Abstract: Example wireless charging methods and apparatus are described. In one example, a wireless charging module includes a control circuit, a charging coil, a tunable capacitor module, and a converter circuit. The converter circuit includes at least one of a rectifier circuit or an inverter circuit. The tunable capacitor module is connected in series between the charging coil and the converter circuit. The tunable capacitor module includes a plurality of capacitors and at least one controllable switch. The control circuit controls the at least one controllable switch to be turned on or off, to control an equivalent capacitance value of the tunable capacitor module. The equivalent capacitance value of the tunable capacitor module includes one of a first capacitance value or a second capacitance value.

Abstract: An electronic device, including a first circuit, a second circuit, a coil, and one or more resonant circuits. The first circuit may transmit a first signal through the coil, and the second circuit may transmit a second signal through the coil. Frequencies of the first signal and the second signal are different. The resonant circuit may be disposed between the first circuit and the coil to prevent the second signal from passing or disposed between the second circuit and the coil to prevent the first signal from passing, so as to prevent the first signal from interfering with the second circuit or prevent the second signal from interfering with the first circuit.

Abstract: A wireless charging module includes a charging coil and a magnetic alignment apparatus. The magnetic alignment apparatus includes a first permanent magnet and a second permanent magnet. The first permanent magnet and the second permanent magnet are disposed adjacently on one surface. The charging coil is disposed on an inner side or an outer side of the magnetic alignment apparatus. Magnetization manners for the first permanent magnet and the second permanent magnet are different. Magnetic field strength on an upper side and a lower side of the magnetic alignment apparatus is different.

Abstract: A transmit end for multi-device wireless charging includes N half-bridge inverter circuits, a multi-coil gating matrix, and a multi-coil module. Input terminals of the N half-bridge inverter circuits are connected to corresponding direct currents, and output terminals of the N half-bridge inverter circuits are connected to input terminals of the multi-coil gating matrix. The multi-coil gating matrix includes a plurality of switches configured to respectively connect the output terminals of the N half-bridge inverter circuits to corresponding transmit coils in the multi-coil module.

Abstract: The wireless charging circuit includes an oscillation circuit and a monitoring circuit that are sequentially connected. The oscillation circuit includes an excitation voltage source, a full-bridge circuit, and an LC series circuit that are connected in series. When damped oscillation occurs in the LC series circuit, the LC series circuit outputs a resonant voltage signal during damped oscillation to the monitoring circuit. The monitoring circuit includes a comparison module and a processing module. The comparison module is configured to receive the resonant voltage signal and convert the resonant voltage signal into a digital square wave signal. The processing module is configured to receive the digital square wave signal, obtain a quantity of peaks, a quantity of troughs, or a sum of the quantity of peaks and the quantity of troughs and that is in a resonant voltage attenuation waveform, determine a quality factor Q.

Abstract: A shielding film includes a first film layer. The first film layer includes a first conductive part and a first insulating part, and the first insulating part penetrates the first conductive part in a thickness direction of the first film layer. Under electromagnetic influence of a first electromagnetic field, a first eddy current is formed in the first film layer, and a loop of the first eddy current is located in the first conductive part, so that the first eddy current has relatively high current intensity. Under electromagnetic influence of a second electromagnetic field, a second eddy current is formed in the first film layer, and a loop of the second eddy current passes through the first insulating part, so that current intensity of the second eddy current can be reduced.

Abstract: A 5G-signal-based DOA fingerprint-based positioning method includes the following steps: dividing an initial area into a number of micro-cells, and estimating angle information of reference points in the divided micro-cells; storing the angle information of the reference point of each micro-cell and position information of the each micro-cell in a fingerprint database, and updating the angle information in the fingerprint database at regular intervals; wherein when there is a target in the initial area, estimating angle information of the target; matching the angle information of the target with the angle information in the fingerprint database to determine a micro-cell where the target is located to obtain position information of the target, so as to locate the target.

Abstract: A 5G-signal-based DOA fingerprint-based positioning method includes the following steps: dividing an initial area into a number of micro-cells, and estimating angle information of reference points in the divided micro-cells; storing the angle information of the reference point of each micro-cell and position information of the each micro-cell in a fingerprint database, and updating the angle information in the fingerprint database at regular intervals; wherein when there is a target in the initial area, estimating angle information of the target; matching the angle information of the target with the angle information in the fingerprint database to determine a micro-cell where the target is located to obtain position information of the target, so as to locate the target.

Abstract: The present disclosure provides a via structure and a multilayer circuit board including the via structure. The via structure is provided in three or more conductor layers in the same electrical network, the conductor layers overlapping with each other vertically and including at least one current input layer and at least one current output layer; wherein the via structure includes a plurality of rows of vias, each row of vias puncture through at least one current input layer and at least one current output layer, and a part of the rows of vias puncture through all of the conductor layers, and the other part of the rows of vias puncture through a part of the conductor layers. By using the via structure in the present disclosure, the vias are subject to even temperature and thus the lifetime of the circuit board is extended.

Abstract: The present disclosure provides a via structure and a multilayer circuit board including the via structure. The via structure is provided in three or more conductor layers in the same electrical network, the conductor layers overlapping with each other vertically and including at least one current input layer and at least one current output layer; wherein the via structure includes a plurality of rows of vias, each row of vias puncture through at least one current input layer and at least one current output layer, and a part of the rows of vias puncture through all of the conductor layers, and the other part of the rows of vias puncture through a part of the conductor layers. By using the via structure in the present disclosure, the vias are subject to even temperature and thus the lifetime of the circuit board is extended.