Patents by Inventor Yueh Cheng Hsueh

Yueh Cheng Hsueh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR DETECTING FAULT EVENTS
    Publication number: 20180107202
    Abstract: A detection method includes: aligning, by a processor, first data with second data according to steps, in which the first data and the second data are associated with equipment for fabricating semiconductor devices; determining, by the processor, a first virtual area according to the first data; determining, by the processor, a second virtual area according to the second data; and displaying, by a display, a result of comparing the first virtual area and the second virtual area, to distinguish whether a fault event exists during the process.
    Type: Application
    Filed: October 18, 2016
    Publication date: April 19, 2018
    Inventors: Yueh-Cheng HSUEH, Yu-Wei LIU, Liang-Lun LEE, Tzu-Chiang LIN, Chun-Yu CHEN, Chia-Hung LIU
  • Pressure control system of wafer polishing apparatus
    Patent number: 8192251
    Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.
    Type: Grant
    Filed: July 8, 2009
    Date of Patent: June 5, 2012
    Assignee: Inotera Memories, Inc.
    Inventors: Yueh Cheng Hsueh, Chin Wei Wu, Sheng-Feng Hung
  • Pressure control system of wafer polishing apparatus
    Publication number: 20100203807
    Abstract: A pressure control system of a wafer polishing apparatus includes a main input air pressure regulator, an air branch conduit, a plurality of first pipes, a plurality of auxiliary air pressure regulators, a plurality of second pipes, and a plurality of air pressure controlling devices. The air branch conduit is connected with the main input air pressure regulator. The first pipes are connected between the air branch conduit and the auxiliary air pressure regulators. The second pipes are connected between the auxiliary air pressure regulators and the air pressure controlling devices. Accordingly, the air pressure controlling devices can control the pressure outputted from a polishing head of the wafer polishing apparatus to a surface of a wafer.
    Type: Application
    Filed: July 8, 2009
    Publication date: August 12, 2010
    Inventors: Yueh Cheng Hsueh, Chin Wei Wu, Sheng-Feng Hung