Abstract: The present invention relates to an apparatus combining bypass diode and wire. According to the present invention, the bypass diode can connect with the wire directly. It is not necessary to reserve an extra region on the substrate of the solar cell as the wire soldering area. Thereby, the required area of the ceramic substrate is reduced, and hence lowering the manufacturing cost of the solar cell substantially.

Abstract: The present invention discloses a solar cell device and a packaging method thereof. The solar cell device applies to a concentrator photovoltaic cell, and comprises a circuit substrate, a solar cell chip, and an electrode plate. The two sides of the lower surface of the electrode plate respectively have an electronic conducting element. A positive electrode plate disposed on the circuit substrate is electrically connected with a back electrode disposed on the lower surface of the solar cell chip. Through each conducting element of the electrode plate, front electrodes disposed respectively on the two sides of the upper surface of the solar cell chip are connected with a negative electrode plate disposed on the circuit substrate.

Abstract: A thermoelectric generating module includes at least one thermoelectric unit and at least one light-concentrating unit. The thermoelectric unit has a first surface and a second surface disposed oppositely. The light-concentrating unit is disposed adjacent to the thermoelectric unit and concentrates light on the first surface of the thermoelectric unit.

Abstract: A solar cell device structure, that is applicable in a concentrator solar cell device structure, comprising a silicon substrate, an insulation layer, and a solar chip. Wherein, the insulation layer is provided on the silicon substrate, a pattern region is provided on the insulation layer, and the solar chip is disposed in the pattern region. Due to the various advantages of superior heat conduction, low cost, and maturity of silicon semiconductor manufacturing technology of a silicon substrate, it is utilized to replace the ceramic substrate of the prior art, hereby raising the heat dissipation efficiency and reducing the production cost.