Abstract: A touch-sensing device includes a substrate, a touch-sensing structure, a signal transmitting layer, a first connecting pin assembly and a second connecting pin assembly. The touch-sensing structure is disposed on the substrate. The signal transmitting layer is disposed on the substrate and electrically connected to the touch-sensing structure. The first connecting pin assembly is disposed on the substrate in a position different from the touch-sensing structure. The first connecting pin assembly has a plurality first connecting pins electrically connected to the signal transmitting layer. The second connecting pin assembly is disposed on the substrate in a position different from the touch-sensing structure. The second connecting pin assembly has a plurality second connecting pins electrically connected to the signal transmitting layer. The first axis of the second connecting pin assembly and the second axis of the first connecting pin assembly are not arranged in the same axis.

Abstract: A touch-sensing device includes a substrate, a touch-sensing structure, a signal transmitting layer, a first connecting pin assembly and a second connecting pin assembly. The touch-sensing structure is disposed on the substrate. The signal transmitting layer is disposed on the substrate and electrically connected to the touch-sensing structure. The first connecting pin assembly is disposed on the substrate in a position different from the touch-sensing structure. The first connecting pin assembly has a plurality first connecting pins electrically connected to the signal transmitting layer. The second connecting pin assembly is disposed on the substrate in a position different from the touch-sensing structure. The second connecting pin assembly has a plurality second connecting pins electrically connected to the signal transmitting layer. The first axis of the second connecting pin assembly and the second axis of the first connecting pin assembly are not arranged in the same axis.

Abstract: A soldering pad layout for flexible printed circuit board (PCB) is disclosed, which comprises: a top substrate; a middle substrate; and a bottom substrate, being arranged by stacking one over the other successively in parallel. In an exemplary embodiment, there are at least a top routing layer, being sandwiched between the top substrate and the middle substrate, and at least a bottom routing layer, being sandwiched between the middle substrate and the bottom substrate. With the aforesaid soldering pad layout, not only circuit breakage caused by stress concentration on a bended flexible printed circuit board can be prevented, but also the routing path required on the PCB can be shortened and the amount of space for laying out parts on the PCB can be reduced.

Abstract: A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective.

Abstract: A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective.

Abstract: An anti-dust apparatus for a liquid crystal display (LCD) panel, comprising: a protective film comprising a main portion, a foldable portion extending from the main portion, and a fold line between the main portion and the foldable portion, wherein the main portion has a first attachment surface and an exposed surface on both sides, the foldable portion has a second attachment surface adjacent to the first attachment surface, and the foldable portion is folded along the fold line to be parallel with the LCD panel; an adhesive layer disposed on the first attachment surface and the second attachment surface of the protective film, wherein the adhesive layer on the first attachment surface is attached onto the LCD panel; a twin adhesive layer disposed on the other surface different from the second attachment surface of the foldable portion, wherein the twin adhesive layer is attached onto the exposed surface of the protective film; and an anti-dust portion disposed on the adhesive layer on the second attachment