Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

Abstract: A structure for protecting an electronic component from coolant leaking from a liquid cooling system is disclosed. The liquid cooling system has a manifold collecting and supplying coolant to a cold plate via inlet and outlet tubes. The cold plate is mounted over a heat-generating component on a circuit board. The structure includes a drip tray having a top surface and a length approximately the distance between the manifold and the cold plate. The drip tray includes a trough for collection of leaking coolant. The tray is inserted between the circuit board and the inlet and outlet tubes.

Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.

Abstract: A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.

Abstract: A computing system including a water-resistant chassis, at least one electronic component with a heat sink, and a gap filler. The heat sink includes an arrangement of fins separated by inter-fin spaces. The gap filler is in contact with both the heat sink and the water-resistant chassis. The gap filler is positioned in the inter-fin spaces to provide a heat conduction path between the heat sink and the chassis.

Abstract: A heat transmissive chassis for a fan-less equipment component such as a 5G component is disclosed. The chassis includes a heat sink section having an interior surface and an exterior surface. The interior surface is configured for contact with a heat-generating electronic device. A lateral hollow compartment is located near the interior surface. A coolant is contained in the hollow compartment.

Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.

Abstract: A dust-proof telecommunication system is disclosed. The dust-proof telecommunication system includes a chassis, critical components located within the chassis, and a filter module located within the chassis near at least some of the critical components that need to be cooled. For example, the critical components include a central processing unit (CPU), a system on chip (SoC), a memory module, a PCIe card, and/or a chipset. The filter module has a filter cover that surrounds at least in part the critical components, a first air filter located at an inlet of an airflow, and a second air filter located at an outlet. The critical components located at a protective space within the chassis receive and are cooled by the airflow passing through the air filter.

Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.

Abstract: A heat sink comprises a first portion and a second portion. The first portion is configured to contact a heat-generating electronic component. The first portion is formed from a first group of materials and has a first plurality of fins. The second portion is coupled to the first portion. The second portion is formed from a second group of materials and has a second plurality of fins. The second group of materials is different than the first group of materials. The first group of materials can include extruded aluminum, stamped aluminum, or both. The second group of materials can include die-cast metal. The first plurality of fins can have a smaller fin pitch than the second plurality of fins. The heat sink can further comprise a third portion coupled to the first portion, such that the first portion is positioned between the second portion and the third portion.

Abstract: A computing system includes a cabinet, an inlet temperature sensor, a cooling device, an environmental sensor, and at least one processor. The cabinet houses at least one computing device. The inlet temperature sensor is configured to detect inlet temperature data for the at least one computing device. The inlet temperature data represents internal temperature within the cabinet. The cooling device is coupled to the cabinet for maintaining temperature within the cabinet. The environmental sensor is configured to detect environmental temperature data external to the cabinet. The environmental temperature data represents external temperature outside the cabinet. The at least one processor is configured to: (a) determine if one or more of the inlet temperature data and the environmental temperature data exceeds a temperature range; and (b) in response to the temperature range being exceeded, generate a first warning signal indicating a temperature problem.

Abstract: Cooling devices, such as fans, installed in a computing device can be automatically identified by reading an encoded signal from the cooling device's tachometer signal line. A cooling device can temporarily output an encoded signal in response to a trigger event, such as a power on event (e.g., powering-on of the cooling device). A controller, such as a baseboard management controller (BMC), can receive the encoded signal and decode the signal to determine identification information about the cooling device, such as vendor information and/or model information. The identification information about the cooling device can be stored, logged, output, and/or used to customize the operation of the cooling device.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

Abstract: A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

Abstract: A computing device comprises a heat sink including a base and a multi-dimensional thermal dissipation device disposed adjacent to the base. A thermally-conductive grease layer is disposed between and in direct contact with the multi-dimensional thermal dissipation device and the base. A gasket contains the thermally-conductive grease layer between the multi-dimensional thermal dissipation device and the base.

Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.

Abstract: An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.

Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.

Abstract: A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.