate to a relative zero position.

Abstract: A fine-motion module for use in a wafer stage of a photolithography tool includes: a base (201); a fine-motion plate (210); a plurality of vertical motors (203), fixed between the base and the fine-motion plate; a plurality of gravity compensators (202), each having one end fixed on the base and the other end configured to support the fine-motion plate; a plurality of absolute-position sensors (205, 211), configured to measure an absolute position of the fine-motion plate and to adjust pressures in the gravity compensators based on the obtained absolute-position measurements such that the absolute position of the fine-motion plate is changed to a predetermined initial vertical position; and a plurality of relative-position sensors (204, 207), configured to measure a relative position of the fine-motion plate to the base and to control the fine-motion plate based on the obtained relative-position measurements, thereby moving the fine-motion plate to a relative zero position.

Abstract: A wafer edge protection apparatus, including an electrical control module having a servomotor, a vertical motion mechanism and a protection mechanism. The protection mechanism includes: a shaft coupler, in fixed connection with a shaft of the servomotor and having a plurality of first connecting components; and a transmission sleeve, in fixed connection with the vertical motion mechanism and having a plurality of second connecting components in movable connection with the plurality of first connecting components.