Patents by Inventor Yueh-Hisin Chang

Yueh-Hisin Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode package with positioning groove
    Publication number: 20080029775
    Abstract: A light emitting diode package structure includes a light emitting diode, a substrate structure and at least one gel. A surface of the substrate structure has a concave and at least one groove. The concave is used for containing the light emitting diode. A predetermined distance (D) is between the groove and the light emitting diode. The groove is formed around the light emitting diode. The gel covers the light emitting diode and a portion of the surface of the substrate structure. The gel is limited to surface tension in the groove and is positioned in a predetermined region surrounded by the groove.
    Type: Application
    Filed: August 2, 2006
    Publication date: February 7, 2008
    Inventors: Chia-Chi Liu, Pao-Chi Chi, Yueh-Hisin Chang