Patents by Inventor Yueh-Hsiang YU

Yueh-Hsiang YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite polypeptide having a metal binding motif and molecular construct comprising the same
    Patent number: 11926678
    Abstract: Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.
    Type: Grant
    Filed: October 8, 2021
    Date of Patent: March 12, 2024
    Assignee: Immunwork Inc.
    Inventors: Tse-Wen Chang, Hsing-Mao Chu, Wei-Ting Tian, Yueh-Hsiang Yu
  • COMPOSITE POLYPEPTIDE HAVING A METAL BINDING MOTIF AND MOLECULAR CONSTRUCT COMPRISING THE SAME
    Publication number: 20220064215
    Abstract: Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.
    Type: Application
    Filed: October 8, 2021
    Publication date: March 3, 2022
    Applicant: Immunwork Inc.
    Inventors: Tse-Wen CHANG, Hsing-Mao CHU, Wei-Ting TIAN, Yueh-Hsiang YU
  • Composite polypeptide having a metal binding motif and molecular construct comprising the same
    Patent number: 11203614
    Abstract: Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: December 21, 2021
    Assignee: IMMUNWORK INC.
    Inventors: Tse-Wen Chang, Hsing-Mao Chu, Wei-Ting Tian, Yueh-Hsiang Yu
  • COMPOSITE POLYPEPTIDE HAVING A METAL BINDING MOTIF AND MOLECULAR CONSTRUCT COMPRISING THE SAME
    Publication number: 20200308223
    Abstract: Disclosed herein are composite polypeptide. According to various embodiments, the composite polypeptide includes a parent polypeptide and a metal binding motif capable of forming a complex with a metal cation. The composite polypeptide may be conjugated with a linker unit having a plurality of functional elements to form a multi-functional molecular construct. Alternatively, multiple composite polypeptides may be conjugated to a linker unit to form a molecular construct, or a polypeptide bundle. Linker units suitable for conjugating with the composite polypeptide having the metal binding motif are also disclosed.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 1, 2020
    Applicant: Immunwork Inc.
    Inventors: Tse-Wen CHANG, Hsing-Mao CHU, Wei-Ting TIAN, Yueh-Hsiang YU