Abstract: A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I) wherein n is 8 to 232, wherein R1 is independently C1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II) wherein x?2, y?2, and x/y is between 0.1 and 3, and R2, R3 and R4 are independently C1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III) and 90 to 250 parts by mole of a curing agent represented by Formula (IV) wherein m is 7 to 230, wherein R5 is independently C1-3 alkyl group.

Abstract: A curable composition and an electronic device employing the same are provided. The curable composition includes 100 parts by mole of a first siloxane compound represented by Formula (I) wherein n is 8 to 232, wherein R1 is independently C1-3 alkyl group; 1 to 15 parts by mole of a second siloxane compound represented by Formula (II) wherein x?2, y?2, and x/y is between 0.1 and 3, and R2, R3 and R4 are independently C1-3 alkyl group; 1 to 15 parts by mole of a third siloxane compound represented by Formula (III) and 90 to 250 parts by mole of a curing agent represented by Formula (IV) wherein m is 7 to 230, wherein R5 is independently C1-3 alkyl group.

Abstract: The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a first material layer overlying the carrier with a first area, a second material layer overlying the first material layer and the carrier with a second area, and a flexible substrate overlying the second material layer, the first material layer and the carrier with a third area, wherein the second area is larger than or equal to the first area, the third area is larger than the second area, and the flexible substrate has a greater adhesion force than that of the first material layer to the carrier. The invention also provides a method for fabricating the substrate structure.

Abstract: An organic light-emitting device is provided. The organic light-emitting device includes a substrate having a first surface and a second surface opposite to the first surface; an organic light-emitting element disposed on the first surface; and a low refractive index layer disposed on the second surface, wherein the low refractive index layer includes a mixture including polyvinylidene fluoride and inorganic nano-platelet, a hyperbranched polysiloxane, or a combination thereof.

Abstract: The present disclosure provides a substrate structure for an electronic element, which includes a supporting carrier; a release layer having a first microstructure on a surface thereof, and the release layer having first adhesion to the supporting carrier; and a flexible substrate for disposing the supporting carrier and the release layer thereon, wherein the flexible substrate has second adhesion to the release layer, the first adhesion is greater than the second adhesion, and the surface of the flexible substrate in contact with the surface of the release layer has a second microstructure opposing to the first microstructure. The present disclosure further provides a method for fabricating the substrate structure.

Abstract: An optical device structure with a light outcoupling layer is provided. The optical device structure includes a substrate having a first surface and a second surface, and a layer of polyimide (PI) or its copolymer formed on the first surface of the substrate, wherein the layer of polyimide or its copolymer is prepared from at least one aromatic diamine and at least one cycloaliphatic dianhydride, and an optical component formed on the layer of polyimide or its copolymer.

Abstract: Disclosed is an organic light emitting diode (OLED), including a flexible substrate having a surface with a bulge and groove structure. The OLED also includes a first electrode on the flexible substrate, an organic light emitting layer on the first electrode, and a second electrode on the organic light emitting layer. The flexible substrate includes polyimide.

Abstract: An optical device structure with a light outcoupling layer is provided. The optical device structure includes a substrate having a first surface and a second surface, and a layer of polyimide (PI) or its copolymer formed on the first surface of the substrate, wherein the layer of polyimide or its copolymer is prepared from at least one aromatic diamine and at least one cycloaliphatic dianhydride, and an optical component formed on the layer of polyimide or its copolymer.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention also provides a method for fabricating the substrate structure.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a flexible substrate opposed to the carrier, a release layer formed on a surface of the flexible substrate opposed to the carrier, and an adhesive layer formed between the carrier, the release layer and the flexible substrate, wherein the area of the adhesive layer is larger than that of the release layer, and the adhesive layer has a greater adhesion force than that of the release layer to the flexible substrate. The invention also provides a method for fabricating the substrate structure.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a first material layer overlying the carrier with a first area, a second material layer overlying the first material layer and the carrier with a second area, and a flexible substrate overlying the second material layer, the first material layer and the carrier with a third area, wherein the second area is larger than or equal to the first area, the third area is larger than the second area, and the flexible substrate has a greater adhesion force than that of the first material layer to the carrier. The invention also provides a method for fabricating the substrate structure.

Abstract: A substrate structure applied in flexible electrical devices is provided. The substrate structure includes a carrier, a release layer overlying the carrier with a first area and a flexible substrate overlying the release layer and the carrier with a second area, wherein the second area is larger than the first area and the flexible substrate has a greater adhesion force than that of the release layer to the carrier. The invention also provides a method for fabricating the substrate structure.